Abstract: A technique for monitoring optical power in a fiber array unit having a plurality of optical transmission waveguides terminating at an edge thereof for carrying optical signals to and/or from a PLC. A tapping filter is placed within a slit formed in the substrate and interrupting the transmission channels, thereby tapping at least some of the optical power from the channels and directing the tapped optical power toward respective photodetector channels for detection, while allowing other optical power to continue transmission in the at least one channel of the fiber array unit.

Abstract: A technique for monitoring optical power in a fiber array unit having a plurality of optical transmission waveguides terminating at an edge thereof for carrying optical signals to and/or from a PLC. A tapping filter is placed within a slit formed in the substrate and interrupting the transmission channels, thereby tapping at least some of the optical power from the channels and directing the tapped optical power toward respective photodetector channels for detection, while allowing other optical power to continue transmission in the at least one channel of the fiber array unit.

Abstract: A funnel-type planar lightwave circuit (PLC) optical splitter having an input optical waveguide, a slab waveguide receiving the input optical signal from the input optical waveguide, and output waveguides projecting from the slab region. The region connecting the slab waveguide to the output waveguides is characterized by a segmented taper structure. In another additional, or alternative aspect of the present invention, a cladding mode absorption region runs along either or both sides of the input optical waveguide. A funnel-type splitter with both a cladding mode absorption region and a segmented taper structure provides a “super” low loss splitter design, when considering both insertion loss and polarization dependent loss. Advantageously, the disclosed funnel-type PLC splitter does not require a quartz substrate due to its very low PDL, and a silicon substrate can be used. Silicon substrates are known to be lower cost, with a higher resistance to fracture.

Abstract: A funnel-type planar lightwave circuit (PLC) optical splitter having an input optical waveguide, a slab waveguide receiving the input optical signal from the input optical waveguide, and output waveguides projecting from the slab region. The region connecting the slab waveguide to the output waveguides is characterized by a segmented taper structure. In another additional, or alternative aspect of the present invention, a cladding mode absorption region runs along either or both sides of the input optical waveguide. A funnel-type splitter with both a cladding mode absorption region and a segmented taper structure provides a “super” low loss splitter design, when considering both insertion loss and polarization dependent loss. Advantageously, the disclosed funnel-type PLC splitter does not require a quartz substrate due to its very low PDL, and a silicon substrate can be used. Silicon substrates are known to be lower cost, with a higher resistance to fracture.

Abstract: An apparatus and method for warpage compensation of a display panel substrate assembly are described. A method and apparatus for warpage compensation of a display panel substrate assembly are described. In one embodiment, the method includes the selection of a substrate having a substrate warpage level exceeding a warpage tolerance level. Once selected, a plurality of conductive bumps are formed over an area of the selected substrate. Once formed, a thermal process is applied to the plurality of conductive bumps to obtain a virtual plane over the area of the selected substrate have a coplanarity level below a coplanarity specification level. As such, utilizing embodiments of the present invention, lower cost substrates with substandard warpage levels may be utilized to form OLED panel substrate assemblies when compensated utilizing embodiments of the present invention.

Abstract: An apparatus and method for warpage compensation of a display panel substrate assembly are described. A method and apparatus for warpage compensation of a display panel substrate assembly are described. In one embodiment, the method includes the selection of a substrate having a substrate warpage level exceeding a warpage tolerance level. Once selected, a plurality of conductive bumps are formed over an area of the selected substrate. Once formed, a thermal process is applied to the plurality of conductive bumps to obtain a virtual plane over the area of the selected substrate have a coplanarity level below a coplanarity specification level. As such, utilizing embodiments of the present invention, lower cost substrates with substandard warpage levels may be utilized to form OLED panel substrate assemblies when compensated utilizing embodiments of the present invention.

Abstract: An apparatus and method for warpage compensation of a display panel substrate assembly are described. A method and apparatus for warpage compensation of a display panel substrate assembly are described. In one embodiment, the method includes the selection of a substrate having a substrate warpage level exceeding a warpage tolerance level. Once selected, a plurality of conductive bumps are formed over an area of the selected substrate. Once formed, a thermal process is applied to the plurality of conductive bumps to obtain a virtual plane over the area of the selected substrate have a coplanarity level below a coplanarity specification level. As such, utilizing embodiments of the present invention, lower cost substrates with substandard warpage levels may be utilized to form OLED panel substrate assemblies when compensated utilizing embodiments of the present invention.

Abstract: A socket for mounting a processor and/or a board has a substrate with a built in socket. The socket has conductive, elastically deformable terminals. The socket may be mounted to a processor and a board without using conventional surface mount technology, instead providing a mechanical contact mechanism between the socket and the board or processor. An adhesive layer may also be used to connect the socket to a processor and/or a board.

Abstract: An apparatus and method for warpage compensation of a display panel substrate assembly are described. A method and apparatus for warpage compensation of a display panel substrate assembly are described. In one embodiment, the method includes the selection of a substrate having a substrate warpage level exceeding a warpage tolerance level. Once selected, a plurality of conductive bumps are formed over an area of the selected substrate. Once formed, a thermal process is applied to the plurality of conductive bumps to obtain a virtual plane over the area of the selected substrate have a coplanarity level below a coplanarity specification level. As such, utilizing embodiments of the present invention, lower cost substrates with substandard warpage levels may be utilized to form OLED panel substrate assemblies when compensated utilizing embodiments of the present invention.

Abstract: A planar lightwave circuit includes an arrayed waveguide grating (AWG), with input and output waveguides, partially curved array waveguides with respective length differences, and planar waveguide regions for focusing optical energy between the input/output and array waveguides. Optimal waveguide widths and spacing along the planar waveguide region facets are disclosed, which are largely determinative of AWG size and optical performance. Also disclosed are optimal cross-sectional waveguide dimensions (e.g., width and height); modified index of refraction difference between the waveguide core and cladding regions; and optimal array waveguide lengths, path length differences, and free spectral range. These features, especially when combined with advanced fiber attachment, passivation and packaging techniques, result in high-yield, high-performance AWGs (both gaussian and flattop versions).

Abstract: A groove assembly for holding at least one fiber optic. The assembly includes a base, a cover and a small carrier disposed between the base and the cover. The carrier has at least one groove. At least one fiber optic is disposed in this groove and terminates at an edge surface of the carrier. The base and cover have respective edge surfaces serving as attachment surfaces for attachment of the assembly to a planar lightwave circuit (PLC). The PLC has at least one waveguide terminating at an edge, to which the fiber requires alignment. The base and/or cover are preferably formed from a material enabling attachment to the PLC, e.g., transparent to energy used for curing an adhesive. The carrier is formed from material enabling a substantially more precise formation of the grooves, e.g., silicon.

Abstract: A package for optical components includes an inner package enclosing the optical component, and an outer package enclosing the inner package. A heater may be disposed in the inner package proximate the optical component to control its temperature, and to maintain this temperature control, the outer package creates an isolated air pocket around the inner package, which thermally insulates the inner package from the outside environment. The outer package is formed of a material having low thermal conductivity, to promote this insulating function. This package is especially useful if the optical component comprises a planar light-wave circuit (PLC), e.g. an arrayed waveguide grating (AWG), which requires tight temperature control and structural integrity to maintain the integrity of the optical paths.

Abstract: A planar lightwave circuit includes an arrayed waveguide grating (AWG), with input and output waveguides, partially curved array waveguides with respective length differences, and planar waveguide regions for focusing optical energy between the input/output and array waveguides. Optimal waveguide widths and spacing along the planar waveguide region facets are disclosed, which are largely determinative of AWG size and optical performance. Also disclosed are optimal cross-sectional waveguide dimensions (e.g., width and height); modified index of refraction difference between the waveguide core and cladding regions; and optimal array waveguide lengths, path length differences, and free spectral range. These features, especially when combined with advanced fiber attachment, passivation and packaging techniques, result in high-yield, high-performance AWGs (both gaussian and flattop versions).

Abstract: An optical component package, in which a transfer molded layer of material (e.g., syntactic foam in one embodiment) is formed at least partially around, or entirely around, the optical component to provide structural and thermal insulation around the component. The optical component may be a planar lightwave circuit (PLC), with a protective passivation layer formed between the PLC and the layer of syntactic foam, to de-couple stresses and thermal transfer between the PLC and the layer of syntactic foam. Strengthening caps, fiber assemblies, and a heater may be provided with the PLC assembly, around which the layer of syntactic foam can also be formed. The protective passivation layer can also be formed between these structures and the syntactic foam; in one embodiment between at least two strengthening caps formed on opposing edges of the PLC. The disclosed package provides numerous structural, thermal and size benefits.

Abstract: A groove assembly for holding at least one fiber optic. The assembly includes a base, a cover and a small carrier disposed between the base and the cover. The carrier has at least one groove. At least one fiber optic is disposed in this groove and terminates at an edge surface of the carrier. The base and cover have respective edge surfaces serving as attachment surfaces for attachment of the assembly to a planar lightwave circuit (PLC). The PLC has at least one waveguide terminating at an edge, to which the fiber requires alignment. The base and/or cover are preferably formed from a material enabling attachment to the PLC, e.g., transparent to energy used for curing an adhesive. The carrier is formed from material enabling a substantially more precise formation of the grooves, e.g., silicon.

Abstract: A package for optical components includes an inner package enclosing the optical component, and an outer package enclosing the inner package. A heater may be disposed in the inner package proximate the optical component to control its temperature, and to maintain this temperature control, the outer package creates an isolated air pocket around the inner package, which thermally insulates the inner package from the outside environment. The outer package is formed of a material having low thermal conductivity, to promote this insulating function. This package is especially useful if the optical component comprises a planar light-wave circuit (PLC), e.g. an arrayed waveguide grating (AWG), which requires tight temperature control and structural integrity to maintain the integrity of the optical paths.

Abstract: A heat dissipation device comprising a thermally conductive, hollow housing having a fan and an active anti-noise module disposed within the hollow housing. The hollow housing may include a plurality of fins disposed therein to increase the surface area for convective heat transfer. The heat dissipation device further may further include heat pipes for the transportation and dispersion of heat to and about an external surface of the hollow housing.

Abstract: The present invention provides a method of attaching an integrated circuit die to a substrate. The method includes applying solder bumps to contact areas, and placing the inverted integrated circuit die in a desired location such that the solder bumps are in contact with contact areas of the integrated circuit die and the substrate. The solder bumps are heated to mount the die, such that the bumps form a connection between the substrate and the integrated circuit. The gap between the die and the substrate is underfilled by injecting a molding compound into a molding die positioned over the mounted integrated circuit die.

Abstract: A substrate which has a first conductive layer that is attached to a first dielectric layer. A second conductive layer is attached to the first dielectric layer. The second conductive layer may be a plated copper material that extends through a via opening of the dielectric and is attached to the first conductive layer. A third conductive layer is attached to the second conductive layer, including a sidewall of the third layer. A second dielectric can be attached to the third conductive layer. The third conductive layer may be a plated nickel-copper composition which improves the adhesion to subsequent layers in the substrate, particularly between the second dielectric and the sidewall of the second conductive layer.

Abstract: A cooling unit for an integrated circuit. The cooling unit may include a peltier device that may be coupled to the integrated circuit and a plurality of fins that are thermally coupled to the peltier device. The fins may be separated by at least one channel. The cooling unit may include a fan that generates a flow of fluid through the channel.