Patents by Inventor Kyoung-hwan Kim
Kyoung-hwan Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10325882Abstract: A method of manufacturing a semiconductor package includes providing a substrate including a mounting region having a recess space for accommodating a semiconductor chip and a connection region surrounding the mounting region, providing a semiconductor chip in the mounting region, the semiconductor chip including a connection pad provided on a top surface of the semiconductor chip, forming a protective layer covering a top surface of the substrate and the top surface of the semiconductor chip, forming a photosensitive insulating layer on the protective layer after forming the protective layer, patterning the photosensitive insulating layer thereby exposing the protective layer, removing the exposed protective layer, and forming a redistribution line to be electrically connected to the connection pad.Type: GrantFiled: July 17, 2017Date of Patent: June 18, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Tae-woo Kang, Byung-lyul Park, Kyoung-hwan Kim, Kun-sang Park, Young-gyu Ahn
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Patent number: 10186427Abstract: A substrate treating apparatus and a method of treating a substrate, the apparatus including a substrate treater that treats a substrate using a chemical solution, the chemical solution including a phosphoric acid aqueous solution and a silicon compound; and a chemical solution supplier that supplies the chemical solution to the substrate treating unit, wherein the chemical solution supplier includes a concentration measurer that measures concentrations of the chemical solutions, the concentration measurer including a first concentration measurer that measures a water concentration of the chemical solution; and a second concentration measurer that measures a silicon concentration of the chemical solution.Type: GrantFiled: December 6, 2017Date of Patent: January 22, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyoung Hwan Kim, Ingi Kim, Mihyun Park, Young-Hoo Kim, Ui-soon Park, Jung-Min Oh, Kuntack Lee, Hyosan Lee
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Publication number: 20190020889Abstract: The present invention relates to a motion control system and method using detection of motions in a video, and the motion control system includes: a video processing device for decoding encoded video to extract motion vectors and residual values of effective macroblocks, producing motion codes using the extracted motion vectors and residual values of the effective macroblocks, reproducing the decoded video, and transmitting the produced motion codes and the time codes corresponding to the video being reproduced to a motion control device; and the motion control device for receiving the time codes and motion codes from the video processing device and controlling motions of actuators according to the motion codes if the time values of the time codes and motion codes correspond to each other.Type: ApplicationFiled: December 26, 2016Publication date: January 17, 2019Inventors: Kyoung Hwan KIM, Hyoung Woo LEE, Hyung Jin TAK
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Publication number: 20180114714Abstract: A substrate processing apparatus may include a substrate jig device and a transfer unit, which is configured to hold a substrate in a non-contact state and move the substrate toward the substrate jig device. The substrate jig device may include a supporter, which is configured to support an edge of the substrate and have an opening, a first suction part, which overlaps with a center region of the opening and is configured to move in a first direction, and a plurality of second suction parts, which overlap with an edge region of the opening and are configured to move toward the opening. Here, the first direction may be a direction passing through the opening.Type: ApplicationFiled: May 16, 2017Publication date: April 26, 2018Inventors: KYOUNG HWAN KIM, TAEWOO KANG, Byung Lyul PARK, HYUNGJUN JEON
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Publication number: 20180108639Abstract: A method of manufacturing a semiconductor package includes providing a substrate including a mounting region having a recess space for accommodating a semiconductor chip and a connection region surrounding the mounting region, providing a semiconductor chip in the mounting region, the semiconductor chip including a connection pad provided on a top surface of the semiconductor chip, forming a protective layer covering a top surface of the substrate and the top surface of the semiconductor chip, forming a photosensitive insulating layer on the protective layer after forming the protective layer, patterning the photosensitive insulating layer thereby exposing the protective layer, removing the exposed protective layer, and forming a redistribution line to be electrically connected to the connection pad.Type: ApplicationFiled: July 17, 2017Publication date: April 19, 2018Inventors: Tae-woo Kang, Byung-lyul Park, Kyoung-hwan Kim, Kun-sang Park, Young-gyu Ahn
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Publication number: 20180096856Abstract: A substrate treating apparatus and a method of treating a substrate, the apparatus including a substrate treater that treats a substrate using a chemical solution, the chemical solution including a phosphoric acid aqueous solution and a silicon compound; and a chemical solution supplier that supplies the chemical solution to the substrate treating unit, wherein the chemical solution supplier includes a concentration measurer that measures concentrations of the chemical solutions, the concentration measurer including a first concentration measurer that measures a water concentration of the chemical solution; and a second concentration measurer that measures a silicon concentration of the chemical solution.Type: ApplicationFiled: December 6, 2017Publication date: April 5, 2018Inventors: Kyoung Hwan KIM, Ingi KIM, Mihyun PARK, Young-Hoo KIM, Ui-soon PARK, Jung-Min OH, Kuntack LEE, Hyosan LEE
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Patent number: 9922897Abstract: A method of manufacturing a semiconductor package includes forming a preliminary package, on a supporting substrate, which includes a connection substrate, a semiconductor chip and a molding pattern on the connection substrate and the semiconductor chip, forming a buffer pattern on the molding pattern, and forming a carrier substrate, on the buffer pattern, which includes a first portion contacting the buffer pattern and a second portion contacting the molding pattern.Type: GrantFiled: April 6, 2017Date of Patent: March 20, 2018Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyoung Hwan Kim, Taewoo Kang, Byung Lyul Park, Hyungjun Jeon
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Publication number: 20180076108Abstract: A method of manufacturing a semiconductor package includes forming a preliminary package, on a supporting substrate, which includes a connection substrate, a semiconductor chip and a molding pattern on the connection substrate and the semiconductor chip, forming a buffer pattern on the molding pattern, and forming a carrier substrate, on the buffer pattern, which includes a first portion contacting the buffer pattern and a second portion contacting the molding pattern.Type: ApplicationFiled: April 6, 2017Publication date: March 15, 2018Inventors: Kyoung Hwan KIM, Taewoo KANG, Byung Lyul PARK, Hyungjun JEON
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Patent number: 9852921Abstract: A substrate treating apparatus and a method of treating a substrate, the apparatus including a substrate treater that treats a substrate using a chemical solution, the chemical solution including a phosphoric acid aqueous solution and a silicon compound; and a chemical solution supplier that supplies the chemical solution to the substrate treating unit, wherein the chemical solution supplier includes a concentration measurer that measures concentrations of the chemical solutions, the concentration measurer including a first concentration measurer that measures a water concentration of the chemical solution; and a second concentration measurer that measures a silicon concentration of the chemical solution.Type: GrantFiled: June 7, 2016Date of Patent: December 26, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyoung Hwan Kim, Ingi Kim, Mihyun Park, Young-Hoo Kim, Ui-soon Park, Jung-Min Oh, Kuntack Lee, Hyosan Lee
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Patent number: 9772296Abstract: In a method of inspecting a surface of a substrate, a first surface image of the substrate before loaded into a process chamber may be obtained. The first surface image may be processed to detect a defect on the surface of the substrate. Thus, the surfaces of all of the substrate may be inspected during a process may be performed without transferring the substrates.Type: GrantFiled: August 15, 2014Date of Patent: September 26, 2017Assignee: Samsung Electronics Co., Ltd.Inventors: Byung-Bok Kang, Seok-Min Kang, Bon-Ok Koo, Kyoung-Hwan Kim, Myung-Woo Kim, In-Gi Kim, Hyun-Chul Kim, Sung-Ki Roh, Gyung-Jin Min, Eun-Seok Lee, Jin-Suk Hong
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Publication number: 20170110316Abstract: A method of cleaning a substrate includes providing the substrate, the substrate including a metal material film, performing physical cleaning of the substrate, performing chemical cleaning of the substrate, and drying a surface of the substrate. Performing the chemical cleaning includes supplying a chemical cleaning solution including an anionic surfactant at a concentration that is equal to or greater than a critical micelle concentration (CMC) onto the surface of the substrate.Type: ApplicationFiled: August 16, 2016Publication date: April 20, 2017Inventors: Mi-hyun PARK, Jung-min OH, Kyoung-hwan KIM, In-gi KIM, Hyo-san LEE, Ji-hoon JEONG, Kyoung-seob KIM, Seok-hoon KIM
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Patent number: 9595434Abstract: A method of manufacturing a semiconductor device includes: forming a pattern on a surface of a semiconductor substrate; placing the substrate on a platform of a substrate treatment apparatus; rotating the wafer while applying a cleaning liquid from a first nozzle and a wetting liquid from a second nozzle to treat a first region on the surface of the substrate; vertically changing the distance of the second nozzle together with the first nozzle with respect to the platform; after the vertical change, rotating the wafer while applying the cleaning liquid from the first nozzle and the wetting liquid from the second nozzle to treat a second region on the surface of the substrate; and forming a semiconductor device from the treated substrate.Type: GrantFiled: May 5, 2015Date of Patent: March 14, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyoungseob Kim, Yongsun Ko, Kyoung Hwan Kim, SeokHoon Kim, Kuntack Lee, Hyosan Lee
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Publication number: 20170062242Abstract: A chemical liquid supply apparatus includes a nozzle unit including a nozzle arm and an injection nozzle mounted in an end of the nozzle arm, a chemical liquid supply unit including a first chemical liquid tank accommodating a first chemical liquid and a second chemical liquid tank accommodating a second chemical liquid, and supplying the first chemical liquid and the second chemical liquid to the nozzle unit, and a mixer unit provided in the nozzle unit and discharging a process fluid by mixing the first chemical liquid and the second chemical liquid, wherein the mixer unit includes an in-line mixer mixing the first chemical liquid and the second chemical liquid that are continually injected from the chemical liquid supply unit, and a mixer pipe extending from the in-line mixer to the injection nozzle.Type: ApplicationFiled: June 3, 2016Publication date: March 2, 2017Inventors: YOUNG-HOO KIM, IL-SANG LEE, IN-GI KIM, KYOUNG-HWAN KIM, HYO-SAN LEE, SANG-WON BAE, TAE-HONG KIM, YONG-JUN CHOI
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Publication number: 20170062287Abstract: A substrate treating apparatus and a method of treating a substrate, the apparatus including a substrate treater that treats a substrate using a chemical solution, the chemical solution including a phosphoric acid aqueous solution and a silicon compound; and a chemical solution supplier that supplies the chemical solution to the substrate treating unit, wherein the chemical solution supplier includes a concentration measurer that measures concentrations of the chemical solutions, the concentration measurer including a first concentration measurer that measures a water concentration of the chemical solution; and a second concentration measurer that measures a silicon concentration of the chemical solution.Type: ApplicationFiled: June 7, 2016Publication date: March 2, 2017Inventors: Kyoung Hwan KIM, Ingi KIM, Mihyun PARK, Young-Hoo KIM, Ui-soon PARK, Jung-Min OH, Kuntack LEE, Hyosan LEE
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Publication number: 20160368030Abstract: Disclosed is a substrate processing system including a nozzle to supply a chemical solution containing a mixture of first and second solutions onto a substrate loaded on a supporter of a process chamber, a chemical solution supplying system to supply the chemical solution to the nozzle, and a controller to control the chemical solution supplying system. The chemical solution supplying system may include a mixing tank mixing a plurality of chemicals to produce the first solution, a supply tank receiving the first solution from the mixing tank and producing the chemical solution, a connection line to connect the mixing tank to the supply tank, and a valve and a pump on the connection line. The pump is controlled to allow the first solution to be supplied into the supply tank at a predetermined supply amount per stroke.Type: ApplicationFiled: April 29, 2016Publication date: December 22, 2016Inventors: Ingi KIM, Kyoung Hwan KIM, SeokHoon KIM, Sang Won BAE, Jung-Min OH, Kuntack LEE, Hyosan LEE
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Publication number: 20160089723Abstract: A method of fabricating nanostructures using macro pre-patterns according to the present invention, which comprises either depositing a target material on a substrate having macro pre-patterns formed thereon, or applying a target material to a substrate and then forming macro pre-patterns on the substrate, and then depositing the target material on the side surface of the macro pre-patterns by an ion bombardment phenomenon occurring during etching, provides a three-dimensional nanostructures with high aspect ratio and uniformity can be fabricated by a simple process at low cost by using the ion bombardment phenomenon occurring during physical ion etching, thereby achieving the high performance of future nano-devices, such as nanosized electronic devices, optical devices, bio devices and energy devices.Type: ApplicationFiled: October 27, 2015Publication date: March 31, 2016Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Hee-Tae JUNG, Hwan-Jin JEON, Kyoung-Hwan KIM, Youn-Kyoung BAEK
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Publication number: 20160027637Abstract: A method of manufacturing a semiconductor device includes: forming a pattern on a surface of a semiconductor substrate; placing the substrate on a platform of a substrate treatment apparatus; rotating the wafer while applying a cleaning liquid from a first nozzle and a wetting liquid from a second nozzle to treat a first region on the surface of the substrate; vertically changing the distance of the second nozzle together with the first nozzle with respect to the platform; after the vertical change, rotating the wafer while applying the cleaning liquid from the first nozzle and the wetting liquid from the second nozzle to treat a second region on the surface of the substrate; and forming a semiconductor device from the treated substrate.Type: ApplicationFiled: May 5, 2015Publication date: January 28, 2016Inventors: KYOUNGSEOB KIM, YONGSUN KO, KYOUNG HWAN KIM, SeokHoon KIM, KUNTACK LEE, HYOSAN LEE
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Patent number: 9180519Abstract: A three-dimensional nanostructures and a method for fabricating the same, and more particularly to three-dimensional structures of various shapes having high aspect ratio and uniformity in large area and a method of fabricating the same by attaching a target material to the outer surface of patterned polymer structures using an ion bombardment phenomenon occurring during a physical ion etching process to form target material-polymer composite structures, and then removing the polymer from the target material-polymer structures. A three-dimensional nanostructures with high aspect ratio and uniformity can be fabricated by a simple process at low cost by using the ion bombardment phenomenon occurring during physical ion etching. Also, nanostructures of various shapes can be easily fabricated by controlling the pattern and shape of polymer structures. In addition, uniform fine nanostructures having a thickness of 10 nm or less can be formed in a large area.Type: GrantFiled: October 10, 2014Date of Patent: November 10, 2015Assignee: Korea Advanced Institute of Science and TechnologyInventors: Hee-Tae Jung, Hwan-Jin Jeon, Kyoung-Hwan Kim, Youn-Kyoung Baek
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Publication number: 20150228412Abstract: A tantalum capacitor may include: a body part having a cathode layer disposed as an outermost layer thereof; an anode wire buried in the body part with a portion thereof being led out from one surface of the body part; and a molded part enclosing the body part and the anode wire. The molded part formed on at least one surface of the cathode layer may have a thickness of 10 ?m to 50 ?m.Type: ApplicationFiled: May 1, 2014Publication date: August 13, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hee Sung CHOI, Kyoung Hwan KIM
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Publication number: 20150228413Abstract: A solid electrolytic capacitor may include: an anode body formed of a porous sintered material containing a tantalum powder having an average particle size of 100 nm or less; an anode wire having a portion buried in the porous sintered material in a length direction; a dielectric layer formed on a surface of the porous sintered material; and a solid electrolytic layer disposed on a surface of the dielectric layer. When a cross-sectional area of the anode wire in a thickness-width direction is defined as A1 and a cross-sectional area of the anode body in the thickness-width direction is defined as A2, 0.05?A1/A2?0.5 is satisfied.Type: ApplicationFiled: May 1, 2014Publication date: August 13, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hee Sung CHOI, Kyoung Hwan KIM