Abstract: According to one embodiment, an electronic device includes a housing, a heat generating part contained in the housing, and a loop heat pipe contained in the housing. The loop heat pipe includes a heat receiving portion, a heat radiating portion, a vapor flow path and a liquid return flow path. The heat receiving portion includes a first region connected to the liquid return flow path and provided with a wick, and a second region formed to be hollow, connected to the vapor flow path. The heat receiving portion is thermally connected to the heat generating part at a position across the first region and the second region.

Abstract: According to one embodiment, an electronic apparatus includes a conductive layer provided on an outer surface of a housing, a conductive member provided inside the housing, and a connecting component attached to the housing. The housing is provided with a through hole which causes the inside of the housing to communicate with the outside. The connecting component has conductivity, and is provided with a major diameter section and a minor diameter section. The major diameter section is formed larger than the through hole, is opposed to the conductive layer from outside the housing, and is electrically connected to the conductive layer. The minor diameter section is formed smaller than the through hole, is inserted in the through hole to reach the inside of the housing, and is electrically connected to the conductive member.

Abstract: An electronic device is provided with an enclosure having a side wall in which vent holes are formed, a heat generator stored in the enclosure, a radiator disposed adjacent to the vent holes, a heat receiver thermally connected to the heat generator, a heat transmission member having one end thermally connected to the heat receiver and the other end thermally connected to the radiator, a fan disposed adjacent to the radiator to generate cooling air toward the radiator, and a seal member that seals a gap formed between the radiator and the side wall having the vent holes formed therein.

Abstract: According to one embodiment, an electronic apparatus includes a semiconductor package including a resin substrate and a die mounted on the resin substrate, a printed circuit board on which the semiconductor package is mounted, and a heat receiving plate that has an area larger than an area of the die. The heat receiving plate has a concave portion that corresponds to a surface of the die at a normal temperature. The concave portion is provided with a pasty heat conductive agent. The heat receiving plate is thermally connected to the semiconductor package via the pasty heat conductive agent.

Abstract: According to one embodiment, an electronic device includes a housing, a heat generating part contained in the housing, and a loop heat pipe contained in the housing. The loop heat pipe includes a heat receiving portion, a heat radiating portion, a vapor flow path and a liquid return flow path. The heat receiving portion includes a first region connected to the liquid return flow path and provided with a wick, and a second region formed to be hollow, connected to the vapor flow path. The heat receiving portion is thermally connected to the heat generating part at a position across the first region and the second region.

Abstract: According to one embodiment, an electronic device includes a heat generating part housed inside a cabinet and a loop heat pipe housed inside the cabinet, which includes an internal flow path having a loop shape in which a working fluid is sealed. The loop heat pipe further includes a heat receiving unit, a heat radiating unit, a vapor flow path which allows a gasified portion of the working fluid to flow from the heat receiving unit towards the heat radiating unit, a liquid returning flow path which allows a liquefied portion of the working fluid to flow from the heat radiating unit towards the heat receiving unit, and a wick provided at a position adjacent to the vapor flow path inside the liquid returning flow path. The wick also serves as a partition portion which partitions the vapor flow path and the liquid returning flow path from each other.

Abstract: A heat-receiving plate of a pump has a heat-receiving surface and a guide. The heat-receiving surface is thermally connected to a heat-generating body. The guide is provided on the heat-receiving surface. The guide is opposed to the heat-generating body.

Abstract: An electronic device includes: a circuit board that has a wireless communication module that is mounted thereon and a feed line that is formed on the circuit board and electrically connected to the wireless communication module; a planar member that is formed with an opening and has a flexible planar piece that is formed to protrude toward the circuit board from an edge of the opening; and an antenna pattern that includes an antenna part that is formed on the planar member and a feeder part that is formed on the flexible planar piece, wherein circuit board and the planar member are arranged to be in positions to flexibly bend the flexible planar piece by the circuit board to electrically connect the feeder part of the antenna pattern and the feed line formed on the circuit board.

Abstract: According to one embodiment, an electronic device includes a housing including a bottom wall and a side wall rising from an circumference of the bottom wall, an antenna formed on inner surface of the housing, and a part contained inside the housing and having a radio wave absorption property. The part having a radio wave absorption property is arranged with a predetermined gap maintained relative to the side wall of the housing, and at least a part of the antenna is formed in tight contact with an inner surface of the side wall of the housing.

Abstract: The cooling unit includes a heat receiving portion, a heat radiating portion and a circulation path. The heat radiating portion has an impeller, a heat-radiating member and a case. The heat-radiating member surround the impeller that applies cooling air. The heat-radiating member has a coolant passage in which liquid coolant flows, and a plurality of heat-radiating fins which are thermally connected to the coolant passage. The case contains the impeller and the heat-radiating member and has at least one outlet port through which the cooling air is expelled.

Abstract: A loop heat pipe includes a vessel having a flow path formed in a looped shape and a working fluid sealed in the vessel, and the vessel includes a first wick provided at least in a opposing area in an evaporation part and a second wick adjacent to the first wick 61 from the side of a liquid return pipe. The vessel has a first wall facing a heat generating component and a second wall opposed to the first wall. The first wick has a first portion provided in the first wall and a second portion provided in the second wall with space from the first portion. The second wick is provided to cover the entire cross-section of the flow path between the first wall and the second wall.

Abstract: According to one embodiment, a housing of an electronic apparatus includes a first sidewall portion provided with an air vent, a ceiling wall portion extending from an upper end of the first sidewall portion toward the outside of the housing, and a pair of second sidewall portions which extend from respective side end portions of the first sidewall portion toward the outside of the housing and are opposed to each other.

Abstract: According to one embodiment, a housing of an electronic apparatus includes a first sidewall portion provided with an air vent, a ceiling wall portion extending from an upper end of the first sidewall portion toward the outside of the housing, and a pair of second sidewall portions which extend from respective side end portions of the first sidewall portion toward the outside of the housing and are opposed to each other.

Abstract: According to one embodiment, a cooling device includes: a heat transfer unit including a passage, through which a coolant circulates, a heat-receiving section, which is thermally connected to a heating element, and a heat-sinking section for dissipating heat received by the heat-receiving section; a heat dissipation member thermally connected to the heat-sinking section; and a fan that blows air to the heat dissipation member. The heat transfer unit includes: a first plate member, in which a groove corresponding to the passage is formed; and a second plate member, which covers the groove. The heat-receiving section and the heat-sinking section are provided on one of the first and second plate members. The fan is provided on one side of the first or second plate member that is provided with the heat-receiving section and the heat-sinking section.

Abstract: According to one embodiment, a cooling device includes: a heat transfer unit including a passage, through which a coolant circulates, a heat-receiving section, which is thermally connected to a heating element, and a heat-sinking section for dissipating heat received by the heat-receiving section; a heat dissipation member thermally connected to the heat-sinking section; and a fan that blows air to the heat dissipation member. The heat transfer unit includes: a first plate member, in which a groove corresponding to the passage is formed; and a second plate member, which covers the groove. The heat-receiving section and the heat-sinking section are provided on one of the first and second plate members. The fan is provided on one side of the first or second plate member that is provided with the heat-receiving section and the heat-sinking section.

Abstract: A fuel cell system is provided with a fuel cell stack composed of one or more fuel cells, a discharging flow path for conducting an exhaust from the fuel cells connected to the fuel cells and a radiator for cooling the exhaust to a controlled temperature.

Abstract: According to one embodiment, an electronic apparatus includes a conductive layer provided on an outer surface of a housing, a conductive member provided inside the housing, and a connecting component attached to the housing. The housing is provided with a through hole which causes the inside of the housing to communicate with the outside. The connecting component has conductivity, and is provided with a major diameter section and a minor diameter section. The major diameter section is formed larger than the through hole, is opposed to the conductive layer from outside the housing, and is electrically connected to the conductive layer. The minor diameter section is formed smaller than the through hole, is inserted in the through hole to reach the inside of the housing, and is electrically connected to the conductive member.

Abstract: According to one embodiment, an electronic apparatus includes a housing, an inner conductor member provided inside the housing, a conductor part with which the housing is provided, and which restrains undesired electromagnetic radiation from leaking from inside the housing to the outside, and an antenna including an antenna element that is provided on an outer surface of the housing, the antenna using the conductor part as an antenna ground. The housing includes a non-conductor part that is out of the conductor part at least at a part of a region in which the antenna element is provided. When the antenna is viewed from a direction in which the antenna element and the housing overlap each other, a size of a part of the antenna element overlapping the non-conductor part is larger than a part of the antenna element overlapping the conductor part.

Abstract: A heat-receiving plate of a pump has a heat-receiving surface and a guide. The heat-receiving surface is thermally connected to a heat-generating body. The guide is provided on the heat-receiving surface. The guide is opposed to the heat-generating body.

Abstract: According to one embodiment, an electronic device includes a case, a heat generation body mounted in the case, a cooling member mounted in the case, and a heat conduction member. The heat conduction member includes a heat receiving section opposed to the heat generation body and thermally connected to the heat generation body, a heat radiation section opposed to the cooling member, and a section provided between the heat receiving section and the heat radiation section. The heat conduction member is formed by laminating a plurality of sheet members each having thermal conductivity. The plurality of sheet members are joined together in a portion of the heat conduction member.