Abstract: An image sensor semiconductor package (package) includes a printed circuit board (PCB) having a first surface and a second surface opposite the first surface. A complementary metal-oxide semiconductor (CMOS) image sensor (CIS) die has a first surface with a photosensitive region and a second surface opposite the first surface of the CIS die. The second surface of the CIS die is coupled with the first surface of the PCB. A transparent cover is coupled over the photosensitive region of the CIS die. An image signal processor (ISP) is embedded within the PCB. One or more electrical couplers electrically couple the CIS die with the PCB. A plurality of electrical contacts on the second surface of the PCB are electrically coupled with the CIS die and with the ISP. The ISP is located between the plurality of electrical contacts of the second surface of the PCB and the CIS die.

Abstract: A water remediation device is disclosed, including a water-permeable outer fabric defining a cavity therein, a buoyant core disposed within the cavity, and a mass of water remediation media including biochar disposed between the buoyant core and the water-permeable outer fabric. The remediation media is configured to reduce a quantity of a polyfluoroalkyl substance present in a sample of contaminated water when the remediation device is placed in the sample of contaminated water. The device may be formed into an elongated boom that is configured to float on or partially-submerge in water. Alternatively, the device may be formed of a pad or blanket that may be entirely submerged in water during use.

Abstract: A water remediation device is disclosed, including a water-permeable outer fabric defining a cavity therein, a buoyant core disposed within the cavity, and a mass of water remediation media including biochar disposed between the buoyant core and the water-permeable outer fabric. The remediation media is configured to reduce a quantity of a polyfluoroalkyl substance present in a sample of contaminated water when the remediation device is placed in the sample of contaminated water. The device may be formed into an elongated boom that is configured to float on or partially-submerge in water. Alternatively, the device may be formed of a pad or blanket that may be entirely submerged in water during use.

Abstract: Implementations of semiconductor packages may include: a die coupled to a glass lid; one or more inner walls having a first material coupled to the die; an outer wall having a second material coupled to the die; and a glass lid coupled to the die at the one or more inner walls and at the outer wall; wherein the outer wall may be located at the edge of the die and the glass lid and the one or more inner walls may be located within the perimeter of the outer wall at a predetermined distance from the perimeter of the outer wall; and wherein a modulus of the first material may be lower than a modulus of the second material.

Abstract: A method of time delayed reduction in the molecular weight of polymers in a viscosified fluid and a method of time delayed breaking of viscosified fluids through treatment of the viscosified fluid with a viscosity breaking composition. The viscosity breaking composition is formed from a peroxygen compound, a peroxygen inhibiting agent and a peroxygen catalyzing agent, where the relative concentration of the components determines the duration of the a time interval require for breaking the viscosified fluid.

Abstract: An image sensor semiconductor package (package) includes a printed circuit board (PCB) having a first surface and a second surface opposite the first surface. A complementary metal-oxide semiconductor (CMOS) image sensor (CIS) die has a first surface with a photosensitive region and a second surface opposite the first surface of the CIS die. The second surface of the CIS die is coupled with the first surface of the PCB. A transparent cover is coupled over the photosensitive region of the CIS die. An image signal processor (ISP) is embedded within the PCB. One or more electrical couplers electrically couple the CIS die with the PCB. A plurality of electrical contacts on the second surface of the PCB are electrically coupled with the CIS die and with the ISP. The ISP is located between the plurality of electrical contacts of the second surface of the PCB and the CIS die.

Abstract: An image sensor semiconductor package (package) includes a printed circuit board (PCB) having a first surface and a second surface opposite the first surface. A complementary metal-oxide semiconductor (CMOS) image sensor (CIS) die has a first surface with a photosensitive region and a second surface opposite the first surface of the CIS die. The second surface of the CIS die is coupled with the first surface of the PCB. A transparent cover is coupled over the photosensitive region of the CIS die. An image signal processor (ISP) is embedded within the PCB. One or more electrical couplers electrically couple the CIS die with the PCB. A plurality of electrical contacts on the second surface of the PCB are electrically coupled with the CIS die and with the ISP. The ISP is located between the plurality of electrical contacts of the second surface of the PCB and the CIS die.

Abstract: Implementations of semiconductor packages may include: a die coupled to a glass lid; one or more inner walls having a first material coupled to the die; an outer wall having a second material coupled to the die; and a glass lid coupled to the die at the one or more inner walls and at the outer wall; wherein the outer wall may be located at the edge of the die and the glass lid and the one or more inner walls may be located within the perimeter of the outer wall at a predetermined distance from the perimeter of the outer wall; and wherein a modulus of the first material may be lower than a modulus of the second material.

Abstract: Implementations of semiconductor packages may include: a die coupled to a glass lid; one or more inner walls having a first material coupled to the die; an outer wall having a second material coupled to the die; and a glass lid coupled to the die at the one or more inner walls and at the outer wall; wherein the outer wall may be located at the edge of the die and the glass lid and the one or more inner walls may be located within the perimeter of the outer wall at a predetermined distance from the perimeter of the outer wall; and wherein a modulus of the first material may be lower than a modulus of the second material.

Abstract: A method of reducing the viscosity of a viscosified fluid in an underground drilling operation comprising, where the introduction of a chelated transition metal catalyzes the viscosity reduction of the viscosified fluid. The chelated transition metal may be ferric methylglycinediacetate. Additionally, an uninhibited oxidizing agent, such as a peroxygen compound, may also be present in combination with the chelated transition metal to catalyze the viscosity reduction of the viscosified fluid.

Abstract: The present application is directed to a method of remediation of an organic contaminant through the formation of a treatment zone defined by an introduction of biochar slurry that concentrates the contaminate in the treatment zone. In one embodiment, the biochar slurry catalyzes the oxidation and/or reduction of the contaminate in the treatment zone. The present application may be applied to in situ or ex situ contaminant remediation.

Abstract: Implementations of semiconductor packages may include: a die coupled to a glass lid; one or more inner walls having a first material coupled to the die; an outer wall having a second material coupled to the die; and a glass lid coupled to the die at the one or more inner walls and at the outer wall; wherein the outer wall may be located at the edge of the die and the glass lid and the one or more inner walls may be located within the perimeter of the outer wall at a predetermined distance from the perimeter of the outer wall; and wherein a modulus of the first material may be lower than a modulus of the second material.

Abstract: A method of time delayed reduction in the molecular weight of polymers in a viscosified fluid and a method of time delayed breaking of viscosified fluids through treatment of the viscosified fluid with a viscosity breaking composition. The viscosity breaking composition is formed from a peroxygen compound, a peroxygen inhibiting agent and a peroxygen catalyzing agent, where the relative concentration of the components determines the duration of the a time interval require for breaking the viscosified fluid.

Abstract: An image sensor semiconductor package (package) includes a printed circuit board (PCB) having a first surface and a second surface opposite the first surface. A complementary metal-oxide semiconductor (CMOS) image sensor (CIS) die has a first surface with a photosensitive region and a second surface opposite the first surface of the CIS die. The second surface of the CIS die is coupled with the first surface of the PCB. A transparent cover is coupled over the photosensitive region of the CIS die. An image signal processor (ISP) is embedded within the PCB. One or more electrical couplers electrically couple the CIS die with the PCB. A plurality of electrical contacts on the second surface of the PCB are electrically coupled with the CIS die and with the ISP. The ISP is located between the plurality of electrical contacts of the second surface of the PCB and the CIS die.

Abstract: Implementations of semiconductor packages may include: a first semiconductor die coupled to a first side of a substrate having one or more internal traces. One or more connectors coupled to the first semiconductor die and the first side of the substrate. A glass lid coupled to the first side of the substrate over the first semiconductor die. A mold compound that encapsulates at least a portion of the substrate. A second semiconductor die coupled to a second side of the substrate opposing the first side. The second semiconductor die is electrically coupled with the first semiconductor die through the one or more traces of the substrate.

Abstract: A method of time delayed reduction in the molecular weight of polymers in a viscosified fluid and a method of time delayed breaking of viscosified fluids through treatment of the viscosified fluid with a viscosity breaking composition. The viscosity breaking composition is formed from a peroxygen compound, a peroxygen inhibiting agent and a peroxygen catalyzing agent, where the relative concentration of the components determines the duration of the a time interval require for breaking the viscosified fluid.

Abstract: Implementations of semiconductor packages may include: a die coupled to a glass lid; one or more inner walls having a first material coupled to the die; an outer wall having a second material coupled to the die; and a glass lid coupled to the die at the one or more inner walls and at the outer wall; wherein the outer wall may be located at the edge of the die and the glass lid and the one or more inner walls may be located within the perimeter of the outer wall at a predetermined distance from the perimeter of the outer wall; and wherein a modulus of the first material may be lower than a modulus of the second material.

Abstract: A method of in situ remediation of an organic contaminant through the formation of a subsurface treatment zone defined by a injection biochar slurry that concentrates the organic contaminate and catalyzes the formation of free radical of an oxidizing agent. An in situ organic contaminant remediation composition including biochar particles and a persulfate oxidizing agent is also provided.

Abstract: A method of reducing the viscosity of a viscosified fluid in an underground drilling operation comprising, where the introduction of a chelated transition metal catalyzes the viscosity reduction of the viscosified fluid. The chelated transition metal may be ferric methylglycinediacetate. Additionally, an uninhibited oxidizing agent, such as a peroxygen compound, may also be present in combination with the chelated transition metal to catalyze the viscosity reduction of the viscosified fluid.

Abstract: A method of time delayed reduction in the molecular weight of polymers in a viscosified fluid and a method of time delayed breaking of viscosified fluids through treatment of the viscosified fluid with a viscosity breaking composition. The viscosity breaking composition is formed from a peroxygen compound, a peroxygen inhibiting agent and a peroxygen catalyzing agent, where the relative concentration of the components determines the duration of the a time interval require for breaking the viscosified fluid.