Abstract: A waveguide connection structure consists of a waveguide chip having a waveguide, and a connector having a groove dug in a thickness direction, the waveguide chip and the connector each having a concave-convex portion that fit into each other in a state of being adjacent to each other on the same plane.

Abstract: An embodiment lens structure body includes a microlens portion of double-sided asymmetric aspherical shape having a refraction surface on an illuminant side and a refraction surface on an emission side so as to be opposed to the refraction surface, and marker portions formed so as to be joined to both ends of the microlens portion in a direction perpendicular to an optical axis.

Abstract: An optical connection structure includes a waveguide substrate; a Si waveguide formed on one surface of the waveguide substrate 100 and having a first end surface; an optical fiber having a second end surface facing the first end surface; a terrace section extending further toward the optical fiber side from an end portion on the optical fiber side of the waveguide substrate; and a support member formed on the terrace section, and including, on a top surface in a view from the terrace section, a recess c configured to support a lens.

Abstract: An optical connection structure 1 includes a waveguide substrate; a Si waveguide formed on one surface of the waveguide substrate and having a first end surface; an optical fiber having a second end surface facing the first end surface; a terrace section extending further toward the optical fiber side from an end portion on the optical fiber side of the waveguide substrate; and a lens disposed on the terrace section, and arranged on an optical axis connecting the first end surface and the second end surface.

Abstract: There is provided an optical connection structure in which an optical fiber and an optical semiconductor waveguide are easily connected with low loss. The present invention relates to an optical connection structure configured to connect an optical waveguide device and an optical fiber including cores having different refractive indexes, wherein an optical connection component using a planar lightwave circuit is bonded and fixed on an end surface of an input/output waveguide of the optical waveguide device, a value of a refractive index of a core of the planar lightwave circuit is between a value of the refractive index of the core of the optical waveguide device and a value of the refractive index of the core of the optical fiber, and the optical waveguide device and the optical fiber are optically connected via the planar lightwave circuit.

Abstract: Optical alignment between an optical waveguide device and an optical connection part is realized easily and at low cost. An optical circuit in which optical waveguides to be connected to optical fibers are formed includes: an alignment optical waveguide configured to be opposed to, on an optical waveguide edge face to which an optical connection part having guide holes for insertion of core wires of the optical fibers is to be fixed, a guide hole into which an alignment optical fiber is to be inserted; and a light path changing member configured to change a path of light to a vertical direction with respect to the optical axis direction of the core of the alignment optical waveguide.

Abstract: An embodiment optical body is provided in a propagation path of light between a Si waveguide and an optical fiber. The optical body changes a course of some of radiation mode light, which is emitted from the Si waveguide and propagates in a direction away from an optical axis thereof, to obtain waveguide mode light passing through itself. Thus, the amount of waveguide mode light incident on the optical fiber increases, and the coupling efficiency between the Si waveguide and the optical fiber is improved.

Abstract: An optical connection structure includes a first optical waveguide, a second optical waveguide, and an optical element. The first optical waveguide includes a first light incidence/emission end face (104) formed on one end side. In addition, the second optical waveguide includes a second light incidence/emission end face formed on one end side. One end side of the first optical waveguide and one end side of the second optical waveguide are arranged facing each other. The optical element is arranged in contact with the first light incidence/emission end face and the second light incidence/emission end face between the first optical waveguide and the second optical waveguide.

Abstract: An optical module according to the present invention includes: a first plasmonic waveguide having one end formed of a first metal layer formed over an end portion of a first substrate, and having another end connected to one end of a first optical waveguide; a second metal layer that is formed on a side surface continuous with the end portion of the first substrate and formed to be continuous with the first metal layer; a second substrate provided with a second plasmonic waveguide formed of a third metal layer; and a second optical waveguide that is connected to the second plasmonic waveguide and formed on the second substrate, wherein the second metal layer and a part of the third metal layer are joined together to connect the first substrate to the second substrate.

Abstract: Provided is an optical connection component that is constituted of a plate-shaped substrate configured to transmit light to be used, and a resin optical waveguide. The resin optical waveguide is constituted of a resin core formed with a resin through which light to be used passes. For example, the resin core is formed with a light-cured resin. The resin optical waveguide uses air surrounding the resin core as a cladding. The resin core has a folded back structure in which the resin core once separates from the surface of the substrate and then returns to the surface of the substrate, and is connected to each of a first input/output end and a second input/output end of the substrate.

Abstract: An optical connection structure includes a PLC that is an optical waveguide chip including an optical waveguide and at least one groove formed on a substrate, and at least one optical fiber that is fitted into the at least one groove of the PLC. The PLC includes the optical waveguide, at least one grating coupler that is optically connected to the optical waveguide, and the at least one groove formed at a position in a vicinity of the at least one grating coupler in a cladding layer in which the optical waveguide is formed. An optical fiber of the at least one optical fiber is fitted into a groove of the at least one groove such that an end surface of the optical fiber is located in a vicinity of a grating coupler of the at least one grating coupler, the optical fiber being optically connected to the grating coupler.

Abstract: A wavelength checker includes an optical waveguide chip. A known arrayed-waveguide diffraction grating is formed on the optical waveguide chip. The wavelength checker includes a light conversion unit made of a conversion material that converts infrared light into visible light. The light conversion unit is arranged on an output side of a plurality of first output waveguides of the optical waveguide chip to be capable of receiving light emitted from the plurality of first output waveguides. The light conversion unit is formed on a side surface of a support facing an output end surface of the optical waveguide chip. The support is fixed to a main board.

Abstract: An optical connection structure includes a first focus lens arranged between a first light incidence/emission end and an optical element, and a second focus lens arranged between a second light incidence/emission end and the optical element. The first focus lens and the second focus lens are arranged on an optical axis connecting the first light incidence/emission end and the second light incidence/emission end.

Abstract: A first optical waveguide layer and a second optical waveguide layer are optically connected by a resin optical waveguide composed of a resin core composed of a light-transmitting resin and a cladding composed of air surrounding the resin core. A hollow outer wall structure that houses the resin optical waveguide is provided. An enclosed space is provided inside the outer wall structure. The outer wall structure is disposed to bridge the gap between the first optical device and the second optical device.

Abstract: The optical module includes an extension circuit board and a front end flip-chip mounted on the extension circuit board. The front end includes a semiconductor amplifier chip that executes signal processing, and an optical semiconductor chip that includes at least one of a light emitting element and a light receiving element and is flip-chip mounted on the semiconductor amplifier chip. The extension circuit board has a recessed portion that can accommodate at least a part of the optical semiconductor chip. The semiconductor amplifier chip is flip-chip mounted on the extension circuit board in the state where the surface mounting the optical semiconductor chip faces the surface of the extension circuit board, and at least a part of the optical semiconductor chip is accommodated in the recessed portion.

Abstract: Provided is an optical fiber connection component in which an optical waveguide of a planar lightwave circuit and an optical fiber can be connected after a process using SMT and reflow mounting technology. The optical fiber connection component includes: a plurality of fiber guide holes into which optical fibers are insertable at intervals equal to intervals of a plurality of optical waveguides of the planar lightwave circuit; and grooves for demarcating an area provided with the plurality of fiber guide holes and an area coated with an adhesive in an end surface to be joined with the planar lightwave circuit. The plurality of optical waveguides and the plurality of fiber guide holes are respectively aligned and fixed to the planar lightwave circuit with the adhesive in advance.

Abstract: A connection structure of optical waveguide chips includes a base substrate (2003) in which grooves (2013) are formed, spacer optical fibers (2006) each disposed for a corresponding one of the grooves (2013) and fitted in the groove (2013) while partially projecting from the base substrate (2003), and silica-based PLCs (2001, 2002) that are a plurality of optical waveguide chips in each of which grooves (2007) fitted on the projecting portions of the spacer optical fibers (2006) are formed at positions of an optical waveguide layer (2008) facing the grooves (2013), and each of which is mounted on the base substrate (2003) while being supported by the spacer optical fibers (2006). The silica-based PLCs (2001, 2002) are mounted on the base substrate (2003) such that incident/exit end faces of the optical waveguide layers (2008) face each other.

Abstract: An optical module according to the present invention includes: a first plasmonic waveguide having one end formed of a first metal layer formed over an end portion of a first substrate, and having another end connected to one end of a first optical waveguide; a second metal layer that is formed on a side surface continuous with the end portion of the first substrate and formed to be continuous with the first metal layer; a second substrate provided with a second plasmonic waveguide formed of a third metal layer; and a second optical waveguide that is connected to the second plasmonic waveguide and formed on the second substrate, wherein the second metal layer and a part of the third metal layer are joined together to connect the first substrate to the second substrate.

Abstract: A first adhesive layer is provided to be in contact with an SSC. A second adhesive layer is provided to be in contact with an optical fiber. A lens structure is on an interface between the first adhesive layer and the second adhesive layer.

Abstract: There is provided an optical element mounted on a substrate and an optical coupling element mounted on the substrate. The optical coupling element includes a guide unit extending in a direction parallel to a plane of the substrate so as to fix an optical fiber. There is provided a mold resin layer formed on the substrate so as to cover the optical element and expose a side surface of the optical coupling element at one end of the guide unit. The optical element includes a light incidence/emission unit on a side surface perpendicular to the plane of the substrate, and the other end of the guide unit and the light incidence/emission unit are disposed to face each other.