Patents by Inventor Kuang-Yuan Hsu
Kuang-Yuan Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11063181Abstract: A patterned epitaxial substrate includes a substrate and a plurality of patterns. The substrate has a first zone and a second zone surrounding the first zone. The first zone and the second zone are disposed in a concentric manner. The patterns and the substrate are integrally formed, and the patterns are disposed on the substrate. The patterns include a plurality of first patterns and a plurality of second patterns. The first patterns are disposed in the first zone. The second patterns are disposed in the second zone. Sizes of the first patterns are different from sizes of the second patterns.Type: GrantFiled: October 31, 2019Date of Patent: July 13, 2021Assignee: PlayNitride Display Co., Ltd.Inventors: Kuang-Yuan Hsu, Chien-Chih Yen, Yen-Lin Lai
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Patent number: 11053584Abstract: Systems and methods for supplying a precursor material for an atomic layer deposition (ALD) process are provided. A gas supply provides one or more precursor materials to a deposition chamber. The deposition chamber receives the one or more precursor materials via an input line. A gas circulation system is coupled to an output line of the deposition chamber. The gas circulation system includes a gas composition detection system configured to produce an output signal indicating a composition of a gas exiting the deposition chamber through the output line. The gas circulation system also includes a circulation line configured to transport the gas exiting the deposition chamber to the input line. A controller is coupled to the gas supply. The controller controls the providing of the one or more precursor materials by the gas supply based on the output signal of the gas composition detection system.Type: GrantFiled: October 14, 2019Date of Patent: July 6, 2021Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Bor-Chiuan Hsieh, Chien-Kuo Huang, Tai-Chun Huang, Kuang-Yuan Hsu, Tze-Liang Lee
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Publication number: 20200411310Abstract: A method of descumming a dielectric layer is provided. In an embodiment the dielectric layer is deposited over a substrate, and a photoresist is applied, exposed, and developed after the photoresist has been applied. Once the pattern of the photoresist is transferred to the underlying dielectric layer, a descumming process is performed, wherein the descumming process utilizes a mixture of a carbon-containing precursor, a descumming precursor, and a carrier gas. The mixture is ignited into a treatment plasma, and the treatment plasma is applied to the dielectric layer in order to descum the dielectric layer.Type: ApplicationFiled: September 14, 2020Publication date: December 31, 2020Inventors: Wan-Yi Kao, Kuang-Yuan Hsu, Tze-Liang Lee
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Patent number: 10867789Abstract: A treatment, structure and system are provided that modify the deposition process of a material that can occur over two differing materials. In an embodiment the deposition rates may be adjusted by the treatment to change the deposition rate of one of the materials to be more in line with the deposition rate of a second one of the materials. Also, the deposition rates may be modified to be different from each other, to allow for a more selective deposition over the first one of the materials than over the second one of the materials.Type: GrantFiled: July 31, 2018Date of Patent: December 15, 2020Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wan-Yi Kao, Kuang-Yuan Hsu
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Publication number: 20200373460Abstract: A patterned epitaxial substrate includes a substrate and a plurality of patterns. The substrate has a first zone and a second zone surrounding the first zone. The first zone and the second zone are disposed in a concentric manner. The patterns and the substrate are integrally formed, and the patterns are disposed on the substrate. The patterns include a plurality of first patterns and a plurality of second patterns. The first patterns are disposed in the first zone. The second patterns are disposed in the second zone. Sizes of the first patterns are different from sizes of the second patterns.Type: ApplicationFiled: October 31, 2019Publication date: November 26, 2020Applicant: PlayNitride Display Co., Ltd.Inventors: Kuang-Yuan Hsu, Chien-Chih Yen, Yen-Lin Lai
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Publication number: 20200350473Abstract: A micro light-emitting device includes an epitaxial structure layer, a first-type electrode, a second-type electrode, and a light guide structure. The epitaxial structure layer has a top surface and a bottom surface opposite to each other and a plurality of first grooves located on the top surface. The first-type electrode and the second-type electrode separated from each other are disposed on the epitaxial structure layer and located at the bottom surface. The light guide structure is disposed on the epitaxial structure layer. The light guide structure covers a portion of the top surface and a portion of inner walls of the first grooves to define a plurality of second grooves corresponding to the portion of the first grooves.Type: ApplicationFiled: October 31, 2019Publication date: November 5, 2020Applicant: PlayNitride Display Co., Ltd.Inventors: Kuang-Yuan Hsu, Chien-Chih Yen, Yen-Lin Lai
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Publication number: 20200350416Abstract: A semiconductor device includes a source/drain region, a source/drain silicide layer formed on the source/drain region, and a first contact disposed over the source/drain silicide layer. The first contact includes a first metal layer, an upper surface of the first metal layer is at least covered by a silicide layer, and the silicide layer includes a same metal element as the first metal layer.Type: ApplicationFiled: July 13, 2020Publication date: November 5, 2020Inventors: Chia-Ming HSU, Pei-Yu CHOU, Chih-Pin TSAO, Kuang-Yuan HSU, Jyh-Huei CHEN
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Patent number: 10796898Abstract: A method of descumming a dielectric layer is provided. In an embodiment the dielectric layer is deposited over a substrate, and a photoresist is applied, exposed, and developed after the photoresist has been applied. Once the pattern of the photoresist is transferred to the underlying dielectric layer, a descumming process is performed, wherein the descumming process utilizes a mixture of a carbon-containing precursor, a descumming precursor, and a carrier gas. The mixture is ignited into a treatment plasma, and the treatment plasma is applied to the dielectric layer in order to descum the dielectric layer.Type: GrantFiled: January 6, 2020Date of Patent: October 6, 2020Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wan-Yi Kao, Kuang-Yuan Hsu, Tze-Liang Lee
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Publication number: 20200251567Abstract: A method includes forming a trench over a substrate, wherein the trench is surrounded by gate spacers and an inter-layer dielectric layer, depositing a dielectric layer on a bottom and along sidewalls of the trench, depositing a metal layer over the dielectric layer, depositing a protection layer over the metal layer, wherein the protection layer has an uneven thickness, applying an etch-back process to the protection layer and the metal layer, wherein as a result of applying the etch-back process, a portion of the metal layer has been removed and at least a portion of the protection layer remains at the bottom of the trench and removing the protection layer from the trench.Type: ApplicationFiled: April 23, 2020Publication date: August 6, 2020Inventors: Peng-Soon Lim, Da-Yuan Lee, Kuang-Yuan Hsu
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Patent number: 10714586Abstract: A semiconductor device includes a source/drain region, a source/drain silicide layer formed on the source/drain region, and a first contact disposed over the source/drain silicide layer. The first contact includes a first metal layer, an upper surface of the first metal layer is at least covered by a silicide layer, and the silicide layer includes a same metal element as the first metal layer.Type: GrantFiled: July 30, 2018Date of Patent: July 14, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chia-Ming Hsu, Pei-Yu Chou, Chih-Pin Tsao, Kuang-Yuan Hsu, Jyh-Huei Chen
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Publication number: 20200152449Abstract: A method of descumming a dielectric layer is provided. In an embodiment the dielectric layer is deposited over a substrate, and a photoresist is applied, exposed, and developed after the photoresist has been applied. Once the pattern of the photoresist is transferred to the underlying dielectric layer, a descumming process is performed, wherein the descumming process utilizes a mixture of a carbon-containing precursor, a descumming precursor, and a carrier gas. The mixture is ignited into a treatment plasma, and the treatment plasma is applied to the dielectric layer in order to descum the dielectric layer.Type: ApplicationFiled: January 6, 2020Publication date: May 14, 2020Inventors: Wan-Yi Kao, Kuang-Yuan Hsu, Tze-Liang Lee
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Patent number: 10651283Abstract: A method includes forming a trench over a substrate, wherein the trench is surrounded by gate spacers and an inter-layer dielectric layer, depositing a dielectric layer on a bottom and along sidewalls of the trench, depositing a metal layer over the dielectric layer, depositing a protection layer over the metal layer, wherein the protection layer has an uneven thickness, applying an etch-back process to the protection layer and the metal layer, wherein as a result of applying the etch-back process, a portion of the metal layer has been removed and at least a portion of the protection layer remains at the bottom of the trench and removing the protection layer from the trench.Type: GrantFiled: April 18, 2019Date of Patent: May 12, 2020Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Peng-Soon Lim, Da-Yuan Lee, Kuang-Yuan Hsu
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Publication number: 20200126985Abstract: A semiconductor device with a metal gate is disclosed. An exemplary semiconductor device with a metal gate includes a semiconductor substrate, source and drain features on the semiconductor substrate, a gate stack over the semiconductor substrate and disposed between the source and drain features. The gate stack includes a HK dielectric layer formed over the semiconductor substrate, a plurality of barrier layers of a metal compound formed on top of the HK dielectric layer, wherein each of the barrier layers has a different chemical composition; and a stack of metals gate layers deposited over the plurality of barrier layers.Type: ApplicationFiled: December 19, 2019Publication date: April 23, 2020Inventors: Xiong-Fei Yu, Chun-Yuan Chou, Kuang-Yuan Hsu, Da-Yuan Lee, Jeff J. Xu
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Publication number: 20200083109Abstract: A cut-last process for cutting fin segments of a FinFET structure on a substrate utilizes a two-step process. After the fins are formed, an oxide material is deposited in the trenches of the FinFET structure. The oxide material can be an STI oxide or a low-stress dummy gapfill material. A fin segment can be removed by an etchant and can leave a concave shaped (such as a u-shape or v-shape) portion of silicon at the bottom of the fin. Where the oxide material is an STI oxide, the void left by removing the fin can be filled with replacement STI oxide. Where the oxide material is a dummy gapfill material, the dummy gapfill material can be removed and replaced with an STI oxide or converted to an STI oxide and filled with replacement STI oxide before or after the conversion.Type: ApplicationFiled: November 15, 2019Publication date: March 12, 2020Inventors: Yen-Chun Huang, Chih-Tang Peng, Kuang-Yuan Hsu, Tai-Chun Huang, Tsu-Hsiu Perng, Tien-I Bao
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Publication number: 20200040450Abstract: Systems and methods for supplying a precursor material for an atomic layer deposition (ALD) process are provided. A gas supply provides one or more precursor materials to a deposition chamber. The deposition chamber receives the one or more precursor materials via an input line. A gas circulation system is coupled to an output line of the deposition chamber. The gas circulation system includes a gas composition detection system configured to produce an output signal indicating a composition of a gas exiting the deposition chamber through the output line. The gas circulation system also includes a circulation line configured to transport the gas exiting the deposition chamber to the input line. A controller is coupled to the gas supply. The controller controls the providing of the one or more precursor materials by the gas supply based on the output signal of the gas composition detection system.Type: ApplicationFiled: October 14, 2019Publication date: February 6, 2020Inventors: Bor-Chiuan Hsieh, Chien-Kuo Huang, Tai-Chun Huang, Kuang-Yuan Hsu, Tze-Liang Lee
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Patent number: 10529553Abstract: A method of descumming a dielectric layer is provided. In an embodiment the dielectric layer is deposited over a substrate, and a photoresist is applied, exposed, and developed after the photoresist has been applied. Once the pattern of the photoresist is transferred to the underlying dielectric layer, a descumming process is performed, wherein the descumming process utilizes a mixture of a carbon-containing precursor, a descumming precursor, and a carrier gas. The mixture is ignited into a treatment plasma, and the treatment plasma is applied to the dielectric layer in order to descum the dielectric layer.Type: GrantFiled: May 1, 2019Date of Patent: January 7, 2020Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Wan-Yi Kao, Kuang-Yuan Hsu, Tze-Liang Lee
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Publication number: 20200006061Abstract: A treatment, structure and system are provided that modify the deposition process of a material that can occur over two differing materials. In an embodiment the deposition rates may be adjusted by the treatment to change the deposition rate of one of the materials to be more in line with the deposition rate of a second one of the materials. Also, the deposition rates may be modified to be different from each other, to allow for a more selective deposition over the first one of the materials than over the second one of the materials.Type: ApplicationFiled: September 13, 2019Publication date: January 2, 2020Inventors: Wan-Yi Kao, Kuang-Yuan Hsu
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Patent number: 10522544Abstract: A semiconductor device with a metal gate is disclosed. An exemplary semiconductor device with a metal gate includes a semiconductor substrate, source and drain features on the semiconductor substrate, a gate stack over the semiconductor substrate and disposed between the source and drain features. The gate stack includes a HK dielectric layer formed over the semiconductor substrate, a plurality of barrier layers of a metal compound formed on top of the HK dielectric layer, wherein each of the barrier layers has a different chemical composition; and a stack of metals gate layers deposited over the plurality of barrier layers.Type: GrantFiled: May 1, 2019Date of Patent: December 31, 2019Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Xiong-Fei Yu, Chun-Yuan Chou, Kuang-Yuan Hsu, Da-Yuan Lee, Jeff J. Xu
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Patent number: 10483169Abstract: A cut-last process for cutting fin segments of a FinFET structure on a substrate utilizes a two-step process. After the fins are formed, an oxide material is deposited in the trenches of the FinFET structure. The oxide material can be an STI oxide or a low-stress dummy gapfill material. A fin segment can be removed by an etchant and can leave a concave shaped (such as a u-shape or v-shape) portion of silicon at the bottom of the fin. Where the oxide material is an STI oxide, the void left by removing the fin can be filled with replacement STI oxide. Where the oxide material is a dummy gapfill material, the dummy gapfill material can be removed and replaced with an STI oxide or converted to an STI oxide and filled with replacement STI oxide before or after the conversion.Type: GrantFiled: September 29, 2016Date of Patent: November 19, 2019Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yen-Chun Huang, Chih-Tang Peng, Kuang-Yuan Hsu, Tai-Chun Huang, Tsu-Hsiu Perng, Tien-I Bao
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Patent number: 10443127Abstract: Systems and methods for supplying a precursor material for an atomic layer deposition (ALD) process are provided. A gas supply provides one or more precursor materials to a deposition chamber. The deposition chamber receives the one or more precursor materials via an input line. A gas circulation system is coupled to an output line of the deposition chamber. The gas circulation system includes a gas composition detection system configured to produce an output signal indicating a composition of a gas exiting the deposition chamber through the output line. The gas circulation system also includes a circulation line configured to transport the gas exiting the deposition chamber to the input line. A controller is coupled to the gas supply. The controller controls the providing of the one or more precursor materials by the gas supply based on the output signal of the gas composition detection system.Type: GrantFiled: November 5, 2013Date of Patent: October 15, 2019Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Bor-Chiuan Hsieh, Chien-Kuo Huang, Tai-Chun Huang, Kuang-Yuan Hsu, Tze-Liang Lee