Abstract: A connection structure for optical waveguide chips includes a silica-based PLC in which grooves are formed, spacer steel balls fitted in the grooves, and silica-based PLCs in which grooves into which the spacer steel balls to be fitted are formed, the silica-based PLCs being mounted on the silica-based PLC by being supported by the spacer steel balls. A conductor wire formed in the silica-based PLC and a conductor wire formed in the silica-based PLC are electrically connected to each other by a conductor film formed in the groove, the spacer steel balls and a conductor film formed in the groove.

Abstract: A connection structure of optical waveguide chips includes a base substrate (2003) in which grooves (2013) are formed, spacer optical fibers (2006) each disposed for a corresponding one of the grooves (2013) and fitted in the groove (2013) while partially projecting from the base substrate (2003), and silica-based PLCs (2001, 2002) that are a plurality of optical waveguide chips in each of which grooves (2007) fitted on the projecting portions of the spacer optical fibers (2006) are formed at positions of an optical waveguide layer (2008) facing the grooves (2013), and each of which is mounted on the base substrate (2003) while being supported by the spacer optical fibers (2006). The silica-based PLCs (2001, 2002) are mounted on the base substrate (2003) such that incident/exit end faces of the optical waveguide layers (2008) face each other.

Abstract: An optical fiber guide part fixes optical fibers optically connected to optical waveguides of an optical waveguide device and is adhesively fixed to the optical waveguide device. The optical fiber guide part includes a V-grooved substrate, in a surface of which plural V-grooves are formed in parallel to one another, a lid member fixed to a top of the V-grooved substrate such that the V-grooves are exposed in a neighborhood of at least that end face of the V-grooved substrate which is on a side of the optical waveguide device, and a lid member fixed to an exposed part of the V-grooves of the V-grooved substrate, pressing, from above, the optical fibers inserted in guide holes formed by the V-grooves and the lid member placed on the V-grooves.

Abstract: A signal processing circuit is provided that generates output signals to be output from spatially different output ports based on bit combinations of an input word consisting of a plurality of bit signals. A distributed memory, a ROM and a DAC in which the signal processing circuit is used are also provided. A recognition circuit includes a serial port to which a bit signal is input and 2N output ports recognizing an input N-bit word and corresponding uniquely to 2N bit combinations. Output ports of the recognition circuit are connected to 2N input ports of an electric circuit. With no signal input to the recognition circuit, all outputs are constantly in a Low level state. In a case where a bit signal is input to the serial port of the recognition circuit, only one of the output ports corresponding to the bit combinations turns to a High level state.

Abstract: A connection structure of optical waveguide chips includes a base substrate (2003) in which grooves (2013) are formed, spacer optical fibers (2006) each disposed for a corresponding one of the grooves (2013) and fitted in the groove (2013) while partially projecting from the base substrate (2003), and silica-based PLCs (2001, 2002) that are a plurality of optical waveguide chips in each of which grooves (2007) fitted on the projecting portions of the spacer optical fibers (2006) are formed at positions of an optical waveguide layer (2008) facing the grooves (2013), and each of which is mounted on the base substrate (2003) while being supported by the spacer optical fibers (2006). The silica-based PLCs (2001, 2002) are mounted on the base substrate (2003) such that incident/exit end faces of the optical waveguide layers (2008) face each other.

Abstract: A signal processing circuit is provided that generates output signals to be output from spatially different output ports based on bit combinations of an input word consisting of a plurality of bit signals. A distributed memory, a ROM and a DAC in which the signal processing circuit is used are also provided. A recognition circuit includes a serial port to which a bit signal is input and 2N output ports recognizing an input N-bit word and corresponding uniquely to 2N bit combinations. Output ports of the recognition circuit are connected to 2N input ports of an electric circuit. With no signal input to the recognition circuit, all outputs are constantly in a Low level state. In a case where a bit signal is input to the serial port of the recognition circuit, only one of the output ports corresponding to the bit combinations turns to a High level state.

Abstract: Even in the case of an optical module including a multi-chip integrated device, an optical module having a smaller size in consideration of the connection to optical fibers. An optical module having a package containing a multi-chip integrated device integrated with an optical functional element having both ends connected to planar lightwave circuits (PLCs) is provided. Each of the PLCs includes a folded waveguide for connecting a light waveguide formed in the optical functional element to optical fibers. The optical module comprises a connecting part connected to each of the PLCs for connecting the optical functional element to the optical fibers in the same face. The optical fibers are taken out from opposed surfaces of the package.

Abstract: Even in the case of an optical module including a multi-chip integrated device, an optical module having a smaller size in consideration of the connection to optical fibers. An optical module having a package containing a multi-chip integrated device integrated with an optical functional element having both ends connected to planar lightwave circuits (PLCs) is provided. Each of the PLCs includes a folded waveguide for connecting a light waveguide formed in the optical functional element to optical fibers. The optical module comprises a connecting part connected to each of the PLCs for connecting the optical functional element to the optical fibers in the same face. The optical fibers are taken out from opposed surfaces of the package.