Abstract: According to one embodiment, an electronic apparatus includes a housing provided with air intake holes, a circuit board contained in the housing, with a heat producing component mounted on the circuit board, a heat sink contained in the housing, and a fan which sends cooling air to the heat sink in the housing, and includes a fan casing and an impeller contained in the fan casing. The fan casing includes a first suction port and a second suction port which face each other with the impeller inserted therebetween, and an exhaust port which faces the heat sink. The first suction port communicates with the air intake holes of the housing. The second suction port comprises an open area which faces the heat producing component in the housing, and another open area which is open to inside of the housing at a position deviated from the circuit board.

Abstract: According to one embodiment, an electronic device includes a housing, a circuit board, a thermally radiative section, a first heat generator, a second heat generator, a first heat receiving block, a second heat receiving block, at least one heat pipe including a first end and a second end, a second heat pipe including a third end, a fourth end, and an intermediate portion, and a cutout section provided on the first heat receiving block. The second heat generator is mounted on the circuit board at a position farther from the thermally radiative section than the first heat generator is. The first heat receiving block is provided with a cutout section and is thermally connected to the first heat generator. The second heat receiving block is thermally connected to the second heat generator. The intermediate portion of the second heat pipe passes through the cutout section.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a partition, a first cooling fan, and a second cooling fan. The partition partitions an inside of the housing into a first chamber and a second chamber. The first chamber communicates with a first inlet, a third inlet, and a first outlet. The second chamber communicates with a second inlet and a second outlet. The first cooling fan locates above the third inlet in the first chamber, and includes a first intake configured to draw air in the first chamber, and a second intake configured to draw air outside the housing through the third inlet, the first cooling fan being configured to discharge the air to a heat sink. The second cooling fan locates in the second chamber and is configured to draw air in the second chamber, and to discharge the air to the second outlet.

Abstract: According to one embodiment, the electronic device includes a housing, the first to third printed circuit boards, and a fan unit. The first printed circuit board includes the first heat-generating part secured to the first wiring board. The second printed circuit board includes the second and third heat-generating parts, has an amount of heat generation larger than that of the first printed circuit board, and is located between the first printed circuit board and the second wall. The third printed circuit board includes the fourth heat-generating part, has an amount of heat generation smaller than that of the first printed circuit board, and is located between the first printed circuit board and the first wall.

Abstract: According to one embodiment, an injection molding machine includes a first die and a second die, a driving mechanism configured to move the second die between the first position and the second position, a holder configured to hold a film for in-mold formation, the film including metallic sheets used for covering the surface of the molded product, and an electric discharge mechanism. The electrical discharge mechanism is moved to a contact position with movement of the second die from the first position to the second position, used as a driving source. The electrical discharge mechanism is moved to a retracted position with movement of the second die from the second position to the first position, used as a driving source.

Abstract: According to one embodiment, an electronic device includes a housing, a circuit board, a thermally radiative section, a first heat generator, a second heat generator, a first heat receiving block, a second heat receiving block, at least one heat pipe including a first end and a second end, a second heat pipe including a third end, a fourth end, and an intermediate portion, and a cutout section provided on the first heat receiving block. The second heat generator is mounted on the circuit board at a position farther from the thermally radiative section than the first heat generator is. The first heat receiving block is provided with a cutout section and is thermally connected to the first heat generator. The second heat receiving block is thermally connected to the second heat generator. The intermediate portion of the second heat pipe passes through the cutout section.

Abstract: According to one embodiment, the electronic device includes a housing, the first to third printed circuit boards, and a fan unit. The first printed circuit board includes the first heat-generating part secured to the first wiring board. The second printed circuit board includes the second and third heat-generating parts, has an amount of heat generation larger than that of the first printed circuit board, and is located between the first printed circuit board and the second wall. The third printed circuit board includes the fourth heat-generating part, has an amount of heat generation smaller than that of the first printed circuit board, and is located between the first printed circuit board and the first wall.

Abstract: According to one embodiment, an electronic apparatus includes a housing provided with air intake holes, a circuit board contained in the housing, with a heat producing component mounted on the circuit board, a heat sink contained in the housing, and a fan which sends cooling air to the heat sink in the housing, and includes a fan casing and an impeller contained in the fan casing. The fan casing includes a first suction port and a second suction port which face each other with the impeller inserted therebetween, and an exhaust port which faces the heat sink. The first suction port communicates with the air intake holes of the housing. The second suction port comprises an open area which faces the heat producing component in the housing, and another open area which is open to inside of the housing at a position deviated from the circuit board.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a partition, a first cooling fan, and a second cooling fan. The partition partitions an inside of the housing into a first chamber and a second chamber. The first chamber communicates with a first inlet, a third inlet, and a first outlet. The second chamber communicates with a second inlet and a second outlet. The first cooling fan locates above the third inlet in the first chamber, and includes a first intake configured to draw air in the first chamber, and a second intake configured to draw air outside the housing through the third inlet, the first cooling fan being configured to discharge the air to a heat sink. The second cooling fan locates in the second chamber and is configured to draw air in the second chamber, and to discharge the air to the second outlet.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a heat dissipating member disposed inside the housing, a first heat generating element mounted on the circuit board, a second heat generating element mounted on the circuit board, a first heat pipe, and a second heat pipe. The first heat pipe includes a first heat receiving portion thermally connected to the first heat generating element, and a first heat releasing portion thermally connected to the heat dissipating member. The second heat pipe includes a second heat receiving portion thermally connected to the second heat generating element, a second heat releasing portion thermally connected to the heat dissipating member, and a fluid capturing structure configured to temporarily hold a working fluid enclosed inside the second heat pipe.

Abstract: According to one embodiment, a loop heat pipe including a fluid circulating channel containing fluid, includes: an evaporating portion configured to vaporize the fluid by heat from a heat generating component; a condensing portion configured to liquefy the vaporized fluid; a first fluid channel connecting the evaporating portion and the condensing portion, the vaporized fluid flowing through the first fluid channel; a second fluid channel connecting the evaporating portion and the condensing portion, the fluid liquefied by the condensing portion flowing through the second fluid channel; a liquid accumulating portion formed on an inner wall of the second fluid channel, and provided between the evaporating portion and the condensing portion, the liquid accumulating portion being configured to accumulate the liquid liquefied by the condensing portion; and a wick provided between the evaporating portion and a position where the liquid accumulating portion is formed.

Abstract: According to one embodiment, a housing of an electronic apparatus includes a first sidewall portion provided with an air vent, a ceiling wall portion extending from an upper end of the first sidewall portion toward the outside of the housing, and a pair of second sidewall portions which extend from respective side end portions of the first sidewall portion toward the outside of the housing and are opposed to each other.

Abstract: An electronic device includes: a circuit board that has a wireless communication module that is mounted thereon and a feed line that is formed on the circuit board and electrically connected to the wireless communication module; a planar member that is formed with an opening and has a flexible planar piece that is formed to protrude toward the circuit board from an edge of the opening; and an antenna pattern that includes an antenna part that is formed on the planar member and a feeder part that is formed on the flexible planar piece, wherein circuit board and the planar member are arranged to be in positions to flexibly bend the flexible planar piece by the circuit board to electrically connect the feeder part of the antenna pattern and the feed line formed on the circuit board.

Abstract: According to one embodiment, an electronic apparatus includes a semiconductor package including a resin substrate and a die mounted on the resin substrate, a printed circuit board on which the semiconductor package is mounted, and a heat receiving plate that has an area larger than an area of the die. The heat receiving plate has a concave portion that corresponds to a surface of the die at a normal temperature. The concave portion is provided with a pasty heat conductive agent. The heat receiving plate is thermally connected to the semiconductor package via the pasty heat conductive agent.

Abstract: According to one embodiment, an injection molding machine includes a first die and a second die, a driving mechanism configured to move the second die between the first position and the second position, a holder configured to hold a film for in-mold formation, the film including metallic sheets used for covering the surface of the molded product, and an electric discharge mechanism. The electrical discharge mechanism is moved to a contact position with movement of the second die from the first position to the second position, used as a driving source. The electrical discharge mechanism is moved to a retracted position with movement of the second die from the second position to the first position, used as a driving source.

Abstract: According to one embodiment, a housing of an electronic apparatus includes a first sidewall portion provided with an air vent, a ceiling wall portion extending from an upper end of the first sidewall portion toward the outside of the housing, and a pair of second sidewall portions which extend from respective side end portions of the first sidewall portion toward the outside of the housing and are opposed to each other.

Abstract: According to one embodiment, a loop heat pipe including a fluid circulating channel containing fluid, includes: an evaporating portion configured to vaporize the fluid by heat from a heat generating component; a condensing portion configured to liquefy the vaporized fluid; a first fluid channel connecting the evaporating portion and the condensing portion, the vaporized fluid flowing through the first fluid channel; a second fluid channel connecting the evaporating portion and the condensing portion, the fluid liquefied by the condensing portion flowing through the second fluid channel; a liquid accumulating portion formed on an inner wall of the second fluid channel, and provided between the evaporating portion and the condensing portion, the liquid accumulating portion being configured to accumulate the liquid liquefied by the condensing portion; and a wick provided between the evaporating portion and a position where the liquid accumulating portion is formed.

Abstract: According to one embodiment, an electronic device includes a heat generating part housed inside a cabinet and a loop heat pipe housed inside the cabinet, which includes an internal flow path having a loop shape in which a working fluid is sealed. The loop heat pipe further includes a heat receiving unit, a heat radiating unit, a vapor flow path which allows a gasified portion of the working fluid to flow from the heat receiving unit towards the heat radiating unit, a liquid returning flow path which allows a liquefied portion of the working fluid to flow from the heat radiating unit towards the heat receiving unit, and a wick provided at a position adjacent to the vapor flow path inside the liquid returning flow path. The wick also serves as a partition portion which partitions the vapor flow path and the liquid returning flow path from each other.

Abstract: According to one embodiment, a housing of an electronic apparatus includes a first sidewall portion provided with an air vent, a ceiling wall portion extending from an upper end of the first sidewall portion toward the outside of the housing, and a pair of second sidewall portions which extend from respective side end portions of the first sidewall portion toward the outside of the housing and are opposed to each other.

Abstract: According to one embodiment, an electronic device includes a case, a heat generation body mounted in the case, a cooling member mounted in the case, and a heat conduction member. The heat conduction member includes a heat receiving section opposed to the heat generation body and thermally connected to the heat generation body, a heat radiation section opposed to the cooling member, and a section provided between the heat receiving section and the heat radiation section. The heat conduction member is formed by laminating a plurality of sheet members each having thermal conductivity. The plurality of sheet members are joined together in a portion of the heat conduction member.