Patents by Inventor Larry Kinsman
Larry Kinsman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8791536Abstract: Disclosed herein is a stacked chip package including an image sensor including a recess formed on a surface thereof, and a digital signal processor chip that is positioned within the recess. Also disclosed herein is a method of fabricating a stacked chip package including the steps of forming a recess on a surface of an image sensor and positioning a digital signal processor in the recess of the image sensor.Type: GrantFiled: January 18, 2012Date of Patent: July 29, 2014Assignee: Aptina Imaging CorporationInventors: Larry Kinsman, Yu Te Hsieh
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Publication number: 20120273908Abstract: Disclosed herein is a stacked chip package including an image sensor including a recess formed on a surface thereof, and a digital signal processor chip that is positioned within the recess. Also disclosed herein is a method of fabricating a stacked chip package including the steps of forming a recess on a surface of an image sensor and positioning a digital signal processor in the recess of the image sensor.Type: ApplicationFiled: January 18, 2012Publication date: November 1, 2012Applicant: APTINA IMAGING CORPORATIONInventors: LARRY KINSMAN, YU TE HSIEH
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Patent number: 7919410Abstract: An imager device is disclosed which includes at least one photosensitive element positioned on a front surface of a substrate and a conductive structure extending at least partially through an opening defined in the substrate to conductively couple to an electrical contact or bond pad on the front surface. An insulating material of a conductive laminate film and/or a mold compound material is positioned within the opening between at least a portion of the conductive structure and the substrate. Also disclosed is a device that comprises a substrate and a plurality of openings in the substrate, wherein each of the openings is adapted to be positioned above an imager device when the substrate is positioned above and secured to an imager substrate. A method of forming an imager device is also disclosed.Type: GrantFiled: March 14, 2007Date of Patent: April 5, 2011Assignee: Aptina Imaging CorporationInventors: Luke England, Larry Kinsman
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Patent number: 7600314Abstract: A technique is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is positioned over a support region in the receiving socket. A manual actuator is pressed into the holder to eject the device from the holder and to install the device in the support. The holder may be configured to hold a single device, or multiple devices aligned in slots defined by partitions. A multi-device tray may be provided for indexing devices toward an ejection slot, through which the devices are installed by manual actuation of an ejecting actuator. The technique provides protection for the device prior to and during installation, and facilitates manual installation of such devices without requiring direct hand contact with the device either prior to or during installation.Type: GrantFiled: September 1, 2005Date of Patent: October 13, 2009Assignee: Micron Technology, Inc.Inventors: Larry Kinsman, Mike Brooks, Warren M. Farnworth, Walter Moden, Terry Lee
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Publication number: 20080224192Abstract: An imager device is disclosed which includes at least one photosensitive element positioned on a front surface of a substrate and a conductive structure extending at least partially through an opening defined in the substrate to conductively couple to an electrical contact or bond pad on the first surface. An insulating material of a conductive laminate film and/or a mold compound material is positioned within the opening between at least a portion of the conductive structure and the substrate. Also disclosed is a device that comprises a substrate and a plurality of openings in the substrate, wherein each of the openings is adapted to be positioned above an imager device when the substrate is positioned above and secured to an imager substrate. A method of forming an imager device is also disclosed.Type: ApplicationFiled: March 14, 2007Publication date: September 18, 2008Inventors: Luke England, Larry Kinsman
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Patent number: 7384805Abstract: In one implementation, a circuit substrate includes a substrate having opposing sides. At least one of the sides is configured for transfer mold packaging and has conductive traces formed thereon. A soldermask is received on the one side, and has a plurality of openings formed therethrough to locations on the conductive traces. The soldermask includes a peripheral elongated trench therein positioned on the one side to align with at least a portion of an elongated mold void perimeter of a transfer mold to be used for transfer mold packaging of the one side. In one implementation, the invention includes a transfer mold semiconductor packaging process. In one implementation, the invention includes a semiconductor package. In one implementation, the invention includes a ball grid array.Type: GrantFiled: November 1, 2002Date of Patent: June 10, 2008Assignee: Micron Technology, Inc.Inventors: Larry Kinsman, Richard Wensel, Jeff Reeder
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Publication number: 20080042252Abstract: An apparatus package for high-temperature thermal applications for ball grid array semiconductor devices and a method of packaging ball grid array semiconductor devices.Type: ApplicationFiled: October 18, 2007Publication date: February 21, 2008Applicant: MICRON TECHNOLOGY, INC.Inventors: Walter Moden, David Corisis, Leonard Mess, Larry Kinsman
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Publication number: 20070148918Abstract: Channels are formed that pass through an active surface of a semiconductor substrate to provide isolation between adjacent active surface regions defining individual die locations. Bond pads on the substrate are bumped with intermediate conductive elements, after which a material used to encapsulate the active surface is applied, filling the channels and covering exposed peripheral edges of the active surface integrated circuitry. The encapsulant is then planarized to expose the ends of the bumps. External conductive elements such as solder balls are then formed on the exposed bump ends. The semiconductor wafer is diced in alignment with the channels to singulate the semiconductor devices, the encapsulant in the channels keeping the edges of the integrated circuitry substantially hermetically sealed.Type: ApplicationFiled: February 26, 2007Publication date: June 28, 2007Inventors: Larry Kinsman, Salman Akram
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Publication number: 20070029681Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component mounted to a substrate. The substrate carries a plurality of bond pads at a location substantially coplanar with a terminal surface of the microelectronic component. This enables a smaller package to be produced by moving the bond pads laterally inwardly toward the periphery of the microelectronic component.Type: ApplicationFiled: July 27, 2006Publication date: February 8, 2007Applicant: Micron Technology, Inc.Inventor: Larry Kinsman
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Publication number: 20070013084Abstract: An apparatus for making a semiconductor assembly and, specifically, interconnecting a semiconductor die to a carrier substrate. The carrier substrate includes a first surface and a second surface with at least one opening therethrough. The die includes an active surface and a back surface, wherein the die is attached face down to the first surface of the carrier substrate with conductive bumps therebetween. In addition, a plurality of bond wires is attached through the at least one opening in the carrier substrate between the active surface of the die and the second surface of the carrier substrate. With this arrangement, both the conductive bumps and the bond wires share in the electrical interconnection between the die and the carrier substrate, thereby allowing more space for bond pads to interconnect with bond wires and/or allowing for smaller die sizes.Type: ApplicationFiled: September 20, 2006Publication date: January 18, 2007Inventor: Larry Kinsman
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Publication number: 20070000599Abstract: A LOC die assembly and method is disclosed including a die dielectrically adhered to the underside of a lead frame. The lead frame has stress relief slots formed in the undersides of the lead elements proximate the adhesive to accommodate filler particles lodged between the leads and the active surface of the die during transfer molding of a plastic encapsulant. The increased space created by the slots and flexure in the leads about the slots reduces point stresses on the active surface of the die by the filler particles. The increased flexure in the leads about the slots further enhances the locking of the leads in position with respect to the die.Type: ApplicationFiled: September 1, 2006Publication date: January 4, 2007Inventors: Larry Kinsman, Timothy Allen, Jerry Brooks
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Publication number: 20060292732Abstract: The present invention provides flip-chip packaging for optically interactive devices such as image sensors and methods of assembly. In a first embodiment of the invention, conductive traces are formed directly on the second surface of a transparent substrate and an image sensor chip is bonded to the conductive traces. Discrete conductive elements are attached to the conductive traces and extend below a back surface of the image sensor chip. In a second embodiment, a secondary substrate having conductive traces formed thereon is secured to the transparent substrate. In a third embodiment, a backing cap having a full array of attachment pads is attached to the transparent substrate of the first embodiment or the secondary substrate of the second embodiment. In a fourth embodiment, the secondary substrate is a flex circuit having a mounting portion secured to the second surface of the transparent substrate and a backing portion bent over adjacent to the back surface of the image sensor chip.Type: ApplicationFiled: September 1, 2006Publication date: December 28, 2006Inventor: Larry Kinsman
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Patent number: 7148083Abstract: In one implementation, a circuit substrate includes a substrate having opposing sides. At least one of the sides is configured for transfer mold packaging and has conductive traces formed thereon. A soldermask is received on the one side, and has a plurality of openings formed therethrough to locations on the conductive traces. The soldermask includes a peripheral elongated trench therein positioned on the one side to align with at least a portion of an elongated mold void perimeter of a transfer mold to be used for transfer mold packaging of the one side. In one implementation, the invention includes a transfer mold semiconductor packaging process. In one implementation, the invention includes a semiconductor package. In one implementation, the invention includes a ball grid array.Type: GrantFiled: November 10, 2004Date of Patent: December 12, 2006Assignee: Micron Technology, Inc.Inventors: Larry Kinsman, Richard Wensel, Jeff Reeder
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Publication number: 20060267184Abstract: An inventive integrated circuit package includes a package body, such as a transfer molded plastic or preformed ceramic package body, having an integrated circuit die positioned therein. A lead frame, such as a peripheral lead, Leads-Over-Chip (LOC), or Leads-Under-Chip (LUC) lead frame, includes a plurality of leads with portions enclosed within the package body that electrically connect to the integrated circuit die. A heat sink is positioned at least partially within the package body so a surface of a first portion of the heat sink faces the lead frame in close proximity to a substantial part, such as at least eighty percent, of the area of the enclosed portion of the lead frame to thereby substantially reduce an inductance associated with each of the leads.Type: ApplicationFiled: July 6, 2006Publication date: November 30, 2006Inventors: Larry Kinsman, Jerry Brooks
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Patent number: 7095115Abstract: In one implementation, a circuit substrate includes a substrate having opposing sides. At least one of the sides is configured for transfer mold packaging and has conductive traces formed thereon. A soldermask is received on the one side, and has a plurality of openings formed therethrough to locations on the conductive traces. The soldermask includes a peripheral elongated trench therein positioned on the one side to align with at least a portion of an elongated mold void perimeter of a transfer mold to be used for transfer mold packaging of the one side. In one implementation, the invention includes a transfer mold semiconductor packaging process. In one implementation, the invention includes a semiconductor package. In one implementation, the invention includes a ball grid array.Type: GrantFiled: July 2, 2003Date of Patent: August 22, 2006Assignee: Micron Technology, Inc.Inventors: Larry Kinsman, Richard Wensel, Jeff Reeder
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Publication number: 20060154405Abstract: The present invention provides flip-chip packaging for optically interactive devices such as image sensors and methods of assembly. In a first embodiment of the invention, conductive traces are formed directly on the second surface of a transparent substrate and an image sensor chip is bonded to the conductive traces. Discrete conductive elements are attached to the conductive traces and extend below a back surface of the image sensor chip. In a second embodiment, a secondary substrate having conductive traces formed thereon is secured to the transparent substrate. In a third embodiment, a backing cap having a full array of attachment pads is attached to the transparent substrate of the first embodiment or the secondary substrate of the second embodiment. In a fourth embodiment, the secondary substrate is a flex circuit having a mounting portion secured to the second surface of the transparent substrate and a backing portion bent over adjacent to the back surface of the image sensor chip.Type: ApplicationFiled: March 13, 2006Publication date: July 13, 2006Inventor: Larry Kinsman
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Patent number: 7065868Abstract: A method is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is positioned over a support region in the receiving socket. A manual actuator is pressed into the holder to eject the device from the holder and to install the device in the support. The holder may be configured to hold a single device, or multiple devices aligned in slots defined by partitions. A multi-device tray may be provided for indexing devices toward an ejection slot, through which the devices are installed by manual actuation of an ejecting actuator. The technique provides protection for the device prior to and during installation, and facilitates manual installation of such devices without requiring direct hand contact with the device either prior to or during installation.Type: GrantFiled: December 29, 2003Date of Patent: June 27, 2006Assignee: Micron Technology, Inc.Inventors: Larry Kinsman, Mike Brooks, Warren M. Farnworth, Walter Moden, Terry Lee
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Publication number: 20060060957Abstract: Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays. The ball grid array packages comprise flexible or rigid substrates. The ball grid array packages additionally comprise an arrangement for the substantial matching of impedance for the circuits connected to the semiconductor devices.Type: ApplicationFiled: October 31, 2005Publication date: March 23, 2006Inventors: David Corisis, Walter Moden, Leonard Mess, Larry Kinsman
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Publication number: 20060048382Abstract: A technique is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is positioned over a support region in the receiving socket. A manual actuator is pressed into the holder to eject the device from the holder and to install the device in the support. The holder may be configured to hold a single device, or multiple devices aligned in slots defined by partitions. A multi-device tray may be provided for indexing devices toward an ejection slot, through which the devices are installed by manual actuation of an ejecting actuator. The technique provides protection for the device prior to and during installation, and facilitates manual installation of such devices without requiring direct hand contact with the device either prior to or during installation.Type: ApplicationFiled: September 1, 2005Publication date: March 9, 2006Inventors: Larry Kinsman, Mike Brooks, Warren Farnworth, Walter Moden, Terry Lee
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Publication number: 20060049504Abstract: Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays. The ball grid array packages comprise flexible or rigid substrates. The ball grid array packages additionally comprise an arrangement for the substantial matching of impedance for the circuits connected to the semiconductor devices.Type: ApplicationFiled: October 31, 2005Publication date: March 9, 2006Inventors: David Corisis, Walter Moden, Leonard Mess, Larry Kinsman