Abstract: The present invention provides an electrolytic processing apparatus which is capable of increasing the in-plane uniformity of the film thickness of a plated film by making more uniform an electric field distribution over the entire surface to be processed of a substrate even if the substrate has a large area and controlling more uniformly the speed, over the entire surface to be processed of the substrate.

Abstract: There is provided an electrolytic solution supply and recovery facility which, in response to an increase in the production amount of an associated electrolytic processing apparatus, can efficiently supply and recover an electrolytic solution while enhancing the productivity and lowering the production cost. An electrolytic solution supply and recovery facility for supplying and recovering an electrolytic solution to and from an electrolytic processing apparatus, includes: a fresh liquid supply section for storing a fresh electrolytic solution, said electrolytic solution having been transferred from a carry-in container that has been carried in from the outside, and for supplying the fresh electrolytic solution to the electrolytic processing apparatus; and a waste liquid recovery section for recovering the electrolytic solution from the electrolytic processing apparatus, storing the electrolytic solution and transferring the electrolytic solution to a carry-out container which is to be carried to the outside.