Patents by Inventor Koichi Kita

Koichi Kita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210352828
    Abstract: A carbonaceous member contains graphene aggregates formed by deposition of a single layer or multiple layers of graphene, and flat graphite particles, and has a structure in which the flat graphite particles are laminated with the graphene aggregate as a binder so that basal surfaces of the graphite particles overlap with one another, and the basal surfaces of the flat graphite particles are oriented in one direction. A metal layer includes a metal plating layer directly formed on a surface (edge lamination surface) to which edge surfaces of the graphite particles laminated in the carbonaceous member are directed, and the metal plating layer is made of a metal having a thermal conductivity of 50 W/(m·k) or greater.
    Type: Application
    Filed: October 31, 2019
    Publication date: November 11, 2021
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Koichi Kita, Toshiyuki Nagase, Kiyotaka Nakaya, Kotaro Iwata
  • Patent number: 10981230
    Abstract: A high quality porous aluminum body, which has excellent joint strength between the porous aluminum body and the aluminum bulk body, and a method of producing the porous aluminum complex, are provided. The porous aluminum complex (10) includes: a porous aluminum body (30) made of aluminum or aluminum alloy; and an aluminum bulk body (20) made of aluminum or aluminum alloy, the porous aluminum body (30) and the aluminum bulk body (20) being joined to each other. The junction (15) between the porous aluminum body (30) and the aluminum bulk body (20) includes a Ti—Al compound. It is preferable that pillar-shaped protrusions (32) projecting toward the outside are formed on outer surfaces of one of or both of the porous aluminum body (30) and the aluminum bulk body (20), and the pillar-shaped protrusions (32) include the junction (15).
    Type: Grant
    Filed: June 1, 2015
    Date of Patent: April 20, 2021
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Ji-bin Yang, Koichi Kita, Toshihiko Saiwai, Koji Hoshino, Jun Katoh
  • Patent number: 10981228
    Abstract: A high-quality porous aluminum sintered compact, which can be produced efficiently at a low cost; has an excellent dimensional accuracy with a low shrinkage ratio during sintering; and has sufficient strength, and a method of producing the porous aluminum sintered compact are provided. The porous aluminum sintered compact is the porous aluminum sintered compact (10) that includes aluminum substrates (11) sintered to each other. The junction (15), in which the aluminum substrates (11) are bonded to each other, includes the Ti—Al compound (16) and the Mg oxide (17). It is preferable that the pillar-shaped protrusions projecting toward the outside are formed on outer surfaces of the aluminum substrates (11), and the pillar-shaped protrusions include the junction (15).
    Type: Grant
    Filed: May 18, 2015
    Date of Patent: April 20, 2021
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Ji-bin Yang, Koichi Kita, Toshihiko Saiwai, Koji Hoshino, Jun Katoh
  • Patent number: 10898956
    Abstract: A manufacturing method of a copper bonded part in which a first copper member and a second copper member are bonded together. The first copper member and the second copper member are made of copper or a copper alloy, and at least one of the first copper member and the second copper member includes a copper porous body made of copper or a copper alloy. This manufacturing method has a bonding material disposing step S01 of disposing a bonding material between the first copper member and the second copper member, and a reduction sintering step S02 of heating and holding the first copper member, the second copper member, and the bonding material in a reducing atmosphere in a range of 600° C. or higher and 1,050° C. or lower. The bonding material contains a copper oxide or a mixture of metallic copper and the copper oxide.
    Type: Grant
    Filed: October 12, 2016
    Date of Patent: January 26, 2021
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Jun Kato, Koichi Kita
  • Patent number: 10598446
    Abstract: A porous aluminum heat exchanger including: a porous aluminum body in which aluminum substrates are sintered each other; and a bulk body, which is an aluminum bulk body made of aluminum or aluminum alloy is provided. Pillar-shaped protrusions projecting toward an outside are formed on outer surfaces of the aluminum substrates, and pores of the porous aluminum body are configured to form flow channels of a heat medium.
    Type: Grant
    Filed: July 2, 2015
    Date of Patent: March 24, 2020
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Toshihiko Saiwai, Koichi Kita, Ji-bin Yang, Koji Hoshino
  • Patent number: 10543531
    Abstract: A porous aluminum sintered material is provided. The porous aluminum sintered material includes aluminum substrates sintered each other, wherein pillar-shaped protrusions projecting toward an outside are formed on outer surfaces of the aluminum substrates, the porous aluminum sintered material has junctions in which the aluminum substrates are bonded each other through the pillar-shaped protrusions, the junctions include a Ti—Al compound, and a eutectic alloy phase including Al and Si is provided on surface layers of the junctions.
    Type: Grant
    Filed: October 28, 2015
    Date of Patent: January 28, 2020
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Toshihiko Saiwai, Ji-bin Yang, Koichi Kita
  • Patent number: 10532407
    Abstract: A porous copper sintered material (10) includes: a plurality of copper fibers (11) sintered each other, wherein the copper fibers (11) are made of copper or copper alloy, a diameter R of the copper fibers (11) is in a range of 0.02 mm or more and 1.0 mm or less, and a ratio L/R of a length L of the copper fibers to the diameter R is in a range of 4 or more and 2500 or less (11), redox layers (12) formed by redox treatment are provided on surfaces of copper fibers (11, 11), and concavities and convexities are formed by the redox layer (12), and each of redox layers (12, 12) formed on each of the copper fibers (11) is integrally bonded in a junction of the copper fibers (11).
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: January 14, 2020
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Koichi Kita, Koji Hoshino, Toshihiko Saiwai, Jun Katoh
  • Publication number: 20190381568
    Abstract: This porous copper body includes: a skeleton which is formed of a sintered body of a plurality of copper fibers and has a three-dimensional network structure, wherein the copper fibers forming the skeleton consist of copper or a copper alloy, and the copper fibers have a diameter R in a range of 0.01 mm to 1.0 mm, a ratio L/R of a length L to the diameter R in a range of 4 to 200, and a circularity of a cross section orthogonal to a length direction in a range of 0.2 to 0.9, and the porous copper body has a porosity of 50% to 95%.
    Type: Application
    Filed: January 18, 2018
    Publication date: December 19, 2019
    Inventors: Jun Kato, Koichi Kita, Toshihiko Saiwai
  • Patent number: 10493528
    Abstract: A porous copper body including a skeleton having a three-dimensional network structure is provided. An oxidation-reduction layer formed by an oxidation-reduction treatment is provided on a surface of the skeleton, and the oxygen concentration of the entirety of the skeleton is set to be 0.025 mass % or less.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: December 3, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Koichi Kita, Jun Kato, Toshihiko Saiwai
  • Patent number: 10478895
    Abstract: A high-quality porous aluminum sintered compact, which can be produced efficiently at a low cost; has an excellent dimensional accuracy with a low shrinkage ratio during sintering; and has sufficient strength, and a method of producing the porous aluminum sintered compact are provided. The porous aluminum sintered compact is the porous aluminum sintered compact that includes aluminum substrates sintered each other. The junction, in which the aluminum substrates are bonded each other, includes the Ti—Al compound and the eutectic element compound capable of eutectic reaction with Al. It is preferable that the pillar-shaped protrusions projecting toward the outside are formed on outer surfaces of the aluminum substrates, and the pillar-shaped protrusions include the junction.
    Type: Grant
    Filed: May 18, 2015
    Date of Patent: November 19, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Ji-Bin Yang, Koichi Kita, Toshihiko Saiwai, Koji Hoshino, Jun Katoh
  • Patent number: 10478896
    Abstract: A porous copper body including a skeleton having a three-dimensional network structure is provided. An oxidation-reduction layer formed by an oxidation-reduction treatment is provided on a surface of the skeleton, and the average crystal grain size of an entirety including the skeleton and the oxidation-reduction layer is 5% or more of the diameter of the skeleton.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: November 19, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Koichi Kita, Jun Kato, Toshihiko Saiwai
  • Publication number: 20190076927
    Abstract: The porous copper body of the disclosure includes a skeleton having a three-dimensional network structure, in which a porosity is in a range of 50% to 90% and a porosity-normalized electrical conductivity ?N which is defined by dividing a electrical conductivity of the porous copper body, measured by a 4-terminal sensing, by an apparent density ratio of the porous copper body is 20% IACS or higher.
    Type: Application
    Filed: April 7, 2017
    Publication date: March 14, 2019
    Inventors: Jun Kato, Koichi Kita, Toshihiko Saiwai
  • Publication number: 20190054538
    Abstract: A manufacturing method of a copper bonded part in which a first copper member and a second copper member are bonded together. The first copper member and the second copper member are made of copper or a copper alloy, and at least one of the first copper member and the second copper member includes a copper porous body made of copper or a copper alloy. This manufacturing method has a bonding material disposing step S01 of disposing a bonding material between the first copper member and the second copper member, and a reduction sintering step S02 of heating and holding the first copper member, the second copper member, and the bonding material in a reducing atmosphere in a range of 600° C. or higher and 1,050° C. or lower. The bonding material contains a copper oxide or a mixture of metallic copper and the copper oxide.
    Type: Application
    Filed: October 12, 2016
    Publication date: February 21, 2019
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Jun Kato, Koichi Kita
  • Publication number: 20180297118
    Abstract: A porous copper body including a skeleton having a three-dimensional network structure is provided. A porous layer having unevenness is formed on a surface of the skeleton, the specific surface area is set to be 0.01 m2/g or greater, and the porosity is set to be in a range of 50% to 90%.
    Type: Application
    Filed: May 24, 2016
    Publication date: October 18, 2018
    Inventors: Koichi Kita, Jun Kato, Toshihiko Saiwai
  • Publication number: 20180290211
    Abstract: A porous aluminum sintered material is provided. The porous aluminum sintered material includes aluminum substrates sintered each other, wherein pillar-shaped protrusions projecting toward an outside are formed on outer surfaces of the aluminum substrates, the porous aluminum sintered material has junctions in which the aluminum substrates are bonded each other through the pillar-shaped protrusions, the junctions include a Ti—Al compound, and a eutectic alloy phase including Al and Si is provided on surface layers of the junctions.
    Type: Application
    Filed: October 28, 2015
    Publication date: October 11, 2018
    Inventors: Toshihiko SAIWAI, Ji-bin YANG, Koichi KITA
  • Publication number: 20180161877
    Abstract: A porous copper body including a skeleton having a three-dimensional network structure is provided. An oxidation-reduction layer formed by an oxidation-reduction treatment is provided on a surface of the skeleton, and the oxygen concentration of the entirety of the skeleton is set to be 0.025 mass % or less.
    Type: Application
    Filed: May 23, 2016
    Publication date: June 14, 2018
    Inventors: Koichi Kita, Jun Kato, Toshihiko Saiwai
  • Publication number: 20180161876
    Abstract: A porous copper body including a skeleton having a three-dimensional network structure is provided. An oxidation-reduction layer formed by an oxidation-reduction treatment is provided on a surface of the skeleton, and the average crystal grain size of an entirety including the skeleton and the oxidation-reduction layer is 5% or more of the diameter of the skeleton.
    Type: Application
    Filed: May 23, 2016
    Publication date: June 14, 2018
    Inventors: Koichi Kita, Jun Kato, Toshihiko Saiwai
  • Publication number: 20170239729
    Abstract: A porous copper sintered material (10) includes: a plurality of copper fibers (11) sintered each other, wherein the copper fibers (11) are made of copper or copper alloy, a diameter R of the copper fibers (11) is in a range of 0.02 mm or more and 1.0 mm or less, and a ratio L/R of a length L of the copper fibers to the diameter R is in a range of 4 or more and 2500 or less (11), redox layers (12) formed by redox treatment are provided on surfaces of copper fibers (11, 11), and concavities and convexities are formed by the redox layer (12), and each of redox layers (12, 12) formed on each of the copper fibers (11) is integrally bonded in a junction of the copper fibers (11).
    Type: Application
    Filed: October 21, 2015
    Publication date: August 24, 2017
    Inventors: Koichi Kita, Koji Hoshino, Toshihiko Saiwai, Jun Katoh
  • Publication number: 20170153072
    Abstract: A porous aluminum heat exchanger including: a porous aluminum body in which aluminum substrates are sintered each other; and a bulk body, which is an aluminum bulk body made of aluminum or aluminum alloy is provided. Pillar-shaped protrusions projecting toward an outside are formed on outer surfaces of the aluminum substrates, and pores of the porous aluminum body are configured to form flow channels of a heat medium.
    Type: Application
    Filed: July 2, 2015
    Publication date: June 1, 2017
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Toshihiko Saiwai, Koichi Kita, Ji-bin Yang, Koji Hoshino
  • Publication number: 20170043401
    Abstract: A high quality porous aluminum body, which has excellent joint strength between the porous aluminum body and the aluminum bulk body, and a method of producing the porous aluminum complex, are provided. The porous aluminum complex includes: a porous aluminum body made of aluminum or aluminum alloy; and an aluminum bulk body made of aluminum or aluminum alloy, the porous aluminum body and the aluminum bulk body being joined each other. The junction between the porous aluminum body and the aluminum bulk body includes a Ti—Al compound. It is preferable that pillar-shaped protrusions projecting toward the outside are formed on outer surfaces of one of or both of the porous aluminum body and the aluminum bulk body, and the pillar-shaped protrusions include the junction.
    Type: Application
    Filed: June 1, 2015
    Publication date: February 16, 2017
    Inventors: Ji-bin Yang, Koichi Kita, Toshihiko Saiwai, Koji Hoshino, Jun Katoh