Patents by Inventor Kenji Otsuka

Kenji Otsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100313754
    Abstract: Provided are a method of efficient separation/purification of hydrogen from a hydrogen-containing gas that contains, in addition to hydrogen, at least one component of water, carbon monoxide, carbon dioxide, methane and nitrogen in an amount of at least 1% where the hydrogen permeability is kept high; a hydrogen separation membrane for use in the method; and a hydrogen purification apparatus. The hydrogen purification method for separation/purification of hydrogen from a hydrogen-containing gas that contains at least one component of water, carbon monoxide, carbon dioxide, methane and nitrogen in an amount of at least 1% is characterized by using a hydrogen separation membrane produced by adhering fine particles of palladium to the surface of a palladium alloy membrane; the hydrogen separation membrane is for use for the method; and the hydrogen purification apparatus comprises the membrane.
    Type: Application
    Filed: December 18, 2007
    Publication date: December 16, 2010
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Eiji Okada, Jun Yoshihara, Futoshi Ikoma, Noboru Takemasa, Tatsunori Tayama, Kenji Otsuka
  • Publication number: 20100187680
    Abstract: A radiator includes: an insulating substrate, a heating element or a semiconductor chip is mounted; and a heat sink that is provided the insulating substrate through a stress relaxation member that has a stress absorbing space, in which the heat sink dissipates heat from the semiconductor chip. The insulating substrate, the stress relaxation member, and the heat sink are braze-bonded to each other. The heat sink has: a top plate that is bonded to the stress relaxation member; and a bottom plate that is bonded to the top plate, and the top plate and the bottom plate forms a passage of coolant therebetween. A thickness proportion between the top plate and the bottom plate falls within a range of 1:3 to 1:5.
    Type: Application
    Filed: December 18, 2009
    Publication date: July 29, 2010
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Kenji Otsuka, Masaru Nakashima
  • Publication number: 20100180441
    Abstract: A method of brazing a heat sink includes: fitting at least a part of a bottom plate between protruding opposite ends of a top plate; fixing a jig to an outer periphery of the top plate in order to prevent the top plate that thermally expands from extending outward in a width direction of the top plate; and braze-bonding an inner side surface of the top plate to a side surface of the bottom plate, which faces the inner side surface of the top plate.
    Type: Application
    Filed: December 4, 2009
    Publication date: July 22, 2010
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Kenji Otsuka, Masaru Nakashima, Yoshiki Tomita
  • Publication number: 20100151231
    Abstract: A bonded body according to the present invention comprises a first object comprised of a first substrate and a first bonding film formed on the first substrate and a second object comprised of a second substrate and a second bonding film formed on the second substrate. The first and second bonding films contain a Si-skeleton constituted of constituent atoms containing silicon atoms and elimination groups bonded to the silicon atoms of the Si-skeleton. The Si-skeleton includes siloxane (Si—O) bonds. The constituent atoms are bonded to each other. When an energy is applied to at least a part region of the surface of each of the first and second bonding films, the elimination groups existing in the vicinity of the surface within the region are removed from the silicon atoms of the Si-skeleton so that each region develops a bonding property with respect to the other film to thereby bond the first and second objects together through the first and second bonding films.
    Type: Application
    Filed: July 2, 2008
    Publication date: June 17, 2010
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Yasuhide Matsuo, Kenji Otsuka, Kazuo Higuchi, Kosuke Wakamatsu
  • Publication number: 20100101719
    Abstract: An optical element includes a first optical component and a second optical component each having light transmission properties; and a bonding film bonding together the first and the second optical components. The bonding film is formed by plasma polymerization and includes an Si skeleton having a random atomic structure including a siloxane (Si—O) bond and leaving groups binding to the Si skeleton. The first and the second optical components are bonded together by the bonding film having adhesive properties provided by applying energy to at least a part of the bonding film to eliminate the leaving groups from the Si skeleton at a surface of the bonding film. Additionally, the bonding film is formed so as to have approximately the same refractive index as that of at least one of the first and the second optical components by adjusting a film forming condition of the plasma polymerization.
    Type: Application
    Filed: October 13, 2009
    Publication date: April 29, 2010
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Kenji OTSUKA, Yasuhide MATSUO, Takenori SAWAI
  • Publication number: 20100104878
    Abstract: A bonding method includes forming a bonding film on a surface of a base member by plasma polymerization, the bonding film including an Si skeleton of a random atomic structure including a siloxane (Si—O) bond and leaving groups binding to the Si skeleton; applying UV light to the bonding film to eliminate the leaving groups at the surface of the bonding film from the Si skeleton so as to provide adhesion properties to the bonding film, an accumulated amount of the UV light being adjusted to control a refractive index of the bonding film; and bonding the base member and an object together via the bonding film to obtain a bonded structure.
    Type: Application
    Filed: October 26, 2009
    Publication date: April 29, 2010
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Yasuhide MATSUO, Kenji OTSUKA, Takenori SAWAI
  • Publication number: 20100098954
    Abstract: An optical element includes: first and second optical components, at least one of the first and second optical components having a light transmission characteristic; and a bonding film bonding the first and the second optical components together, the bonding film being formed by plasma polymerization and including an Si skeleton having a random atomic structure including a siloxane (Si—O) bond and a leaving group binding to the Si skeleton. The first and second optical components are bonded together by the adhesive properties of the bonding film which are provided by applying energy to at least a part of the bonding film to eliminate the leaving group from the Si skeleton at a surface of the bonding film. Preferably, an average thickness of the bonding film is equal to or less than a wavelength of light passing through the optical component having the light transmission characteristic.
    Type: Application
    Filed: October 13, 2009
    Publication date: April 22, 2010
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Takenori SAWAI, Kenji OTSUKA, Yasuhide MATSUO
  • Publication number: 20100052937
    Abstract: An annular operation unit is formed as an outer shape to cover entire outline of a surface of a case, and inputting switches and displaying unit are attached inside of an opening at the center side of the annular operation unit, allowing the annular operation unit to have a size to perform fine rotational operations in case the entire size of the remote control transmitting device is miniaturized.
    Type: Application
    Filed: March 17, 2009
    Publication date: March 4, 2010
    Applicant: SMK Corporation
    Inventors: Kenji Otsuka, Ryuhei Noguchi, Noriaki Miyata
  • Publication number: 20100053464
    Abstract: In a controlling mode wherein control content for rotational operation control of a controlled device has been selected through an inputting operation of an inputting switch, a displaying unit that is provided on a surface of a case that is displayed on the rotational center axis side of an operating unit displays the rotational operation directions for rotational operation control, to perform rotational operation control of a controlled device in a rotational operation direction displayed on the displaying unit by a rotational operation of an operating unit in a direction that matches the rotational operation direction that is displayed on the displaying unit.
    Type: Application
    Filed: March 17, 2009
    Publication date: March 4, 2010
    Applicant: SMK Corporation
    Inventor: Kenji Otsuka
  • Publication number: 20100052938
    Abstract: The rotation operation plane of the ring-shaped operation members that operate the rotation is inclined with respect to the horizontal plane so that the rotation operation of the ring-shaped operation member can be performed without holding a finger in the vertical direction. Furthermore, since the rotation operation plane is inclined with respect to the placement plane of the case, static friction on the placement plane is generated by a force component of the operation force acting on the rotation operation plane and is perpendicular to the placement plane, thus the case does not move toward the rotation operation direction during the rotation operation.
    Type: Application
    Filed: March 17, 2009
    Publication date: March 4, 2010
    Applicant: SMK Corporation
    Inventors: Kenji Otsuka, Ryuhei Noguchi, Noriaki Miyata
  • Publication number: 20100028093
    Abstract: A cutting tool having a small diameter is prevented from being heavily loaded to prevent a reduction in service life thereof. An electric drill that rotationally drives an annular cutting tool by using a drill motor (46) as a drive source is brought close to a workpiece by a drill feed unit having a feed motor (20a) to drill the workpiece with the annular cutting tool. In the course of drilling, the motor current of the drill motor (46) is detected by a motor current detector (50). A main controller (64) compares the result of detection by the motor current detector (50) with a preset reference value to identify the tool diameter of the annular cutting tool being used for drilling and sets a control mode for each tool diameter according to the identification result.
    Type: Application
    Filed: February 1, 2008
    Publication date: February 4, 2010
    Inventor: Kenji Otsuka
  • Publication number: 20090196696
    Abstract: It is an object of the present invention to prevent recurrence of an overload condition after occurrence of the overload condition, thereby improving operability and safety in a drilling device. A motor 12 for rotating a drill is connected to an AC power source 10 through a motor control unit 28, a current detector 30, and a power switch 36. A magnet 16 is also connected to the AC power source 10 through the power switch 36 and a full-wave rectifier 18. The motor control unit 28 rotationally drives the motor on the basis of a signal sent from a main control unit according to a state in which a motor start switch 38 is on. The main control unit 14 controls the motor control unit 28 to gradually reduce a supply voltage to the motor 12 when the motor 12 becomes overloaded, to gradually increase the voltage to the normal power supply condition when the overload condition is vanished, and to stop power supply to the motor 12 if the overload condition continues for a predetermined period.
    Type: Application
    Filed: December 13, 2006
    Publication date: August 6, 2009
    Inventors: Kenji Otsuka, Osamu Asano
  • Publication number: 20090115823
    Abstract: A droplet ejection head comprises: a substrate having first through-holes forming reservoir chambers, a second through-hole forming a supply chamber, and a bonding film on one surface; a nozzle plate having nozzles for ejecting ejection liquid and a second bonding film on one surface, the first and second films being bonded together to cover the first through-holes and the second through-hole; a sealing plate on another surface of the substrate covering the first through-holes, one surface of the sealing plate contacting the substrate's another surface; and piezoelectric means on another surface of the sealing plate for driving the droplet ejection head. The bonding films contain an Si-skeleton of constituent atoms containing silicon atoms, with siloxane (Si—O) bonds and elimination groups bonded to the silicon atoms, the constituent atoms being randomly bonded together, and the elimination groups existing near a surface of the bonding films.
    Type: Application
    Filed: November 4, 2008
    Publication date: May 7, 2009
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Yasuhide MATSUO, Kenji OTSUKA, Kazuo HIGUCHI, Kosuke WAKAMATSU
  • Publication number: 20090115818
    Abstract: A droplet ejection head comprises: a substrate having first through-holes forming reservoir chambers, a second through-hole forming a supply chamber, and a bonding film on one surface; a nozzle plate having nozzles for ejecting ejection liquid and one surface contacting the bonding film, the nozzle plate is bonded to the substrate through the bonding film to cover the first through-holes and the second through-hole; a sealing plate on another surface of the substrate covering the first through-holes, one surface of the sealing plate contacting the substrate's another surface; and piezoelectric means on another surface of the sealing plate for driving the droplet ejection head. The bonding film containing an Si-skeleton constituted of constituent atoms containing silicon atoms, with siloxane (Si—O) bonds and elimination groups bonded to the silicon atoms, the constituent atoms being randomly bonded together, and the elimination groups existing near a surface of the bonding film.
    Type: Application
    Filed: November 4, 2008
    Publication date: May 7, 2009
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Yasuhide MATSUO, Kenji OTSUKA, Kazuo HIGUCHI, Kosuke WAKAMATSU
  • Publication number: 20080212345
    Abstract: A DC-DC converter system is provided to improve switching control operation of a battery charging DC-DC converter (3) in an overheat temperature state without necessitating complication of a control unit (4). The control unit (4) performs output voltage limitation as well as output current limitation when the temperature of the DC-DC converter (3) is in an overheat temperature state in the vicinity of its operation stop temperature. With this capability, the output current and the output voltage can be limited, and therefore overheating of a power switching device (32) of the DC-DC converter (3) can be inhibited. In an alternative embodiment the switching frequency of the power switching device (32) is limited.
    Type: Application
    Filed: March 17, 2006
    Publication date: September 4, 2008
    Applicants: DENSO CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Tsuyoshi Yamashita, Mamoru Toda, Kenji Otsuka
  • Publication number: 20080143551
    Abstract: A RF communication system includes a RF communication module capable of controlling either an IR communication system-controlled device or a controlled device not equipped with a reception circuit for receiving IR signals remotely with RF signals. The RF communication module is equipped with an antenna for receiving RF signals, a RF communication circuit for demodulating the remote control data from the RF signal received by the antenna, a UART interface for outputting bit stream remote data to a device-side microcomputer of the controlled device, and a communication control unit having two types of communication interfaces in a pulse signal interface that outputs a pulse modulated signal, having been pulse modulated with remote control data, to a pulse modulated signal input port of the device-side microcomputer, so that remote control data transmitted by RF signals is output freely, as either bit stream or pulse modulated signals, to a device-side microcomputer of the controlled device.
    Type: Application
    Filed: December 14, 2007
    Publication date: June 19, 2008
    Applicant: SMK Corporation
    Inventors: Kenji Otsuka, Nobuhide Ninomiya
  • Publication number: 20080106656
    Abstract: In a liquid crystal display device, gate lines and common lines are first concurrently formed, and after an interlayer film is formed, a pixel electrode, common electrodes, and source lines are formed at the same time. By this, a electrode pattern can be made simple and manufacturing steps are simplified. Further, wiring lines and electrode disposed in the layer closest to a liquid crystal layer are made the pixel electrode, common electrodes and source lines, and the shapes thereof are made simple.
    Type: Application
    Filed: December 18, 2007
    Publication date: May 8, 2008
    Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
    Inventors: Hongyong Zhang, Yoshiharu Hirakata, Kenji Otsuka, Shunpei Yamazaki, Hideaki Kuwabara
  • Patent number: 7333169
    Abstract: In a liquid crystal display device, gate lines and common lines are first concurrently formed, and after an interlayer film is formed, a pixel electrode, common electrodes, and source lines are formed at the same time. By this, a electrode pattern can be made simple and manufacturing steps are simplified. Further, wiring lines and electrode disposed in the layer closest to a liquid crystal layer are made the pixel electrode, common electrodes and source lines, and the shapes thereof are made simple.
    Type: Grant
    Filed: December 29, 2003
    Date of Patent: February 19, 2008
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Hongyong Zhang, Yoshiharu Hirakata, Kenji Otsuka, Shunpei Yamazaki, Hideaki Kuwabara
  • Patent number: 7328874
    Abstract: A supporting device for non-averaged force in a pipeline comprised of a frame that is fixed to a supporting portion and a fixing mechanism for fixing a pipe body to the frame, wherein wedge bodies capable of blocking movements of the pipe body in a pipe axial direction with respect to the frame are provided when being pressed against an outer surface of the pipe body through pressing force acting from the frame towards the pipe body.
    Type: Grant
    Filed: May 3, 2006
    Date of Patent: February 12, 2008
    Assignee: Waterworks Technology Development Organization Co., Ltd.
    Inventors: Katsutoshi Tenma, Masashi Igarashi, Kenji Otsuka, Kikuo Saito, Haruhiko Shimizu
  • Patent number: 7297315
    Abstract: The invention provides a method of recovering a copper component or a manganese component from a cleaning agent containing copper oxide, a cleaning agent containing basic copper carbonate, a cleaning agent containing copper hydroxide, or a cleaning agent containing copper oxide and manganese oxide, the cleaning agents having been used for removing, through contact with a harmful gas, a phosphine contained as a harmful component in the harmful gas. Also, the invention provides a method of recovering a copper component or a manganese component from a cleaning agent containing basic copper carbonate, a cleaning agent containing copper hydroxide, or a cleaning agent containing copper oxide and manganese oxide, the cleaning agents having been used for removing, through contact with a harmful gas, a phosphine contained as a harmful component in the harmful gas.
    Type: Grant
    Filed: February 2, 2004
    Date of Patent: November 20, 2007
    Assignee: Japan Pionics Co., Ltd
    Inventors: Kenji Otsuka, Takashi Shimada, Minoru Osugi, Kei Kawaguchi