Abstract: A cathode active material includes a bulk nickel-rich cathode active material having a lithium metal oxide coating on a surface of the bulk nickel-rich cathode active material, wherein the lithium metal oxide coating exhibits one or more of the following: a greater PF5? score when normalized to that of LiAlO2 at 100%; a greater HF score when normalized to that of LiAlO2 at 100%; or in absolute terms, an enthalpy of reaction value that is less than 0.351.

Abstract: A process for coating a cathode active material includes dissolving a metal salt in water to generate an aqueous acidic solution; mixing the aqueous acidic solution with the cathode active material for an aging time period to form an acid treated cathode active material; and annealing the acid treated cathode active material at a temperature sufficient to form a lithium metal oxide coating on the cathode active material; wherein: the cathode active material is a high-nickel content lithium cathode active material; the metal salt is M(NO3)x, MClx, MIx, M(ClO3)x, or , M(ClO4)x; M is Al, Co, Cu, Fe, Mn, Mo, Nb, Ni, Sb, Sc, Sn, Ti, Y, Zr, or a mixture of any two or more thereof; and 1?x?8.

Abstract: An electrode includes an electrode active material and a lithium generating species including a mixture of Li3N and MNx, wherein MNx is a metal nitride including a metal (M) selected from Na, K, Ca, Mg, Ba, V, Nb, Ti, Zr, and Sr, or a mixture of any two or more thereof.

Abstract: A process of preparing a lithium metal phosphate includes contacting a water-soluble metal precursor, a water-insoluble metal precursor, and a phosphate precursor in an acidic aqueous medium; to form a reaction mixture; precipitating from the reaction mixture a metal phosphate; collecting the metal phosphate; combining the metal phosphate with a lithium precursor; and calcining the combined metal phosphate and lithium precursor at elevated temperature to form a lithium metal phosphate; wherein a mol ratio of water-soluble metal precursor to water-insoluble metal precursor is from 0.5:99.5 to 99.5:0.5.

Abstract: A flexible printed circuit board includes: a substrate; and a circuit pattern disposed on the substrate, wherein the substrate includes a chip mounting region, and the circuit pattern includes a wiring portion and a pad portion, wherein the circuit pattern includes: a first circuit pattern including a first-first pad portion disposed inside the chip mounting region, a first-second pad portion disposed outside the chip mounting region, and a first wiring portion that connects the first-first pad portion and the first-second pad portion, and extending in a first direction based on the chip mounting region; a second circuit pattern including a second-first pad portion disposed inside the chip mounting region, a second-second pad portion disposed outside the chip mounting region, and a second wiring portion that connects the second-first pad portion and the second-second pad portion, and extending in a second direction; and a third circuit pattern including a plurality of third pad portions disposed inside the ch

Abstract: A thermal release layer for electrode materials in a battery cell is provided. The battery cell can include a terminal and an electrode, in contact with the terminal. The battery cell can include a first material that conducts electricity to establish electrical continuity with the terminal. The battery call can include a second material that, in response to a temperature of the electrode reaching or exceeding a temperature threshold, expands to reduce the electrical continuity with the terminal.

Abstract: Provided herein is an apparatus. The apparatus can include a current collector foil. The current collector foil can include a coated area having an electrode coating. The current collector foil can include an uncoated area having an embossed pattern.

Abstract: A flexible printed circuit board includes: a substrate; and a circuit pattern disposed on the substrate, wherein the substrate includes a chip mounting region, and the circuit pattern includes a wiring portion and a pad portion, wherein the circuit pattern includes: a first circuit pattern including a first-first pad portion disposed inside the chip mounting region, a first-second pad portion disposed outside the chip mounting region, and a first wiring portion that connects the first-first pad portion and the first-second pad portion, and extending in a first direction based on the chip mounting region; a second circuit pattern including a second-first pad portion disposed inside the chip mounting region, a second-second pad portion disposed outside the chip mounting region, and a second wiring portion that connects the second-first pad portion and the second-second pad portion, and extending in a second direction; and a third circuit pattern including a plurality of third pad portions disposed inside the ch

Abstract: A disclosed method of selective separation and transfer of 2D material may include preparing a substrate structure including an adhesion target layer in which at least two different material layers are arranged to be in contact with each other laterally, preparing a crystalline material member including a 2D material, wherein the 2D material constitutes a unit layer, and a plurality of the unit layers form a layered structure through bonding, adhering the crystalline material member to a surface of the adhesion target layer so that a bond is formed between the crystalline material member and the adhesion target layer, and separating the crystalline material member and the adhesion target layer so that a 2D material layer pattern separated from the crystalline material member is formed on the surface of the adhesion target layer.

Abstract: A semiconductor package includes an insulating layer including a first face and a second face opposite each other, a redistribution pattern including a wiring region and a via region in the insulating layer, the wiring region being on the via region, and a first semiconductor chip connected to the redistribution pattern. The first semiconductor chip may be on the redistribution pattern. An upper face of the wiring region may be coplanar with the first face of the insulating layer.

Abstract: Lithium-ion batteries (LIBs) which include a metal phosphate coating material reactive (scavenging) or stable with cathode materials, HF, LiF, PF5?, and LiOH. The metal phosphates may be applied on the cathode material of LIBs.

Abstract: Disclosed herein is a composition comprising a shell that is substantially carbon encapsulating a volume that contains a nanoform of silicon and a void space. Disclosed herein too is a method of fabricating a composition comprising combining a nanoform of silicon with a carbon precursor and sintering the combination with a laser.

Abstract: A blended lithium-ion electrode for an electric vehicle and methods of manufacturing the electrode are disclosed. The blended lithium-ion electrode includes a first mixture of a lithium metal oxide comprised of LiXO2, wherein X is selected from the group consisting of nickel, cobalt, manganese, aluminum, iron, or mixtures thereof; and a second mixture of a lithium iron phosphate comprised of LiYPO4, wherein Y is selected from the group consisting of iron, manganese, cobalt, nickel, aluminum, titanate, or mixtures thereof. In further embodiments, the blended lithium-ion electrode includes graphene sheets to provide structure, electrochemical stabilizer, and electronic conductivity enhancer.

Abstract: The present invention discloses a fire-resistant sealing unit installed adjacent to a penetration part penetrating a partition wall inside a building, and filling the penetration part with fire-resistant sealing by heat generated in case of a fire in the building; a fire sensing unit installed adjacent to a fire-resistant sealing unit to detect whether a fire has occurred in a compartment area; and a control server that divides the inside of the building into predetermined conceptualized compartments, manages them as conceptualized compartmental areas, detects fire occurrence information from a fire sensing unit for each compartmental area, and calculates fire vector information.

Abstract: A flexible printed circuit board according to an embodiment includes: a substrate; a circuit pattern disposed on the substrate; and a protective layer on the circuit pattern, wherein the circuit pattern includes a first circuit pattern and a second circuit pattern connected to a chip in a chip mounting region, a first direction that is a direction in which the circuit pattern extends and a second direction perpendicular to the first direction are defined in the substrate, the substrate includes first and second ends facing each other in the first direction and third and fourth ends facing each other in the second direction, the protective layer includes fifth and sixth ends spaced apart from ends of the substrate and facing in the first direction and seventh and eighth ends spaced apart from ends of the substrate and facing in the second direction, and an outer pattern disposed adjacent to the third end and the fourth end on the substrate, wherein the outer pattern includes: a first outer pattern and a second

Abstract: The present invention discloses a system installed around a penetration hole of a pipe penetrating wall structure which divides a certain space and sealing the penetration hole in case of fire, which comprises a housing unit, a connecting unit and a fixing unit. A housing unit forming a body and having a predetermined accommodatable space, a connecting unit connected to the housing unit, interconnecting the housing unit in a series and a fixing unit arranged at a side of the housing unit, fixing the housing unit to the wall structure.

Abstract: The present invention relates to a method for continuous removal of carbon dioxide, the method comprising the steps of: a) preparing an aqueous solution containing an amine-based compound and an acidic calcium compound; b) bringing a gas containing carbon dioxide to be treated into contact with the aqueous solution to prepare a calcium carbonate precipitate; and c) recovering the calcium carbonate and then adding a basic calcium compound to the residual aqueous solution, wherein after step c), step b) and step c) are repeatedly performed. The removal of carbon dioxide by the method of the present invention has advantages of requiring low energy and being capable of mineralizing and removing carbon dioxide at a fast rate without a separate time for induction.

Abstract: A flexible printed circuit board includes: a substrate; and a circuit pattern disposed on the substrate, wherein the substrate includes a chip mounting region, and the circuit pattern includes a wiring portion and a pad portion, wherein the circuit pattern includes: a first circuit pattern including a first-first pad portion disposed inside the chip mounting region, a first-second pad portion disposed outside the chip mounting region, and a first wiring portion that connects the first-first pad portion and the first-second pad portion, and extending in a first direction based on the chip mounting region; a second circuit pattern including a second-first pad portion disposed inside the chip mounting region, a second-second pad portion disposed outside the chip mounting region, and a second wiring portion that connects the second-first pad portion and the second-second pad portion, and extending in a second direction; and a third circuit pattern including a plurality of third pad portions disposed inside the ch

Abstract: The present invention relates to a speaker driver and an operation method thereof and includes an amp part configured to output a pulse voltage, in which an input signal is amplified on the basis of a supply voltage, to drive a capacitive speaker that generates sound by a driving voltage so that the driving voltage formed by filtering the pulse voltage is applied to the capacitive speaker, and a controller configured to adjust a magnitude of an input audio signal in a high frequency range and transmit the input audio signal to the amp part as the input signal to limit an overcurrent applied to the capacitive speaker by the driving voltage having a high frequency.

Abstract: A semiconductor package includes an insulating layer including a first face and a second face opposite each other, a redistribution pattern including a wiring region and a via region in the insulating layer, the wiring region being on the via region, and a first semiconductor chip connected to the redistribution pattern. The first semiconductor chip may be on the redistribution pattern. An upper face of the wiring region may be coplanar with the first face of the insulating layer.