Abstract: A plurality of metal plates and an insulating plate having a polished surface are laminated in a probe supporting plate. Through-holes into which probes are to be inserted are respectively formed in the metal plates and the insulating plate. Diameters of the through-holes are greater than diameters of the through-holes, and the through-holes pass through the probe supporting plate in a thickness direction of the probe supporting plate. Hollow portions passing through the probe supporting plate in the thickness direction of the probe supporting plate are formed in the probe supporting plate. Each of the hollow portions is formed by connecting each of holes formed in each of the metal plates and each of holes formed in the insulating plate. Diameters of holes of a metal plate that is an uppermost layer, holes of a metal plate that is a lowermost player, and holes of a metal plate that is one of intermediate layers are less than diameters of holes of metal plates 30d that are the other intermediate layers.

Abstract: A probe method of this invention includes a step of reducing an electrode of a wafer by using a forming gas, and a step of bringing the electrode and a probe pin into contact with each other in a dry atmosphere. The probe method further includes, prior to a reducing process of an electrode of the object to be tested, placing the object to be tested in an inert gas atmosphere and heating the object to be tested. The reducing process is performed by bringing a reducing gas into contact with the electrode of the object to be tested under atmospheric pressure.

Abstract: A zero-point detecting method of this invention is performed prior to testing the electrical characteristics of a wafer by bringing an object to be tested on a stage and probes of a probe card into contact with each other. The surface of a zero-point detection plate is made of a conductive material (e.g., copper). The zero-point detection plate is used to detect a zero point as a position where the surface of the object to be tested comes into contact with the probe pins.

Abstract: A probe method of this invention includes a step of reducing an electrode of a wafer by using a forming gas, and a step of bringing the electrode and a probe pin into contact with each other in a dry atmosphere. The probe method further includes, prior to a reducing process of an electrode of the object to be tested, placing the object to be tested in an inert gas atmosphere and heating the object to be tested. The reducing process is performed by bringing a reducing gas into contact with the electrode of the object to be tested under atmospheric pressure.

Abstract: A zero-point detecting method of this invention is performed prior to testing the electrical characteristics of a wafer by bringing an object to be tested on a stage and probes of a probe card into contact with each other. The surface of a zero-point detection plate is made of a conductive material (e.g., copper). The zero-point detection plate is used to detect a zero point as a position where the surface of the object to be tested comes into contact with the probe pins.

Abstract: A temperature managing apparatus according to the invention comprises cooling jackets provided in each of a plurality of test containers, a tank for storing a cooling medium for the cooling jackets, first pumps, second pump, constant pressure valves for making constant the amount of the transferred cooling medium, and a heat exchanger. The tank has partitions that are horizontally and vertically movable. The partitions partition the interior of the tank into a first storage area, a second storage area, and a third area interposed therebetween.

Abstract: A temperature measuring unit of a wafer chuck measures the temperature of a wafer chuck when the wafer chuck holding a wafer W making in-unison contact with a contactor is made to contact a bottom jacket and the bottom jacket controls the wafer W to a specific test temperature. At least three recessed sections are formed in the back of the wafer chuck in such a manner that they have a depth extending from the back of the chuck to the vicinity of its surface. Through holes corresponding to the recessed sections are made in the bottom jacket. Temperature sensors that can be inserted into the through holes and in the recessed sections are provided on the side opposite to the wafer chuck of the bottom jacket. The sensors are supported by springs. During a test, the tips of the temperature sensors are caused to make elastic contact with the recessed sections.

Abstract: There is provided an inspection apparatus comprises, a transportation unit for transporting the object of inspection to a position opposite to the contact portion, a sucking holder movable toward and away from the contact portion and adapted to hold the object of inspection by suction; and a pressure contact mechanism provided separately from the transportation unit and adapted to press the sucking holder, thereby pressing the object of inspection against the contact portion. Thus the tranportation mechanism is separated from the pressure contact mechanism, the transportation mechanism can be reduced in weight, and the pressure contact mechanism can ensure setting of appropriate pressing. The operation time can be shortened, moreover, since the object of inspection is kept attached to the contact portion by the transportation mechanism as it is pressed against the contact portion.