Patents by Inventor Koichi Kita

Koichi Kita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170043398
    Abstract: A high-quality porous aluminum sintered compact, which can be produced efficiently at a low cost; has an excellent dimensional accuracy with a low shrinkage ratio during sintering; and has sufficient strength, and a method of producing the porous aluminum sintered compact are provided. The porous aluminum sintered compact is the porous aluminum sintered compact that includes aluminum substrates sintered each other. The junction, in which the aluminum substrates are bonded each other, includes the Ti—Al compound and the Mg oxide. It is preferable that the pillar-shaped protrusions projecting toward the outside are formed on outer surfaces of the aluminum substrates, and the pillar-shaped protrusions include the junction.
    Type: Application
    Filed: May 18, 2015
    Publication date: February 16, 2017
    Applicant: Mitsubishi Materials Corporation
    Inventors: Ji-bin Yang, Koichi Kita, Toshihiko Saiwai, Koji Hoshino, Jun Katoh
  • Publication number: 20170028473
    Abstract: A high-quality porous aluminum sintered compact, which can be produced efficiently at a low cost; has an excellent dimensional accuracy with a low shrinkage ratio during sintering; and has sufficient strength, and a method of producing the porous aluminum sintered compact are provided. The porous aluminum sintered compact is the porous aluminum sintered compact that includes aluminum substrates sintered each other. The junction, in which the aluminum substrates are bonded each other, includes the Ti—Al compound and the eutectic element compound capable of eutectic reaction with Al. It is preferable that the pillar-shaped protrusions projecting toward the outside are formed on outer surfaces of the aluminum substrates, and the pillar-shaped protrusions include the junction.
    Type: Application
    Filed: May 18, 2015
    Publication date: February 2, 2017
    Inventors: Ji-Bin Yang, Koichi Kita, Toshihiko Saiwai, Koji Hoshino, Jun Katoh
  • Publication number: 20150359635
    Abstract: The invention provides a medical device in which a metallic porous body is joined to at least a part of a surface of the main body of a medical device, and a surface modification method for the medical device. The metallic porous body is formed in multilayers.
    Type: Application
    Filed: August 11, 2015
    Publication date: December 17, 2015
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Koichi KITA, Komei KATO, Akiko YAMAMOTO, Junzo TANAKA
  • Patent number: 9138301
    Abstract: The invention provides a medical device in which a metallic porous body is joined to at least a part of a surface of the main body of a medical device, and a surface modification method for the medical device. The metallic porous body is formed in multilayers.
    Type: Grant
    Filed: December 5, 2006
    Date of Patent: September 22, 2015
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Koichi Kita, Komei Kato, Akiko Yamamoto, Junzo Tanaka
  • Patent number: 8876990
    Abstract: Methods to enhance the quality of grain boundary networks are described. The process can result in the production of a metal including a relatively large fraction of special grain boundaries (e.g., a fraction of special grain boundaries of at least about 55%).
    Type: Grant
    Filed: August 20, 2009
    Date of Patent: November 4, 2014
    Assignee: Massachusetts Institute of Technology
    Inventors: Christopher A. Schuh, Koichi Kita
  • Publication number: 20140201999
    Abstract: A method of manufacturing a composite contact in which a flange section with a large diameter at an end of a base part with a small diameter, the composite contact having: a contact section which is made from silver alloy into an upper-surface part of the flange section; and a leg section which is made from copper alloy by forming a large-diameter part so as to form a lower-surface part of the flange section is made integrally with the base part, having the steps of: a primary-forming process forging a copper-alloy wire and a silver-alloy wire having a smaller diameter than that of the copper-alloy wire in a hole of a forming die in a state of being butted to each other so as to form a primary-formed body including a silver-alloy part and a copper-alloy part so that the wires are bonded with each other.
    Type: Application
    Filed: June 21, 2012
    Publication date: July 24, 2014
    Applicant: MITSUBISHI MATERIALS C.M.I. CORPORATION
    Inventors: Koichi Kita, Hideki Umeoka, Noriaki Murahashi, Shinji Yamanashi, Akihiko Inaba, Hideo Takizawa
  • Publication number: 20130075272
    Abstract: Provided are a highly pure copper anode for electrolytic copper plating, a method for manufacturing the same, and an electrolytic copper plating method using the highly pure copper anode. The highly pure copper anode obtains a crystal grain boundary structure having a special grain boundary ratio L?N/LN of 0.35 or more. LN is a unit total special grain boundary length. L?N is a unit total special boundary length. By having the configuration described above, plating defect can be reduced by suppressing the occurrence of the particles, such as the slime or the like, which are generated on the anode side in the plating bath.
    Type: Application
    Filed: March 25, 2011
    Publication date: March 28, 2013
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kiyotaka Nakaya, Koichi Kita, Satoshi Kumagai, Naoki Kato, Mami Watanabe
  • Patent number: 8105424
    Abstract: A hydrogen permeation/separation thin membrane including a Ni—Ti—Nb alloy. The Ni—Ti—Nb alloy is a cast foil material obtained by roll quenching and a refining heat treatment. The membrane has a thickness of 0.07 mm or less. The Ni—Ti—Nb alloy has the following: (a) a composition consisting of 10 to 47 atomic % of Nb, 20 to 52 atomic % of Ti, and a remainder containing 20 to 48 atomic % of Ni and inevitable impurities; and (b) an alloy structure where fine particles of a Nb-based solid solution alloy, in which Nb forms a solid solution with Ni and Ti in Nb, are dispersed in a basic structure made of a Ni—Ti(Nb) intermetallic compound formed of a solid solution of a Ni—Ti intermetallic compound, in which part of Ti thereof is replaced by Nb.
    Type: Grant
    Filed: March 8, 2007
    Date of Patent: January 31, 2012
    Assignee: Mitsubishi Materials Corporation
    Inventors: Koichi Kita, Kiyoshi Aoki, Kazuhiro Ishikawa
  • Publication number: 20110041964
    Abstract: Methods to enhance the quality of grain boundary networks are described. The process can result in the production of a metal including a relatively large fraction of special grain boundaries (e.g., a fraction of special grain boundaries of at least about 55%).
    Type: Application
    Filed: August 20, 2009
    Publication date: February 24, 2011
    Applicant: Massachusetts Institute of Technology
    Inventors: Christopher A. Schuh, Koichi Kita
  • Patent number: 7708809
    Abstract: A hydrogen permeable membrane which has an excellent high-temperature amorphous stability and a long lifetime under high-temperature heating operation and which can be miniaturized for use in a high-performance hydrogen purifier. The hydrogen permeable membrane is made of a non-crystalline nickel-zirconium alloy or zirconium-nickel alloy composed of 44 to 75 atom % of nickel or zirconium; and 0.2 to 16 atom % of aluminum, 0.2 to 12 atom % of vanadium and/or niobium, or 0.2 to 12 atom % of niobium and 0.1 to 10 atom % of phosphorus (provided that the combined amount of niobium and phosphorus is not more than 18 atom %); with the balance being zirconium or nickel and unavoidable impurities.
    Type: Grant
    Filed: November 20, 2003
    Date of Patent: May 4, 2010
    Assignee: Mitsubishi Materials Corporation
    Inventors: Koichi Kita, Shigeki Hara, Naotsugu Itoh
  • Publication number: 20090162235
    Abstract: The invention provides a medical device in which a metallic porous body is joined to at least a part of a surface of the main body of a medical device, and a surface modification method for the medical device. The metallic porous body is formed in multilayers.
    Type: Application
    Filed: December 5, 2006
    Publication date: June 25, 2009
    Applicant: Mitsubishi Materials Corporation
    Inventors: Koichi Kita, Komei Kato, Akiko Yamamoto, Junzo Tanaka
  • Publication number: 20090056549
    Abstract: A hydrogen permeation/separation thin membrane including an Ni—Ti—Nb alloy, the Ni—Ti—Nb alloy being a cast foil material obtained by roll quenching and having a thickness of 0.07 mm or less, which has been subjected to a refining heat treatment, and the Ni—Ti—Nb alloy having the following composition (a) and alloy structure (b): (a) a composition consisting of 10 to 47 atomic % of Nb, 20 to 52 atomic % of Ti, and a remainder containing 20 to 48 atomic % of Ni and inevitable impurities; and (b) an alloy structure where fine particles of an Nb-based solid solution alloy formed of a solid solution of Ni and Ti in Nb are dispersed in a microstructure made of an Ni—Ti(Nb) intermetallic compound formed of a solid solution of an Ni—Ti intermetallic compound, in which part of Ti thereof is replaced by Nb; and a hydrogen permeation/separation thin membrane including an Nb—Ti—Ni alloy, the Nb—Ti—Ni alloy being a cast foil material obtained by roll quenching and having a thickness of 0.
    Type: Application
    Filed: March 8, 2007
    Publication date: March 5, 2009
    Applicants: Mitsubishi Materials Corporation, National University Corporation Kitami Institute of Technology
    Inventors: Koichi Kita, Kiyoshi Aoki, Kazuhiro Ishikawa
  • Publication number: 20090031737
    Abstract: A refrigerant circuit (20) includes a low stage compressor (101, 102, 121, 122), a high stage compressor (41, 42, 43), an outdoor heat exchanger (44) and a utilization side heat exchanger (83, 93). During a defrosting operation of the refrigeration system (10), the high stage compressor (41, 42, 43) is driven. Refrigerant discharged from the high stage compressor (41, 42, 43) is pumped into the utilization side heat exchanger (83, 93) to heat frost on it from its inside. Thereafter, the refrigerant evaporates in the outdoor heat exchanger (44), is then compressed by the high stage compressor (41, 42, 43) and is sent again to the utilization side heat exchanger (83, 93).
    Type: Application
    Filed: July 3, 2006
    Publication date: February 5, 2009
    Inventors: Takeo Ueno, Masaaki Takegami, Koichi Kita, Kenji Tanimoto, Yoshinari Oda, Kazuyoshi Nomura, Azuma Kondo
  • Patent number: 7305846
    Abstract: In a refrigerant circuit (20), a refrigerator circuit (110) and a freezing circuit (30) are connected in parallel to an outdoor circuit (40). In the freezing circuit (30), a freezer circuit (130) and a booster circuit (140) are connected in series. A booster compressor (141) and a four-way switch valve (142) are provided in the booster circuit (140). During the time when a freezer heat exchanger (131) performs cooling operation for cooling the inside air, refrigerant evaporated in the freezer heat exchanger (131) is compressed in the booster compressor (141), and then, is sucked into a variable capacitance compressor (41). On the other hand, during defrosting of the freezer heat exchanger (131), the refrigerant evaporated in a refrigerator heat exchanger (111) is compressed in the booster compressor (141), and then, is supplied to the freezer heat exchanger (131).
    Type: Grant
    Filed: May 28, 2004
    Date of Patent: December 11, 2007
    Assignee: Daikin Industries, Ltd.
    Inventors: Takeo Ueno, Masaaki Takegami, Hiroto Nakajima, Koichi Kita
  • Publication number: 20060272345
    Abstract: In a refrigerant circuit (20), a refrigerator circuit (110) and a freezing circuit (30) are connected in parallel to an outdoor circuit (40). In the freezing circuit (30), a freezer circuit (130) and a booster circuit (140) are connected in series. A booster compressor (141) and a four-way switch valve (142) are provided in the booster circuit (140). During the time when a freezer heat exchanger (131) performs cooling operation for cooling the inside air, refrigerant evaporated in the freezer heat exchanger (131) is compressed in the booster compressor (141), and then, is sucked into a variable capacitance compressor (41). On the other hand, during defrosting of the freezer heat exchanger (131), the refrigerant evaporated in a refrigerator heat exchanger (111) is compressed in the booster compressor (141), and then, is supplied to the freezer heat exchanger (131).
    Type: Application
    Filed: May 28, 2004
    Publication date: December 7, 2006
    Inventors: Takeo Ueno, Masaaki Takegami, Hiroto Nakajima, Koichi Kita
  • Publication number: 20060213368
    Abstract: A hydrogen permeable membrane which has an excellent high-temperature amorphous stability and a long lifetime under high-temperature heating operation and which can be miniaturized for use in a high-performance hydrogen purifier. The hydrogen permeable membrane is made of a non-crystalline nickel-zirconium alloy or zirconium-nickel alloy composed of 44 to 75 atom % of nickel or zirconium; and 0.2 to 16 atom % of aluminum, 0.2 to 12 atom % of vanadium and/or niobium, or 0.2 to 12 atom % of niobium and 0.1 to 10 atom % of phosphorus (provided that the combined amount of niobium and phosphorus is not more than 18 atom %); with the balance being zirconium or nickel and unavoidable impurities.
    Type: Application
    Filed: November 20, 2003
    Publication date: September 28, 2006
    Applicants: Mitsubishi Materials Corporation, National Institute of Advanced Industrial Science and Technology
    Inventors: Koichi Kita, Shigeki Hara, Naotsugu Itoh
  • Patent number: 6739143
    Abstract: A refrigerant circuit (10) is formed by connecting, in series and in the order given, a compressor (11), a four-way selector valve (12), an outdoor heat exchanger (13), an expansion valve (14), and an indoor heat exchanger (15) by a gas side pipe (31) and a liquid side pipe (32). The refrigerant circuit (10) is charged with an R32 single refrigerant or with an R32/R125 mixed refrigerant in which R32 is present in an amount of not less than 75 wt. %. A dg/dl ratio, which is the ratio of the inside diameter dg of the gas side pipe (31) to the inside diameter dl of the liquid side pipe (32), is so set as to fall in the range of 2.1 to 3.5 when the cooling rated capacity is more than 5 kW but not more than 9 kW whereas when the cooling rated capacity is not more than 5 kW or more than 9 kW the dg/dl ratio is so set as to fall in the range of 2.6 to 3.5.
    Type: Grant
    Filed: August 30, 2001
    Date of Patent: May 25, 2004
    Assignee: Daikin Industries, Ltd.
    Inventors: Koichi Kita, Ryuzaburo Yajima
  • Patent number: 6615597
    Abstract: A bridge circuit (11) having four check valves (31, 32, 33, 34) is provided upstream of a receiver (10), which is provided upstream of an expansion valve (7). A gas vent pipe (12) for connecting the receiver (10) and a pipe (24) downstream of the expansion valve (7) to each other is provided, and the gas vent pipe (12) is provided with a gas vent valve (13). Upon shut down, the gas vent valve (13) is opened, and the expansion valve (7) is gradually closed. The compressor (4) is shut down and the gas vent valve (13) is closed after passage of a predetermined time from the point in time when the expansion valve (7) reaches the fully closed state.
    Type: Grant
    Filed: June 15, 2001
    Date of Patent: September 9, 2003
    Assignee: Daikin Industries, Ltd.
    Inventors: Nobuo Domyo, Koichi Kita
  • Patent number: 6569347
    Abstract: There are provided a refrigerating machine oil which can easily remove a sludge generated in a refrigerant circuit and is easy to return to a compressor and a refrigerator employing the same. A refrigerating machine oil obtained by mixing an alkylbenzene oil and an ether oil is employed in a refrigerant circuit. A sludge generated on an inner surface of a small-diameter portion of a capillary (4) is exfoliated and removed by the alkylbenzene oil while maintaining lubricating performance of a compressor (1) with the ether oil that is well dissolved in an HFC refrigerant, thereby preventing capillary clogging.
    Type: Grant
    Filed: June 26, 1998
    Date of Patent: May 27, 2003
    Assignee: Daikin Industries, Ltd.
    Inventors: Ryuzaburo Yajima, Koichi Kita, Shigeharu Taira, Youichi Oonuma, Masaki Nomura
  • Patent number: 6477848
    Abstract: A compressor (11), a four-way switching valve (12), an outdoor heat exchanger (13), an expansion valve (14) and an indoor heat exchanger (15) are sequentially connected together through gas piping (31) and liquid piping (32), thereby forming a refrigerant circuit (10). The refrigerant circuit (10) is filled with an R32 single refrigerant or an R32/R125 mixed refrigerant containing at least 75% by weight of R32. Synthetic oil is used as refrigerating machine oil. When the rated cooling capacity is 5 kW or less, the liquid piping (32) is formed from piping having an inner diameter of less than 4.75 mm.
    Type: Grant
    Filed: August 30, 2001
    Date of Patent: November 12, 2002
    Assignee: Daikin Industries, Ltd.
    Inventors: Nobuo Domyo, Koichi Kita