Abstract: A heat dissipation apparatus for effective dissipation of heat comprises an air flow module and a heat sink. The air flow module comprises a casing, a piston module slidably mounted in the casing, an airflow outlet module attached to a first side of the casing, and an electromagnet module attached to a second side of the casing that is opposite to the first side. The airflow outlet module comprises a plurality of airflow outlet grooves. The piston module comprises a magnet. The heat sink is aligned with the plurality of airflow outlet grooves. The electromagnet module is capable of moving the magnet and the piston module back and forth in the casing. The air flow module is capable of blowing air to the heat sink via the plurality of airflow outlet grooves.

Abstract: An evaporation-assisted heat dissipation apparatus includes a heat sink, a fan, and a spraying member. The spraying member includes a water tank, a water transmitting tube, and a plurality of water output tubes. The water tank accommodates a heat-dissipating liquid which flows to the tops of the plurality of water output tubes via the water transmitting tube. The convex meniscus which is formed at the top of each of the plurality of water output tubes is atomized and blown toward the heat sink by the fan and the droplets attach on the heat sink. The droplets are evaporated from the heat sink and remove heat from the heat sink by doing so.

Abstract: A heat dissipation system includes an enclosure, a first heat sink, a second heat sink, and a fan. The enclosure includes a bottom plate, a first side plate, and a second side plate. A first air vent area is located on the first side plate. A second air vent area is located on the second side plate. A first heat generation apparatus and a second heat generation apparatus is mounted on the bottom plate and located between the first air vent area and the second air vent area. A first heat sink is mounted on the bottom plate and contacts the first heat generation apparatus. A second heat sink is mounted on the bottom plate and contacts the second heat generation apparatus. A plurality of second fins is located on the second heat sink. Each second fin is wavy. A fan is located between the first air vent area and the second air vent area. The fan is adapted to drive air to flow through the first air vent area, the first heat sink, the plurality of second fins, and the second air vent area.

Abstract: An electronic device includes an enclosure, a heat sink, and a spray device. The spray device includes a water box, a pump member, and a spray member. The spray member connects to the pump member. A plurality of nozzles is defined in the spray member facing the heat sink. The pump member draws water from the water box and sprays the water to the heat sink through the spray member.

Abstract: An electronic device assembly includes an electronic device, an internal heat dissipating mechanism, an external heat dissipating mechanism, and the heat dissipating mechanism. The electronic device includes a bottom base, and the internal heat dissipating mechanism is secured inside the bottom base, to dissipate heat generated by the electronic device. The external heat dissipating mechanism is secured outside the bottom base. The heat conduction block is secured to the internal heat dissipating mechanism and contacts with the external heat dissipating mechanism. The heat conduction block directs heat from the internal heat dissipating mechanism, and the external heat dissipating mechanism directs heat from the heat conduction block, to increase the heat dissipating efficiency of the internal heat dissipating mechanism, to make the electronic device work in a proper temperature.

Abstract: A heat dissipating apparatus includes a rear cove, a fan rotatably attached to the rear cover, a slave gear secured to the fan, and a driving gear rotatably attached to the rear cover. The rear cover defines a plurality of air ventilation holes. The fan is aligned with the plurality of air ventilation holes. The driving gear meshes with the driven gear. A resilient member is secured to the driving member. The driving gear is rotatable in a first direction to deform the resilient member. The resilient member is released to rotate the driving gear in a second direction that is opposite to the first direction, and the slave gear and the fan are together rotatable in the second direction by the driving gear.

Abstract: A heat dissipation structure includes a heat sink having a base formed with four securing tabs laterally extending from four corners of the base. Four positioning posts upwardly protrude from a printed circuit board. Four spring clips are attached to the four positioning posts respectively. Each of the four spring clips has a resilient piece for exerting a downward force to press a corresponding securing tab, thereby securing the heat sink to the printed circuit board.

Abstract: The present disclosure provides a mounting assembly, which includes a data storage device and a bracket receiving the data storage device. Two locking portions are located on opposite sides of the data storage device. The bracket includes a first side plate and the second side plate, each defining a locking hole. The locking holes of the first side plate and the second side plate receive the two locking portions to secure the data storage device in the bracket.

Abstract: A pointing device includes an enclosure, a touch panel, and a securing panel. The enclosure includes an enclosure body, a first resisting portion and a second resisting portion extending from the enclosure body, and an elastic element mounted to the enclosure body. The touch panel is placed between the first resisting portion and the second resisting portion. The securing panel includes a panel body and a first resisting tab and a second resisting tab extending from the panel body. The first resisting tab is received in the first resisting portion, and the second resisting tab is received in the second resisting portion, thereby enabling the touch panel to be secured between the panel body and the enclosure body.

Abstract: A circuit board assembly includes a circuit board and a bracket of a heat sink. The bracket of the heat sink includes a pair of first securing feet and a pair of second securing feet opposite to the pair of first securing feet. A pair of first securing members is secured to the circuit board. A pair of second securing members is secured to the circuit board facing the pair of first securing members. The pair of first securing members includes a pair of elastic pieces which faces the pair of second securing members. The pair of first securing feet abuts against the pair of elastic pieces to elastically deform the pair of elastic pieces. The pair of elastic pieces exerts force on the bracket to push the pair of second securing feet to abut against the pair of second securing members.

Abstract: An optical disk drive includes a disk drive body and a storage device. The drive body includes a receiving bracket and a support tray received in the receiving bracket. The support tray is used for supporting a disk. The support tray includes a tray body. The tray body defines an inserting slot. The storage device includes a main body and an inserting head connected to the main body. The inserting head is received in the inserting slot. The optical disk drive has a storage device which can be used by people to copy data.

Abstract: A heat dissipation system includes a computer case has a base plate and a back plate, a heat sink, a second heat source, and an air partition panel. The back plate defines a plurality of first air outlet holes aligned with the heat sink, and a plurality of second air outlet holes aligned with the second heat source. The heat sink is positioned on the base plate in contact with a first heat source. The second heat source is positioned on the base plate adjacent to the base plate. The air partition panel is positioned on the base plate between the motherboard and the second heat source. A first air path is defined between the air partition panel and the plurality of first air outlet holes. A second air path is defined between the air partition panel and the plurality of second air outlet holes.

Abstract: An electronic device includes a circuit board and a heat sink . A heat generating part is located on the circuit board. Through holes are defined in the circuit board. The heat sink includes a main body and resilient pieces located on the main body. The resilient pieces includes a latching portion and a resisting portion located on the latching portion. The latching portion extends through the through hole to engage with the circuit board. The resisting portion is received in the through hole and abuts the circuit board. The main body closely abuts the heat generating part. The latching portion can be disengaged from the circuit board simply by squeezing the resisting portion.

Abstract: A heat dissipation structure includes a heat sink having a base formed with four securing tabs laterally extending from four corners of the base. Four positioning posts upwardly protrude from a printed circuit board. Four spring clips are attached to the four positioning posts respectively. Each of the four spring clips has a resilient piece for exerting a downward force to press a corresponding securing tab, thereby securing the heat sink to the printed circuit board.

Abstract: An electronic device includes a bottom plate, a cover plate, a dust collection box, and a dust cleaning apparatus. A heat sink is mounted in the bottom plate. The cover plate covers on the bottom plate. The cover plate defines a cutout. The dust collection box is placed on the bottom plate via the cutout. The dust cleaning apparatus is slidably mounted on the bottom plate. The dust cleaning apparatus moves relative to the heat sink to sweep dust of the heat sink into the dust collection box.

Abstract: A heat sink mounting device includes a touching plate and a mounting member. The touching plate defines a locking hole. The mounting member includes a locking post. The locking post includes a body and two protrusions protruding from the body. An inner surface of the locking hole defines two cutouts. The touching plate includes two blocking blocks extending from an edge of the locking hole on a bottom surface of the touching plate. The two protrusions extend out of the two cutouts and abut the bottom surface of the touching plate. One of the two protrusions is located between the two blocking blocks, to prevent the body from rotating freely in the locking hole.

Abstract: An electronic device includes a circuit board and a heat dissipating module. The circuit board includes a body and a first heat generating part located on the body. The body defines a through hole close to the first heat generating part. The heat dissipating module includes a heat pipe, a first heat dissipating piece attached to the heat pipe and a resilient piece. The resilient piece includes a securing portion secured to the first heat dissipating piece and a resilient arm. The resilient arm is engaged in the through hole to secure the first heat dissipating piece to the body. The first heat dissipating piece abuts the first heat generating part, and the resilient arm is elastically deformable to disengage from the through hole.

Abstract: A cooling device for cooling an electronic component is disclosed. The cooling device comprises a cooler comprising a base, a plurality of first fins and a plurality of second fins. The plurality of first fins extends substantially perpendicular from the base, and the plurality of second fins are secured to the base. Each of the plurality of second fins is between adjacent two of the plurality of first fins. Each of the plurality of second fins comprises a plurality of body portions and a plurality of connecting pieces. Each of the plurality of connecting pieces connects adjacent two of the plurality of body portions.

Abstract: A heat dissipation system includes an enclosure, a first heat sink, a second heat sink, and a fan. The enclosure includes a bottom plate, a first side plate, and a second side plate. A first air vent area is located on the first side plate. A second air vent area is located on the second side plate. A first heat generation apparatus and a second heat generation apparatus is mounted on the bottom plate and located between the first air vent area and the second air vent area. A first heat sink is mounted on the bottom plate and contacts the first heat generation apparatus. A second heat sink is mounted on the bottom plate and contacts the second heat generation apparatus. A plurality of second fins is located on the second heat sink. Each second fin is wavy. A fan is located between the first air vent area and the second air vent area. The fan is adapted to drive air to flow through the first air vent area, the first heat sink, the plurality of second fins, and the second air vent area.

Abstract: An enclosure of an electronic device includes a front panel including a plurality of first air guiding boards and a plurality of second air guiding boards. The plurality of first air guiding boards arrange a first air guiding layer, and the plurality of second air guiding boards arrange a second air guiding layer. A first gap is defined between adjacent two of the plurality of first air guiding boards, a second gap is defined between adjacent two of the plurality of second air guiding boards, and a third gap is defined between the first air guiding layer and the second air guiding layer. Each second air guiding board is located opposite to the first gap. An absorbing layer is placed on a side surface of each second air guiding board towards the first gap. The first gap communicates with the second gap and the third gap.