Patents by Inventor Kenji Otsuka

Kenji Otsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170113462
    Abstract: A method for manufacturing a MEMS device in which a plurality of substrates are joined in a stacked state and one face of faces defining a space formed in one substrate of the plurality of substrates is a movable region is disclosed.
    Type: Application
    Filed: October 21, 2016
    Publication date: April 27, 2017
    Inventors: Wataru TAKAHASHI, Yasuhide MATSUO, Kenji OTSUKA
  • Publication number: 20150356715
    Abstract: There is provided an image processing device including a first housing, a second housing, a first display device, a second display device, a video input terminal, a video output terminal, a storage unit, a video combining unit, a configuration control unit, a first GUI control unit, a second GUI control unit.
    Type: Application
    Filed: March 12, 2014
    Publication date: December 10, 2015
    Inventors: Tetsuro NAKATA, Mitsuo OKUMURA, Jo WADA, Tetsuro MIYAZAKI, Kenji OTSUKA, Naomi EGASHIRA
  • Publication number: 20150291773
    Abstract: A thermally expandable resin composition containing an epoxy resin, a thermally expandable graphite, and an inorganic filler excluding graphite. The epoxy resin contains a bisphenol-type epoxy compound and an aliphatic epoxy compound, wherein the weight ratio of the bisphenol-type epoxy compound to the aliphatic epoxy compound is in the range 95:5-60:40.
    Type: Application
    Filed: October 10, 2013
    Publication date: October 15, 2015
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Toshitaka Yoshitake, Masaki Tono, Kenji Otsuka, Hideaki Yano
  • Publication number: 20150284525
    Abstract: A thermally expandable resin composition containing an epoxy resin, a thermally expandable graphite, and an inorganic filler excluding graphite. The epoxy compound contained in said epoxy resin contains a brominated epoxy compound, and contains, in addition to the brominated epoxy compound, a bisphenol-type epoxy compound and/or an aliphatic epoxy compound, wherein the weight ratio of the brominated epoxy compound to the bisphenol-type epoxy compound and/or aliphatic epoxy compound is in the range 99:1-1:99.
    Type: Application
    Filed: October 10, 2013
    Publication date: October 8, 2015
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Toshitaka Yoshitake, Masaki Tono, Kenji Otsuka, Hideaki Yano
  • Publication number: 20150239223
    Abstract: A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.
    Type: Application
    Filed: February 26, 2015
    Publication date: August 27, 2015
    Inventors: Hiroyuki TSUCHIYA, Yasuhide MATSUO, Kenji OTSUKA, Minehiro IMAMURA, Tomohiro HAYASHI, Kei TADACHI
  • Publication number: 20140345886
    Abstract: A thermally expandable multilayer packing for building material, having protruding parts and a body portion in the cross-sectional shape based a plane perpendicular to the longitudinal direction. The thermally expandable multilayer packing includes both a thermally expandable resin composition layer and a thermoplastic resin composition layer, wherein the thermally expandable resin composition forming the thermally expandable resin composition layer contains 100 parts by weight of a resin component containing a chlorinated polyvinyl chloride resin and/or an EPDM, 3 to 300 parts by weight of a thermally expandable graphite, 3 to 200 parts by weight of an inorganic filler and 20 to 200 parts by weight of a plasticizer. The thermally expandable resin composition layer and the thermoplastic resin composition layer are formed by simultaneous co-extrusion using the thermally expandable resin composition and the thermoplastic resin composition.
    Type: Application
    Filed: November 29, 2012
    Publication date: November 27, 2014
    Applicants: SEKISUI CHEMICAL CO., LTD., SEKISUI CHEMICAL HOKKAIDO CO., LTD., TOKUYAMA SEKISUI CO., LTD.
    Inventors: Hideaki Yano, Kenji Otsuka, Masaki Tono, Katsuhiro Nakazato, Ryota Yamasugi, Kenichi Matsumura
  • Publication number: 20140336321
    Abstract: A chlorinated vinyl chloride resin composition for extrusion molding, characterized by: containing 100 parts by weight of a chlorinated vinyl chloride resin, 3 to 300 parts by weight of a thermally expandable graphite, 3 to 200 parts by weight of an inorganic filler and 20 to 200 parts by weight of a plasticizer; and containing no phosphorus compound (excluding phosphate plasticizer). A chlorinated vinyl chloride resin having a chlorine content of 60 to 72% by weight can be used as the resin component for extrusion molding.
    Type: Application
    Filed: November 29, 2012
    Publication date: November 13, 2014
    Applicants: SEKISUI CHEMICAL CO., LTD., TOKUYAMA SEKISUI CO., LTD.
    Inventors: Ryota Yamasugi, Katsuhiro Nakazato, Hideaki Yano, Kenji Otsuka, Masaki Tono
  • Publication number: 20140180623
    Abstract: A safety instrument system includes a plurality of positioners that controls degrees of opening of a plurality of emergency cutoff valves that are provided in pipes in a plant, and a higher-level system that controls PSTs of the emergency cutoff valves. Each positioner comprises a PST executing unit that executes a PST in the emergency cutoff valve in response to an initiating instruction from the higher-level system or an initiating instruction from an inputting device in a workplace wherein the positioner is provided, a PST execution status acquiring unit that acquires PST execution status information for another positioner, and a PST initiation prohibition evaluating unit that evaluates whether or not a PST initiation is permitted, based on a PST execution status of another positioner, when a PST initiating instruction has been received from the higher-level system or from the inputting device.
    Type: Application
    Filed: December 26, 2013
    Publication date: June 26, 2014
    Applicant: AZBIL CORPORATION
    Inventor: Kenji OTSUKA
  • Publication number: 20140180622
    Abstract: A safety instrument system includes a positioner that controls a degree of opening of an emergency cutoff valve that is provided in a pipe in a plant, and a higher-level system that controls a PST of the emergency cutoff valve. The positioner includes a PST executing unit that executes a PST in the emergency cutoff valve in response to an initiating instruction from the higher-level system or from an inputting device in a workplace. The positioner is provided with a timing unit that measures elapsed time from the completion of a PST on the emergency cutoff valve, and a PST initiation prohibition evaluating unit that evaluates whether a PST initiation is permitted, by comparing elapsed time from the previous PST, to a PST minimum interval that is set in advance, when a PST initiating instruction has been received from the higher-level system or from the inputting device.
    Type: Application
    Filed: December 26, 2013
    Publication date: June 26, 2014
    Applicant: AZBIL CORPORATION
    Inventor: Kenji OTSUKA
  • Patent number: 8188842
    Abstract: The rotation operation plane of the ring-shaped operation members that operate the rotation is inclined with respect to the horizontal plane so that the rotation operation of the ring-shaped operation member can be performed without holding a finger in the vertical direction. Furthermore, since the rotation operation plane is inclined with respect to the placement plane of the case, static friction on the placement plane is generated by a force component of the operation force acting on the rotation operation plane and is perpendicular to the placement plane, thus the case does not move toward the rotation operation direction during the rotation operation.
    Type: Grant
    Filed: March 17, 2009
    Date of Patent: May 29, 2012
    Assignee: SMK Corporation
    Inventors: Kenji Otsuka, Ryuhei Noguchi, Noriaki Miyata
  • Patent number: 8138942
    Abstract: An annular operation unit is formed as an outer shape to cover entire outline of a surface of a case, and inputting switches and displaying unit are attached inside of an opening at the center side of the annular operation unit, allowing the annular operation unit to have a size to perform fine rotational operations in case the entire size of the remote control transmitting device is miniaturized.
    Type: Grant
    Filed: March 17, 2009
    Date of Patent: March 20, 2012
    Assignee: SMK Corporation
    Inventors: Kenji Otsuka, Ryuhei Noguchi, Noriaki Miyata
  • Patent number: 8128202
    Abstract: A nozzle plate includes: a nozzle for discharging a liquid as droplets; a liquid-repellent film suppressing attachment of the droplets on one surface of the nozzle plate; and a first bonding film formed on the other surface of the nozzle plate and bonded with a substrate. In the nozzle plate, the liquid-repellent film includes a first plasma polymerized film having a Si skeleton, which includes a siloxane (Si—O) bond and has a random atomic structure, and an elimination group bonded with the Si skeleton.
    Type: Grant
    Filed: July 23, 2009
    Date of Patent: March 6, 2012
    Assignee: Seiko Epson Corporation
    Inventors: Yasuhide Matsuo, Kenji Otsuka, Kazuo Higuchi, Kosuke Wakamatsu
  • Patent number: 8068013
    Abstract: A RF communication system includes a RF communication module capable of controlling either an IR communication system-controlled device or a controlled device not equipped with a reception circuit for receiving IR signals remotely with RF signals. The RF communication module is equipped with an antenna for receiving RF signals, a RF communication circuit for demodulating the remote control data from the RF signal received by the antenna, a UART interface for outputting bit stream remote data to a device-side microcomputer of the controlled device, and a communication control unit having two types of communication interfaces in a pulse signal interface that outputs a pulse modulated signal, having been pulse modulated with remote control data, to a pulse modulated signal input port of the device-side microcomputer, so that remote control data transmitted by RF signals is output freely, as either bit stream or pulse modulated signals, to a device-side microcomputer of the controlled device.
    Type: Grant
    Filed: December 14, 2007
    Date of Patent: November 29, 2011
    Assignee: SMK Corporation
    Inventors: Kenji Otsuka, Nobuhide Ninomiya
  • Patent number: 8029110
    Abstract: A droplet ejection head comprises: a substrate having first through-holes forming reservoir chambers, a second through-hole forming a supply chamber, and a bonding film on one surface; a nozzle plate having nozzles for ejecting ejection liquid and a second bonding film on one surface, the first and second films being bonded together to cover the first through-holes and the second through-hole; a sealing plate on another surface of the substrate covering the first through-holes, one surface of the sealing plate contacting the substrate's another surface; and piezoelectric means on another surface of the sealing plate for driving the droplet ejection head. The bonding films contain an Si-skeleton of constituent atoms containing silicon atoms, with siloxane (Si—O) bonds and elimination groups bonded to the silicon atoms, the constituent atoms being randomly bonded together, and the elimination groups existing near a surface of the bonding films.
    Type: Grant
    Filed: November 4, 2008
    Date of Patent: October 4, 2011
    Assignee: Seiko Epson Corporation
    Inventors: Yasuhide Matsuo, Kenji Otsuka, Kazuo Higuchi, Kosuke Wakamatsu
  • Patent number: 8029111
    Abstract: A droplet ejection head comprises: a substrate having first through-holes forming reservoir chambers, a second through-hole forming a supply chamber, and a bonding film on one surface; a nozzle plate having nozzles for ejecting ejection liquid and one surface contacting the bonding film, the nozzle plate is bonded to the substrate through the bonding film to cover the first through-holes and the second through-hole; a sealing plate on another surface of the substrate covering the first through-holes, one surface of the sealing plate contacting the substrate's another surface; and piezoelectric means on another surface of the sealing plate for driving the droplet ejection head. The bonding film containing an Si-skeleton constituted of constituent atoms containing silicon atoms, with siloxane (Si—O) bonds and elimination groups bonded to the silicon atoms, the constituent atoms being randomly bonded together, and the elimination groups existing near a surface of the bonding film.
    Type: Grant
    Filed: November 4, 2008
    Date of Patent: October 4, 2011
    Assignee: Seiko Epson Corporation
    Inventors: Yasuhide Matsuo, Kenji Otsuka, Kazuo Higuchi, Kosuke Wakamatsu
  • Publication number: 20110100688
    Abstract: In a liquid crystal display device, gate lines and common lines are first concurrently formed, and after an interlayer film is formed, a pixel electrode, common electrodes, and source lines are formed at the same time. By this, a electrode pattern can be made simple and manufacturing steps are simplified. Further, wiring lines and electrode disposed in the layer closest to a liquid crystal layer are made the pixel electrode, common electrodes and source lines, and the shapes thereof are made simple.
    Type: Application
    Filed: January 7, 2011
    Publication date: May 5, 2011
    Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
    Inventors: Hongyong Zhang, Yoshiharu Hirakata, Kenji Otsuka, Shunpei Yamazaki, Hideaki Kuwabara
  • Patent number: 7936142
    Abstract: A drilling device prevents recurrence of an overload condition after occurrence of the overload condition, thereby improving operability and safety in the drilling device. A motor for rotating a drill is connected to an AC power source through a motor control unit, a current detector, and a power switch. A magnet is also connected to the AC power source through the power switch and a full-wave rectifier. The motor control unit rotationally drives the motor on the basis of a signal sent from a main control unit according to a state in which a motor start switch is on. The main control unit controls the motor control unit to gradually reduce a supply voltage to the motor when the motor becomes overloaded, to gradually increase the voltage to the normal power supply condition when the overload condition is vanished, and to stop power supply to the motor if the overload condition continues for a predetermined period.
    Type: Grant
    Filed: December 13, 2006
    Date of Patent: May 3, 2011
    Assignee: Nitto Kohki Co., Ltd.
    Inventors: Kenji Otsuka, Osamu Asano
  • Patent number: 7868984
    Abstract: In a liquid crystal display device, gate lines and common lines are first concurrently formed, and after an interlayer film is formed, a pixel electrode, common electrodes, and source lines are formed at the same time. By this, a electrode pattern can be made simple and manufacturing steps are simplified. Further, wiring lines and electrode disposed in the layer closest to a liquid crystal layer are made the pixel electrode, common electrodes and source lines, and the shapes thereof are made simple.
    Type: Grant
    Filed: December 18, 2007
    Date of Patent: January 11, 2011
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Hongyong Zhang, Yoshiharu Hirakata, Kenji Otsuka, Shunpei Yamazaki, Hideaki Kuwabara
  • Publication number: 20100323192
    Abstract: A base member including a bonding film comprises a substrate; and the bonding film provided on the substrate. The base member is capable of bonding to an opposite substrate (object) through the bonding film. Such a bonding film contains a Si-skeleton constituted of constituent atoms containing silicon atoms and elimination groups bonded to the silicon atoms of the Si-skeleton. The Si-skeleton includes siloxane (Si—O) bonds. The constituent atoms are bonded to each other. Further, the bonding film is formed by a plasma polymerization. Furthermore, in a case where energy is applied to at least a part region of the surface of the bonding film, the elimination groups existing on the surface and in the vicinity of the surface within the region are removed from the silicon atoms of the Si-skeleton so that the region develops a bonding property with respect to the opposite substrate.
    Type: Application
    Filed: July 2, 2008
    Publication date: December 23, 2010
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Yasuhide Matsuo, Kenji Otsuka, Kazuo Higuchi, Kosuke Wakamatsu
  • Publication number: 20100323193
    Abstract: A base member including a bonding film comprises a substrate; and the bonding film provided on the substrate. The base member is capable of bonding to an opposite substrate (object) through the bonding film. Such a bonding film contains a Si-skeleton constituted of constituent atoms containing silicon atoms and elimination groups bonded to the silicon atoms of the Si-skeleton. The Si-skeleton includes siloxane (Si—O) bonds. The constituent atoms are bonded to each other. Further, a crystallinity degree of the Si-skeleton is equal to or lower than 45%. Furthermore, in a case where energy is applied to at least a part region of the surface of the bonding film, the elimination groups existing on the surface and in the vicinity of the surface within the region are removed from the silicon atoms of the Si-skeleton so that the region develops a bonding property with respect to the opposite substrate.
    Type: Application
    Filed: July 2, 2008
    Publication date: December 23, 2010
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Yasuhide Matsuo, Kenji Otsuka, Kazuo Higuchi, Kosuke Wakamatsu