Abstract: The present invention includes an interposer disposed on a surface of a substrate, a light sensing array sensor disposed on the interposer, the light sensing array sensor being back-thinned and configured for back illumination, the light sensing array sensor including columns of pixels, one or more amplification circuitry elements configured to amplify an output of the light sensing array sensor, the amplification circuits being operatively connected to the interposer, one or more analog-to-digital conversion circuitry elements configured to convert an output of the light sensing array sensor to a digital signal, the ADC circuitry elements being operatively connected to the interposer, one or more driver circuitry elements configured to drive a clock or control signal of the array sensor, the interposer configured to electrically couple at least two of the light sensing array sensor, the amplification circuits, the conversion circuits, the driver circuits, or one or more additional circuits.

Abstract: The present invention may include a modulatable illumination source configured to illuminate a surface of a sample disposed on a sample stage, a detector configured to detect illumination emanating from a surface of the sample, illumination optics configured to direct illumination from the modulatable illumination source to the surface of the sample, collection optics configured to direct illumination from the surface of the sample to the detector, and a modulation control system communicatively coupled to the modulatable illumination source, wherein the modulation control system is configured to modulate a drive current of the modulatable illumination source at a selected modulation frequency suitable for generating illumination having a selected coherence feature length. In addition, the present invention includes the time-sequential interleaving of outputs of multiple light sources to generate periodic pulses trains for use in multi-wavelength time-sequential optical metrology.

Abstract: Disclosed are apparatus and methods for inspecting or measuring a specimen. An incident beam is directed across a plurality of consecutive scan portions of a specimen so that an output beam profile from each scan portion is consecutively collected by a photomultiplier tube (PMT), and the scan portions include at least one or more first scan portions and a next scan portion that is scanned after the one or more first scan portions. After or while the incident beam is directed to the one or more first scan portions of the specimen, an output signal for each first scan portion is obtained based on the output beam profile that is collected by the PMT for each first scan portion. An expected output beam profile for the next scan portion is determined based on the output signal that is obtained for each one or more first scan portions.

Abstract: A focusing EBCCD includes a control device positioned between a photocathode and a CCD. The control device has a plurality of holes therein, wherein the plurality of holes are formed perpendicular to a surface of the photocathode, and wherein a pattern of the plurality of holes is aligned with a pattern of pixels in the CCD. Each hole is surrounded by at least one first electrode, which is formed on a surface of the control device facing the photocathode. The control device may include a plurality of ridges between the holes. The control device may be separated from the photocathode by approximately half a shorter dimension of a CCD pixel or less. A plurality of first electrodes may be provided, wherein each first electrode surrounds a given hole and is separated from the given hole by a gap.

Abstract: One embodiment relates to a method of preparation of a sample of a substrate for sub-surface review using a scanning electron microscope apparatus. A defect at a location indicated in a first results file is re-detected, and the location of the defect is marked with at least one discrete marking point having predetermined positioning relative to the location of the defect. The location of the defect may be determined relative to the design for the device, and a cut location and a cut angle may be determined in at least a partly-automated manner using that information. Another embodiment relates to a system for preparing a sample for sub-surface review. Another embodiment relates to a method for marking a defect for review on a target substrate. Other embodiments, aspects and feature are also disclosed.

Abstract: One embodiment relates to a high-voltage electron gun including an insulator stand-off having a resistive layer. The resistive layer is at least on an interior surface of the insulator stand-off. A cathode holder is coupled to one end of the insulator 115 stand-off, and an anode is coupled to the other end. The resistive layer advantageously increases the surface breakdown field strength for the insulator stand-off and so enables a compact design for the high-voltage electron gun. Other embodiments, aspects and feature are also disclosed.

Abstract: Methods and systems for calibrating system parameter values of a target inspection system are presented. Spectral Error Based Calibration (SEBC) increases consistency among inspection systems by minimizing differences in the spectral error among different inspection systems for a given specimen or set of specimens. The system parameter values are determined such that differences between a spectral error associated with a measurement of a specimen by the target inspection system and a spectral error associated with a measurement of the same specimen by a reference inspection system are minimized. In some examples, system parameter values are calibrated without modifying specimen parameters. Small inaccuracies in specimen parameter values have little effect on the calibration because the target system and the reference system both measure the same specimen or set of specimens. By performing SEBC over a set of specimens, the resulting calibration is robust to a wide range of specimens under test.

Abstract: A method of performing a hot test of a wafer-level, packaged high-brightness phosphor converted light-emitting diode (pc-HBLED) includes selectively heating portions of the phosphor layer using a laser to provide a predetermined temperature gradient in the phosphor layer. The selective heating can directly heat the silicone in a silicone-based phosphor layer, or directly heat the active ion(s) of the phosphor in a Lumiramic™-based phosphor or even the active ion(s) of a silicone-based phosphor layer. A current is applied to the InGaN film to establish a predetermined temperature at the InGaN film junction, the film junction being adjacent to the phosphor layer. Photometric measurements are performed on the HBLED after the selective heating and during the applied electroluminescent current. This method quickly establishes the temperatures and temperature gradients in the HBLED consistent with those of an operating, product-level HBLED, thereby ensuring accurate binning of the HBLED.

Abstract: The disclosure is directed to improving optical metrology for a sample with complex structural attributes utilizing custom designed secondary targets. At least one parameter of a secondary target may be controlled to improve sensitivity for a selected parameter of a primary target and/or to reduce correlation of the selected parameter with other parameters of the primary target. Parameters for the primary and secondary target may be collected. The parameters may be incorporated into scatterometry model. Simulations utilizing the scatterometry model may be conducted to determine a level of sensitivity or a level of correlation for the selected parameter of the primary target. The controlled parameter of the secondary target may be modified until a selected level of sensitivity or a selected level of correlation is achieved.

Abstract: The present invention may include an illumination source, a detector, a selectably adjustable optical system including a dynamically adjustable illumination pupil of the illumination arm, a dynamically adjustable collection pupil of the collection arm, a dynamically adjustable illumination field stop of the illumination arm, a dynamically adjustable collection field stop of the collection arm, a sensor configured to measure one or more optical characteristics of one or more components of the optical system, and a control system configured to selectably dynamically adjust at least one of the illumination pupil, the collection pupil, the illumination field stop, the collection field stop, and a spectral radiance of the illumination source.

Abstract: A refillable plasma cell for use in a laser-sustained plasma light source includes a plasma bulb, the bulb being formed from a glass material substantially transparent to a selected wavelength of radiation, and a gas port assembly, the gas port assembly being operably connected to the bulb and disposed at a first portion of the gas bulb, wherein the bulb is configured to selectively receive a gas from a gas source via the gas port assembly.

Abstract: Systems and methods to precisely balance the amount of heat removed from a specimen with the amount of heat generated during processing are presented. In some embodiments, the heat introduced into the specimen is rapidly removed by a temperature controlled cooling element via radiative heat transfer. In some embodiments, a heating element is disposed between the specimen and the cooling element. The heating element is controlled to precisely balance the amount of heat removed from the specimen with the amount of heat generated. A control signal is generated based on the amount of process energy known apriori. The control signal may also be based on an indication of a temperature of the specimen. In some embodiments, an adjustable aperture is employed to change the surface area of the cooling element exposed to the specimen, and thus control the amount of heat absorbed from the specimen by the cooling element.

Abstract: An optical collection system for use in a surface inspection system for inspecting a surface of a workpiece. The surface inspection system has an incident beam projected through a back quartersphere and toward a location on the surface of the workpiece to impinge on the surface. This forms a reflected beam that extends along a light channel axis in a front quartersphere, and forms scattered light having a haze scatter portion. The incident beam and the light channel axis form an incident plane. The optical collection system includes back collectors that are positioned in the back quartersphere for collecting the scattered light, where each of the back collectors is disposed in the back quartersphere outside the incident plane, and at a relative minimum in the Rayleigh scatter.

Abstract: Systems and methods for acquiring information for a construction site are provided. One system includes a base unit positioned within a construction site by a user. A computer subsystem of the base unit determines a position of the base unit with respect to the construction site. The system also includes a measurement unit moved within the construction site by a user. The measurement unit includes one or more elements configured to interact with light in a known manner. An optical subsystem of the base unit directs light to the element(s) and detects the light after interacting with the element(s). The computer subsystem is configured to determine a position and pose of the measurement unit with respect to the base unit based on the detected light. The measurement unit includes a measurement device used by the measurement unit or the base unit to determine information for the construction site.

Abstract: Methods and systems for generating an indication of a changing electrostatic field between a sense electrode of a capacitance sensing integrated circuit and a specimen under inspection are presented. The capacitance sensing integrated circuit is an integrated circuit that includes a number of sense electrodes and sense electronics. By fabricating the elements of the capacitance sensing integrated circuit as a single microelectronic chip, the sense electrodes can be miniaturized to sizes that enable inspection of fine line patterns common in modern semiconductor manufacturing. In one embodiment, the sense electrodes are metallic contacts. In another embodiment the sense electrodes are field effect transistors (FETs) with a floating gate. The sense electronics generate an indication of the changing electrostatic field between each sense electrode and a specimen under inspection as the specimen is scanned relative to the capacitance sensing integrated circuit.

Abstract: Methods and systems for determining band structure characteristics of high-k dielectric films deposited over a substrate based on spectral response data are presented. High throughput spectrometers are utilized to quickly measure semiconductor wafers early in the manufacturing process. Optical dispersion metrics are determined based on the spectral data. Band structure characteristics such as band gap, band edge, and defects are determined based on optical dispersion metric values. In some embodiments a band structure characteristic is determined by curve fitting and interpolation of dispersion metric values. In some other embodiments, band structure characteristics are determined by regression of a selected dispersion model. In some examples, band structure characteristics indicative of band broadening of high-k dielectric films are also determined. The electrical performance of finished wafers is estimated based on the band structure characteristics identified early in the manufacturing process.

Abstract: A transport system for substrates, the transport system having at least one belt for receiving the substrates thereon, retainers disposed at spaced distances on the belt, the spaced distances being at least as wide as a width of the substrates, the retainers rising to an elevation above the belt that is sufficient to stop the substrates from sliding when the substrates bump against the retainers, a motor for moving the belt, and a motion controller for providing acceleration and deceleration of the belt, thereby aligning the substrates against the retainers through successive acceleration and deceleration cycles.