Abstract: A cylinder-shaped gas generator includes an elongated and circular cylindrical housing, a working gas generation chamber and a filter chamber provided within the housing, and an igniter. The working gas generation chamber mainly contains a dividing member and a granular gas generating agent. The dividing member has a circular cylindrical portion, a bottom portion and a hollow portion. The granular gas generating agent is stored in the portion of the working gas generation chamber excluding the hollow portion. The bottom portion of the dividing member is configured to have a tapered shape such that its outer shape is reduced in size in accordance with a decrease in the distance from the igniter.

Abstract: In a steering control apparatus, a worm gear is configured to have a lead angle for a self-lock operation, by which a worm wheel is allowed to rotate by rotation of a worm but the worm is not allowed to rotate by rotation of the worm wheel. Thus, a lock mechanism need not be provided separately from a gear mechanism and the apparatus is reduced in entire size. A VGRS control part checks whether the worm gear has a self-lock failure, which disables the self-lock operation. If the worm gear has the self-lock failure, idling suppression processing is performed to suppress idling of a steering wheel. Thus, even when the self-lock failure arises, the steering wheel is suppressed from idling.

Abstract: There is disclosed an antenna device including: a metal portion which has a surface; and a coil section which is provided above the surface of the metal portion and has an opening portion. Here, a surface of the coil section in which the opening portion is formed is approximately perpendicular to the surface of the metal portion, and the coil section is disposed in the vicinity of an edge of the metal portion.

Abstract: A VGRS device checks whether assist control of an EPS device for assisting steering operation of a steering wheel is being stopped. If the assist control of the EPS device is being stopped, a speed increase ratio is determined so that the rotation angle of the output shaft is less than the rotation angle of the input shaft. A VGRS motor is controlled and driven based on a determined speed increase ratio. Thus, steering operation of the steering wheel can be controlled appropriately so that the steering operation of the steering wheel can be continued with relatively small torque. It is less likely that a driver will erroneously feel that the steering wheel is locked.

Abstract: A semiconductor device includes a semiconductor element having a main surface where an outside connection terminal pad is provided. The semiconductor element is connected to a conductive layer on a supporting board via a plurality of convex-shaped outside connection terminals provided on the outside connection terminal pad and a connection member; and the connection member commonly covers the convex-shaped outside connection terminals.

Abstract: A semiconductor device includes a semiconductor element having a main surface where an outside connection terminal pad is provided. The semiconductor element is connected to a conductive layer on a supporting board via a plurality of convex-shaped outside connection terminals provided on the outside connection terminal pad and a connection member; and the connection member commonly covers the convex-shaped outside connection terminals.

Abstract: An antenna apparatus includes a base member that has an antenna unit and a loop pattern. The loop pattern is wound in such a manner that a magnetic field of the loop pattern is generated along the same direction as that of the antenna unit. Additionally, the loop pattern is formed by a plurality of loops connected parallel to each other.

Abstract: In a motor drive apparatus having two power supply systems for a motor, output phase currents supplied from inverters and detected by current sensors are added. Sums of the phase currents are fed back to a 3-2 phase conversion section and converted into a d-axis current and a q-axis current. A 2-3 phase conversion section outputs the same three-phase voltage command values to the inverters. Thus, the 3-2 phase conversion section and the 2-3 phase conversion section are both reduced to 1 in number, which is less than 2 of the inverters.

Abstract: In a multi-system motor drive apparatus, a power supply relay is interrupted when a first power supply system fails at time t0. A power control unit doubles a current supplied to an inverter of a second power supply system thereby to supplement the electric power, which has been supplied by an inverter of the first power supply system. The total output of inverters is thus maintained before and after the failure. After an elapse of a predetermined period, the electric power supplied by the second power supply system is reduced gradually so that the inverter of the second power supply system will not be operated to supply the doubled power for a long period.

Abstract: An antenna has a base substrate 3, a coil 30 formed from a conductor 4 wound around the base substrate 3, and a plurality of terminals 5 connected to the conductor 4. Uncovered base substrate portions 31 where the conductor is absent are formed on the base substrate 3 except the start and end of turns of the coil 30. The terminals 5 are provided on respective sides of the coil 30 parallel to a coil axis and on the uncovered base substrate portions 31.

Abstract: An antenna unit includes a loop antenna 1; a metallic element 6 provided on one side of an aperture area of the loop antenna 1; and a coil 2 inserted into a line of the loop antenna 1. A coil axis of the coil 2 is parallel to the aperture area of the loop antenna 1 and not parallel to a direction of an electric current flowing through portions of the line of the loop antenna 1 before and after a point where the coil 2 is inserted.

Abstract: A relay board provided in a semiconductor device includes a first terminal, and a plurality of second terminals connecting to the first terminal by a wiring. The wiring connecting to the first terminal is split on the way so that the wiring connects to each of the second terminals.

Abstract: An antenna unit includes an antenna formed on a magnetic sheet. A transmission circuit includes an inductor, a matching capacitor, and the antenna connected in series, and a reception circuit includes the antenna, the matching capacitor, a resistor, and a capacitor connected in series. The antenna is formed as one turn, and the size of the antenna and the resistor involves a predetermined relationship.

Abstract: A bending apparatus (1) is for bending a workpiece (object to be worked), using a bending die (2) formed in accordance with a bent form of the workpiece, and a linear die (3) linearly extended, and includes a table (10) having a work face (11a) where the bending die (2) and the linear die (3) are placed; and a pair of rollers (40, 50) configured to move along the work face (11a), wherein each of the rollers (40, 50) is configured to move from one end side of the bending die (2) and the linear die (3) to the other end side thereof in a state of pinching the bending die (2) and the linear die (3) in a die closing direction. According to this configuration, it is possible to configure the bending apparatus (1), to make a work space small, and to improve the work efficiency of the bending.

Abstract: The present invention provides a method for manufacturing a semiconductor device which includes at least supplying an adhesive for bonding an electronic component which has a plurality of bumps with a substrate which has a plurality of bonding pads corresponding to the bumps, to at least a portion of the substrate, between the electronic component and the substrate, flow-casting the adhesive on the substrate by a flow-casting unit, in such a manner that the expression S1/S0>1 is satisfied, where S0 is the total contact surface area with the substrate of the adhesive supplied to the substrate, and S1 is the total contact surface area with the substrate of the adhesive after the flow-casting, and curing the adhesive while making the adhesive contact with the electronic component and the substrate in a state where the bumps are abutted against the bonding pads.

Abstract: An antenna apparatus is featured by that a base member 4 has an antenna unit 3 and a loop pattern 2 wound in such a manner that a magnetic field of the loop pattern 2 is generated along the same direction as that of the antenna unit 2, and the loop pattern 2 has been formed by a plurality of loops connected parallel to each other.

Abstract: An armature includes an armature core, a rotary shaft inserted into a shaft fixing hole of the armature core, and coils each wound about one of teeth of the armature core. The teeth extend radially. The armature core includes an inner core having the shaft fixing hole, and an outer core that is provided about and is integrated with the inner core. The inner core is formed by laminating a plurality of magnetic steel plates. The outer core is formed by compression molding magnetic powder, and includes the teeth. Accordingly, the armature core has a high mechanical strength and is capable of obtaining a high magnetic flux density. Also, the armature core is easy to manufacture.

Abstract: The present invention provides a method for manufacturing a semiconductor device which includes at least supplying an adhesive for bonding an electronic component which has a plurality of bumps with a substrate which has a plurality of bonding pads corresponding to the bumps, to at least a portion of the substrate, between the electronic component and the substrate, flow-casting the adhesive on the substrate by a flow-casting unit, in such a manner that the expression S1/S0>1 is satisfied, where S0 is the total contact surface area with the substrate of the adhesive supplied to the substrate, and S1 is the total contact surface area with the substrate of the adhesive after the flow-casting, and curing the adhesive while making the adhesive contact with the electronic component and the substrate in a state where the bumps are abutted against the bonding pads.

Abstract: A relay board provided in a semiconductor device includes a first terminal, and a plurality of second terminals connecting to the first terminal by a wiring. The wiring connecting to the first terminal is split on the way so that the wiring connects to each of the second terminals.

Abstract: A semiconductor device includes a semiconductor element having a main surface where an outside connection terminal pad is provided. The semiconductor element is connected to a conductive layer on a supporting board via a plurality of convex-shaped outside connection terminals provided on the outside connection terminal pad and a connection member; and the connection member commonly covers the convex-shaped outside connection terminals.