Abstract: A method of manufacturing a hexagonal boron nitride (hBN) laminate on a backside of LED filament contains steps of: a) Preparing a substrate of LED filament array; b) Coating the hBN based slurry on the backside of substrate of LED filament and dried at 100-200° C.; c) Cutting the array to single LED filament. A LED filament with hBN based heat dissipation radiation laminate was obtained after this process. For heat dissipation application, hexagonal boron nitride laminate coating can significantly enhance the performance of LED light bulb.

Abstract: A high power battery/capacitor module is revealed. The high power battery/capacitor module includes a box, electrolyte solution, cells and a heat exchanging device. A chamber in the box is connected to the heat exchanging device to form a closed fluid circulation space. The electrolyte solution is filled into the chamber and the cells are arranged at the chamber of the box. The cells are immersed into and electrically insulated from the electrolyte solution. The electrolyte solution is cooled down by the heat exchanging device after being drawn away from the chamber and then delivered back to the chamber circularly. The high power battery/capacitor module further includes an automatic device for detecting and balancing concentrations of ions in the electrolyte solution. Thus the present battery/capacitor module solves the problems caused by heat generated during charging/discharging and extends service life of the battery/capacitor system by using electrolyte solution as coolant.

Abstract: A printed RFID sensor tag contains: a substrate, a RFID sensor arranged on a top of the substrate, and a protective layer covering the RFID sensor. The RFID sensor includes a RFID sensing antenna and a chip adhered on the RFID sensing antenna. The RFID sensing antenna is partially or totally made of conductive sensing ink/glue printed on the top of the substrate, and the conductive sensing ink/glue consists of conductive ink/glue and multiple sensing materials.

Abstract: A method of manufacturing a polymer printed circuit board contains steps of: A. providing a material layer consisting of polymer; B. forming circuit pattern on the material layer; C. depositing metal nanoparticles on the LIG of the circuit pattern so as to use as a metal seed; D. pressing the circuit pattern; and E. forming a metal layer on the LIG of the circuit pattern. In the step of B, the circuit pattern includes laser induced graphene, and the laser induced graphene is porous. Thereby, the circuit pattern is adhered on the material layer securely and has outstanding electric conductivity after being pressed in the step D.

Abstract: A printed RFID sensor tag contains: a substrate, a RFID sensor arranged on a top of the substrate, and a protective layer covering the RFID sensor. The RFID sensor includes a RFID sensing antenna and a chip adhered on the RFID sensing antenna. The RFID sensing antenna is partially or totally made of conductive sensing ink/glue printed on the top of the substrate, and the conductive sensing ink/glue consists of conductive ink/glue and multiple sensing materials.

Abstract: A heat dissipation coating layer contains: a binder and a core-shell heat dissipation filler. The core-shell heat dissipation filler is synthesized in a water bathing process at the temperature within 20° C. to 100° C. The core-shell heat dissipation filler includes a metal core and a shell composed of the mixture of oxide and hydroxide shell. Here the metal core has metal particles, and the shell has a porous structure consisted of a mixture of metal oxide and porous metal hydroxide.

Abstract: A method of forming a copper metal layer on a non-metallic material contains: a. providing a carbon-based electroless-plating inks; b. spraying the carbon-based electroless-plating inks on the non-metallic material; c. dry spraying the carbon-based electroless-plating inks on the non-metallic material; and d. dipping the non-metallic material on which the carbon-based electroless-plating inks dry sprayed in an electroless plating solution. Thereby, the copper metal layer is formed on the carbon-based electroless-plating inks of the non-metallic material.

Abstract: An LED filament contains: a light transmissive substrate, at least one LED chip, a first electrode pin, a second electrode pin, a light emitting layer, and a phosphor layer. The phosphor layer packages the at least one LED chip, and the first electrode pin and the second electrode pin expose outside the phosphor layer. The light emitting layer is made of electromagnetic wave material of different radiation waves, the at least one LED chip produces excitation light source to excite the phosphor layer to illumine lights, and a part of the excitation light source of the at least one LED chip excites the light emitting layer to illuminate the lights after passing through the substrate. The part of the excitation light source excites phosphors of the light emitting layer to illuminate the lights toward the LED filament or the light emitting layer absorbs visible lights converted from infrared lights.

Abstract: A light-emitting diode light bulb contains: a screw base, a transparent housing, at least one filament support, and at least one LED filament. The transparent housing includes an opening, and the screw base includes a positive terminal and a negative terminal. Each filament support includes two metal posts. Each LED filament includes a substrate, a first electrode pin, a second electrode pin, a thermal radiation film, at least one LED chip, a wire, and a fluorescent. The at least one LED chip is electrically connected with the first and second electrode pins, the first electrode pin is electrically connected with a first metal post, and the second electrode pin is electrically connected with a second metal post. The at least one LED filament and the at least one filament support are accommodated in the transparent housing, the screw base is housed into the opening, and the opening is closed.

Abstract: An electroless plating catalyst contains: carbon material powders which include oxygen functional groups. The oxygen functional groups at least consisting of any one of lactol, ester, hydroxyl, epoxy, and ketone, wherein the carbon material powders include oxide of any one of graphene, graphite, carbon nanotube, carbon black, and activated carbon. Oxygen content of the carbon material powders is 5 wt % to 50 wt % of a total weight of carbon powder material. The carbon material powders include a combination, and the combination is any one of nitrogen (N), sulfur (S), boron (B), fluorine (F), and phosphorus (P), wherein a content of the combination is 1 wt % to 20 wt % of the total weight of the carbon powder material.

Abstract: An electroless plating catalyst contains: carbon material powders which include oxygen functional groups, wherein the carbon material powders include oxide of any one of graphene, graphite, carbon nanotube, carbon black, and activated carbon with/without oxidization treatment. Oxygen content of the carbon material powders is 5 wt % to 50 wt % of a total weight of carbon powder material. The carbon material powders include a combination, and the combination is any one of nitrogen (N), sulfur (S), boron (B), fluorine (F), and phosphorus (P), wherein a content of the combination is 1 wt % to 20 wt % of the total weight of the carbon powder material.

Abstract: A RFID security structure for a document contains: a RFID antenna and a RFID chip. The RFID antenna is made of conductive inks printed on the document, and the RFID chip is attached on and is electrically connected with the RFID antenna. When the covering layer is removed from the document, the RFID antenna is broken. Accordingly, a portion of the RFID antenna attaches on the covering layer, and the other portion of the PRID antenna remains on the RFID security document or the substrate, hence the RFID security document is not tampered or is not imitated.

Abstract: A method of manufacturing a polymer printed circuit board contains steps of: A. providing a material layer consisting of polymer; B. forming circuit pattern on the material layer; C. depositing metal nanoparticles on the LIG of the circuit pattern so as to use as a metal seed; D. pressing the circuit pattern; and E. forming a metal layer on the LIG of the circuit pattern. In the step of B, the circuit pattern includes laser induced graphene, and the laser induced graphene is porous. Thereby, the circuit pattern is adhered on the material layer securely and has outstanding electric conductivity after being pressed in the step D.

Abstract: A bonding structure of a chip and an electronic circuit contains: a chip holder, a chip accommodated in the chip holder, multiple conductive feet electrically connected with the chip, and an electronic circuit. The chip and the multiple conductive feet are covered by a packaging material, and a part of each of the multiple conductive feet exposes outside the packaging material to form an extension. The electronic circuit includes a porous substrate and an electric circuit connected on the porous substrate, wherein the electric circuit is formed from conductive inks which penetrate into the porous substrate, and the extension is inserted through the electric circuit, hence the extension is electrically connected with the electric circuit.

Abstract: A heat dissipation coating layer contains: a heat dissipation filler and a binder which are synthesized in a water bathing manner. The heat dissipation filler includes a metal core formed on a central portion of the heat dissipation filler, and the heat dissipation filler also includes a metal shell surrounding the metal core, wherein the metal core has metal particles, and the metal shell has porous metal oxide particles and porous metal hydroxide particles, a size of each of the porous metal oxide particles and the porous metal hydroxide particles is less than 500 nm.

Abstract: A printed graphene-based laminate for wireless wearable communications can be processed at low temperature so that it is compatible with heat-sensitive flexible materials like papers and textiles. The printed graphene-based laminate is of high conductivity, high flexibility, light weight and low cost, making it perfect candidate for wireless wearable devices. As a proof of concept, printed graphene-based laminate enabled transmission lines (TLs) and antennas were designed, fabricated and characterized. To explore its potentials in wearable communications applications, mechanically flexible transmission lines and antennas under various bended cases were experimentally studied. The measurement results demonstrate that the printed graphene laminate can be used for RF signal transmitting, radiating and receiving, which represents some of the essential functionalities of RF signal processing in wireless wearable communications systems.

Abstract: A highly porous heat dissipation coating by graphene-rich baking varnish consists of: graphene nanoflakes, at least one dispersants, binders, and carriers. The amount of graphene-rich nanoflakes accounts for 10 to 70 wt % of solid composition of a graphene baking varnish. The at least one dispersant is non-ionic or ionic dispersant. The binder is made of thermoplastic polymers. The carrier is selected from aqueous liquids, organic solvents, or a combination thereof. A post-baking treatment at relative high temperature (100 to 400° C.) is applied for enhancing the adhesion of heat dissipation coating on metal surface. Accordingly, the graphene-rich baking varnish enhances adhesion and improves heat dissipation rate by convection and radiation.

Abstract: A method of manufacturing a hexagonal boron nitride laminate contains steps of: a) Dissolve dielectric polymers in solvent. b) Mixing h-BN powder to form a well-mixed h-BN coating slurry. c) Coating slurry on substrates and dried at 100-150° C. The substrates can directly be etched or processed to form electric circuits. Substrates can also be completely etched or detached to attain a free standing laminate. Thereby, a hexagonal boron nitride laminate exhibit thermal conductivity of 10 to 40 W/m·K, which is significantly larger than that currently used in thermal management. In addition, thermal conductivity of hexagonal boron nitride laminates increases with the increasing mass density, which opens a way of fine tuning of its thermal properties. For heat dissipation application, hexagonal boron nitride laminate coating can significantly enhance the performance of LED light bulb.

Abstract: A method of manufacturing hexagonal boron nitride laminates contains steps of: a) Dissolving dielectric polymers in solvent. b) Mixing h-BN powder to form a well-mixed h-BN coating slurry. c) Coating slurry on substrates and dried at 100 to 150° C. d-1) For free standing h-BN film, peel off h-BN dielectric polymer layer from substrate in water batch by roll to roll process. d-2) For h-BN film on substrates, heat compression of the substrates and hBN laminates at 100 to 250° C. for multi-layer structures. Thereby, hexagonal boron nitride laminates exhibit thermal conductivity of 10 to 40 W/m·K, which is significantly larger than that currently used in thermal management. In addition, thermal conductivity of hexagonal boron nitride laminates increases with the increasing mass density, which opens a way of fine tuning of its thermal properties.

Abstract: A graphene baking varnish consists of: graphene, fillers, at least one dispersants, binders, and solvent. The graphene includes graphene nanoflakes and accounts for 20 to70 wt % of solid composition of a graphene baking varnish. The fillers are heat dissipation filler including natural graphite, carbon black, boron nitride, copper (Cu), tin (Sn), iron (Fe), zinc (Zn), nickel (Ni), and sliver (Ag). The at least one dispersant is non-ionic or ionic dispersant. The binder is made of thermoplastic polymers. The solvent possesses one or more carriers. Accordingly, the graphene baking varnish enhances adhesion and improves heat dissipation rate by convection and radiation.