Abstract: A hydrofoil craft using a novel propulsive system able to greatly reduce wave making resistance at a sailing time is provided. Therefore, a semi-submergence type hydrofoil craft has a craft main body having a water surface craft body located above the water surface at the sailing time, an underwater craft body located below the water surface, and one or plural struts vertically connecting these craft bodies. The above underwater craft body has a water suction port opened to suck water from a front face of the underwater craft body, a propeller for sending-out the sucked water backward, at least one water injection port opened to inject the water sent-out from the propeller backward, at least one water sending passage extending from the rear of the propeller to the at least one water injection port, and at least one pair of wings projected from both side faces of the underwater craft body.

Abstract: A hydrofoil craft using a novel propulsive system able to greatly reduce wave making resistance at a sailing time is provided. Therefore, a semi-submergence type hydrofoil craft has a craft main body having a water surface craft body located above the water surface at the sailing time, an underwater craft body located below the water surface, and one or plural struts vertically connecting these craft bodies. The above underwater craft body has a water suction port opened to suck water from a front face of the underwater craft body, a propeller for sending-out the sucked water backward, at least one water injection port opened to inject the water sent-out from the propeller backward, at least one water sending passage extending from the rear of the propeller to the at least one water injection port, and at least one pair of wings projected from both side faces of the underwater craft body.

Abstract: Provided are an underwater processing apparatus which can effectively prevent water from entering a shield for a workpiece having a surface ruggedness, and in which variation in a gas flow for a processing part is reduced, a processing method and an application thereof to a nuclear reactor, and the under water processing device is composed of a shield means which locally cover the processing part with the gas in order to prevent water from entering the shield member, the shield means having a solid wall formed of a member which is slidable in a part where it make contact with the workpiece, and adapted to make contact with the workpiece and to be moved up and down by a pressing force, and a water jetting means for forming a water curtain around the outer periphery of the solid wall.

Abstract: In a refrigerating device for a vehicle (1) major components for performing a refrigerating cycle, i.e., an evaporator (19), an evaporator fan (25), a condenser (15) and a condenser fan (23), except for the condenser, are preliminarily attached to an evaporator housing (29) to form an integral refrigerating unit (9). Thus, the refrigerating device may be mounted easily to a refrigeration container (3) easily and quickly only by fitting the refrigerating unit (9) having the evaporator housing as a frame into an opening portion (27) of the refrigeration container (3). Further, because the evaporator (19) and the evaporator fan (25) are not protruded from an inner wall of the refrigeration container, the capacity of the refrigeration container is never reduced.

Abstract: A storage system with ambience conditioning facilities includes a desiccator for removing moisture from air and promoting convection, thereby maintaining articles stored therein in an optimum state for a long period of time. The environment maintained has stable humidity, is free of contaminants and suppresses aging of articles by humidity and microbes.

Abstract: A wear resistant material containing no cobalt is used for a sliding portion of a control rod driving mechanism of a nuclear plant for reducing the exposure dose due to elution of cobalt and ensuring smooth driving of a control rod under a high load for a long time. A control rod driving mechanism employs a roller and a pin, each of which is made of a wear resisting alloy comprising coarse particles of a hard phase, having a particle size of from 20 to 100 .mu.m, and dispersed in a soft matrix made of an iron-based or nickel-based alloy containing chromium and having a hardness of 300 Hv or less. A nuclear reactor employs this control rod driving mechanism.

Abstract: A multi-layer wiring structure for mounting electronic devices is provided to be used in an electronic computer, a work station or the like, and more particularly a multi-layer packaging board having microscopic wiring layers, which board has an excellent dimensional stability and a high reliability, and also a method of producing such a board are provided. The multi-layer wiring structure includes a complex of at least two sub-assemblies each having wiring layers formed respectively on opposite sides of a core material of a low thermal expansive metal through an insulation layer in such a manner that the wiring layers correspond in area ratio to each other. The sub-assemblies are connected to one another by conductors via through holes.

Abstract: An evaporator and heater core are provided within a cooling unit so that the flow rate of the heating medium flowing into the heater core can be adjusted with a 3-way valve. The target outlet temperature of the air discharged into the space being temperature controlled is calculated based upon the temperature of the air taken into the cooling unit and the temperature setting that is set at the temperature setting device. The openness of the 3-way valve is adjusted in such a manner that the temperature of the air outlet from the cooling unit is adjusted toward the target outlet temperature when the intake air temperature has entered a specific temperature setting range. Also, for each storage compartment, unit fans, an evaporator and a heater core are provided, housed within a unit case. The evaporators are connected in parallel to a common compressor to adjust the flow rates of the coolant with a solenoid valve.

Abstract: An evaporator and heater core are provided within a cooling unit so that the flow rate of the heating medium flowing into the heater core can be adjusted with a 3-way valve. The target outlet temperature of the air discharged into the space being temperature controlled is calculated based upon the temperature of the air taken into the cooling unit and the temperature setting that is set at the temperature setting device. The openness of the 3-way valve is adjusted in such a manner that the temperature of the air outlet from the cooling unit is adjusted toward the target outlet temperature when the intake air temperature has entered a specific temperature setting range. Also, for each storage compartment, unit fans, an evaporator and a heater core are provided, housed within a unit case. The evaporators are connected in parallel to a common compressor to adjust the flow rates of the coolant with a solenoid valve.

Abstract: A multi-layer wiring assembly including a stack of insulating layers, e.g. of polyimide, alternating with wiring patterns, typically of copper. To establish the circuit pattern, successive wiring patterns are connected to one another through the intervening insulating layers at predetermined locations, by metal stud connections. The studs are formed during assembly of the stack by wire-bonding a stud onto an underlying wiring pattern through a through-hole of the insulating layer above, and then stamping the exposed end of the wire-bonded stud to spread it into contact with the uppermost wiring pattern. The wire-bonded studs e.g. of Au, form strong bonds with the underlying conductor and are quick to apply in an automated process using a wire-bonding machine.

Abstract: An LSI mounting substrate having a multilayered thin film wiring portion, with the thin film wiring portion being divided into wiring units each composed of a plurality of wiring layers, with the wirings between the units being electrically connected through connecting pads defined in the same surface as that of a surface conductive layer of the unit.

Abstract: A composite of metal and an organic film having a high adhesiveness without deterioration of film quality is provided by exposing the surface of organic film to at least one of chemically reactive gas phase molecules and gas phase ions thereby forming functional groups on the surface of organic film, and forming a metallic film thereon through the functional groups.

Abstract: A thin film forming method and apparatus, wherein a negative voltage is applied alternately to a target and a substrate to perform film formation and reverse sputter alternately. Further, a coil is mounted between the target and the substrate and a high frequency current is made to flow therethrough to generate plasma. A negative base voltage smaller in absolute value than that during sputter may be applied to the substrate to make Ar ions flow into the substrate while it is subjected to reverse sputter. Thus, a film whose step coverage is 0.3 or more is possible. It becomes also possible to maintain a stable discharge and perform reverse sputter in a high vacuum region. The pressure of an Ar atmosphere may be lowered to 10.sup.-3 Torr or less. An aluminum wiring film whose peak value of x-ray diffraction strength at a (111) plane is 150 Kcps or more is possible.

Abstract: A magnetic disk device, where a slip pad is adhered on a hub table secured to a spindle, is disclosed, in which the hub table has a circular groove portion formed in the disk hub attracting surface portion coaxially to the spindle and at least a part of the outer peripheral portion of the slip pad is installed in the groove portion.

Abstract: The present invention provides a process for producing a metal-polyimide composite material such as a wiring board. In production thereof, deterioration of polyamide film due to oxidation during imidization of a polyimide precursor in contact with metal such as copper or silver can be prevented. The present invention is characterized by using a polyimide precursor having an acidic functional group which is masked. Examples of the polyamide precursor are polyamic acid epoxy adducts, amido polyamic acids, silylated polyamic acids, etc.

Abstract: The present invention provides a process for producing a metal/polyimide composite article such as high-density wiring boards. This metal/polyimide composite article is produced by a method which comprises coating a polyamic acid alkyl ester represented by the following formula on a metallic film and curing it: ##STR1## wherein R.sub.1 and R.sub.2 which may be identical or different each represents an organic group of 1 or more carbon atoms.

Abstract: A semiconductor package for use in computers includes a insulating substrate onto which a semiconductor device is mounted, an insulating cap which shuts out outside air and seals said semiconductor device, power-source lines which provide power to the semiconductor device, and signal lines which transmit output signals from the semiconductor device to external circuits. The signal lines are arranged perpendicularly to the insulating substrate so that they are prevented from the dielectric constant of the insulating substrate, while the power-source lines are formed within the insulating substrate and connected through conductive layers parallel to the surface onto which the semiconductor is mounted to external leads.

Abstract: Apparatus for rotating and driving a magnetic disk in which a hub of a magnetic disk is magnetically attracted against a hub support, and a driving pin provided on the hub support is engaged with an engaging hole provided in the disk hub. The hub support has a magnetic attractive surface which is high in magnetic flux density in the vicinity of the driving pin and continuously and gradually lowers in magnetic flux density as a function of distance from the driving pin, so that the magnetic disk can be attracted by an approximately uniform net attractive force over the entire surface of the hub support.

Abstract: A semiconductor device having a high reliability wiring conductor structure applicable to DRAMs and SRAMs.The semiconductor device of the present invention is characterized by comprising a first wiring conductor film wherein a specific resistance is 5.about.15.mu..OMEGA.cm and an allowable current density is 1.times.10.sup.6 .about.1.times.10.sup.8 A/cm.sup.2 ; a second wiring conductor film having a laminated layer structure formed of a layer of high fusing point and low resistance material and a layer of an Al based alloy; and a plug composed of a high fusing point and low resistance material, electrically connecting to the first wiring conductor film and the second wiring conductor film. Thus, a semiconductor device showing almost no increase in electrical resistance in a wiring conductor film due to electromigration even after subjecting to a large current is provided.

Abstract: A semiconductor device and the method of fabricating the semiconductor device include a semiconductor substrate and a plurality of conductor films formed on the substrate. Each of the conductor films is made of aluminum alloy including at least one element selected from palladium and platinum and, more preferably, further including at least one element selected from lithium, beryllium, magnesium, manganese, iron, cobalt, nickel, copper, lanthanum, cerium, chromium hafnium, zirconium, cadmium, titanium, tungsten, vanadium, tantalum, and niobium, with a protective film which includes oxide of the selected one of palladium and platinum being formed on the side wall of the conductor film.