Abstract: The present disclosure relates to a fan-out semiconductor package including a frame having a through hole, a semiconductor chip disposed in the through hole, a first encapsulant disposed in a space between the frame and the semiconductor chip, a second encapsulant disposed on one sides of the frame and the semiconductor chip, and a redistribution layer disposed on the other sides of the frame and the semiconductor chip, and a method of manufacturing the same. The first encapsulant and the second encapsulant may include different materials.

Abstract: An electronic component package includes a redistribution layer, an electronic component disposed on the redistribution layer, and an encapsulant encapsulating the electronic component. The electronic component has a trench formed in one side thereof.

Abstract: A printed circuit board, a method of manufacturing a printed circuit board, and an electronic component module including a printed circuit board are provided. The printed circuit board includes a circuit board having a cavity, and a connection board including metal patterns, the connection board disposed in the cavity with the metal patterns disposed substantially vertically in the circuit board.

Abstract: A printed circuit board includes a first insulating layer including a first circuit pattern, a second insulating layer including a second circuit pattern, and a dummy pattern disposed in the first insulating layer and the second insulating layer, in which the first and second insulating layers are made of different materials. An electronic component module includes a printed circuit board and an electronic component mounted on the printed circuit board.

Abstract: Disclosed herein is a method for removing a seed layer in manufacturing a printed circuit board, the method including: forming a photo resist layer on a printed circuit board having a seed layer formed on a surface thereof; removing the photo resist layer according to a predetermined pattern; forming a plating layer for a circuit on the predetermined pattern from which the photo resist layer is removed; exposing the seed layer by removing the photo resist layer around the plating layer; forming a corrosion layer on surfaces of the seed layer and the plating layer by performing a chemical reaction of the substrate from which the seed layer is exposed in a reactor in which a predetermined gas is filled; and removing the seed layer by irradiating a laser on the corrosion layer to remove the corrosion layer.

Abstract: The present invention discloses a printed circuit board including a lower wiring layer, an insulating layer which buries the lower wiring layer, and an upper wiring layer formed on the insulating layer to improve reliability of interlayer electrical connection between the wiring layers, wherein the interlayer connection between the upper wiring layer and the lower wiring layer is performed by a via electrode which is provided between the upper wiring layer and the lower wiring layer and has an upper surface bonded to the upper wiring layer and a lower surface bonded to the lower wiring layer, wherein the lower surface of the via electrode is larger than the upper surface thereof.

Abstract: Disclosed herein are a printed circuit board having a copper plated layer with an anchor shaped surface and roughness by forming the copper plated layer having an anisotropic crystalline orientation structure using a plating inhibitor at the time of forming the copper plated layer serving as a circuit wiring and using composite gas plasma and a dilute acid solution, and a method of manufacturing the same.

Abstract: Disclosed herein is a method for removing a seed layer in manufacturing a printed circuit board, the method including: forming a photo resist layer on a printed circuit board having a seed layer formed on a surface thereof; removing the photo resist layer according to a predetermined pattern; forming a plating layer for a circuit on the predetermined pattern from which the photo resist layer is removed; exposing the seed layer by removing the photo resist layer around the plating layer; forming a corrosion layer on surfaces of the seed layer and the plating layer by performing a chemical reaction of the substrate from which the seed layer is exposed in a reactor in which a predetermined gas is filled; and removing the seed layer by irradiating a laser on the corrosion layer to remove the corrosion layer.

Abstract: Disclosed herein is a three-dimensional (3D) semiconductor package. The 3D semiconductor package includes a printed circuit board, a main interposer that is formed on the printed circuit board, a semiconductor device that is formed on the main interposer, and a support interposer that is disposed on the same plane as a plane of the semiconductor device, or disposed between the main interposer and the semiconductor device. Here, each of the main interposer, the semiconductor device, and the support interposer may include a through-via formed based on a thickness direction of the printed circuit board.