Patents by Inventor Lawrence D. David
Lawrence D. David has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20040154489Abstract: A process for imaging a lithographic printing plate having a presensitizing coating. An ink jet printer is used to apply imagewise micro drops of an insolubilizing solution that insolubilizes exposed areas of the coating. The latent image is then developed. The process works with conventional, commercially available developing processors.Type: ApplicationFiled: February 6, 2004Publication date: August 12, 2004Inventors: Albert S. Deutsch, Lawrence D. David, David B. West
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Patent number: 6691618Abstract: A process for imaging a lithographic printing plate having a presensitizing coating. An ink jet printer is used to apply imagewise micro drops of an insolubilizing solution that insolubilizes exposed areas of the coating. The latent image is then developed. The process works with conventional, commercially available developing processors.Type: GrantFiled: October 25, 2001Date of Patent: February 17, 2004Assignee: Pisces-Print Imaging Sciences, Inc.Inventors: Albert S. Deutsch, Lawrence D. David, David B. West
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Publication number: 20020104455Abstract: A process for imaging a lithographic printing plate having a presensitizing coating. An ink jet printer is used to apply imagewise micro drops of an insolubilizing solution that insolubilizes exposed areas of the coating. The latent image is then developed. The process works with conventional, commercially available developing processors.Type: ApplicationFiled: October 25, 2001Publication date: August 8, 2002Inventors: Albert S. Deutsch, Lawrence D. David, David B. West
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Patent number: 6417280Abstract: A blended solid composition is provided containing a fibrillatable microparticulate PTFE polymer in an unfibrillated state and at least one elastomeric and/or fluoroplastic component. The composition is useful in making microfiber-reinforced solid compositions and articles produced therefrom.Type: GrantFiled: April 6, 2001Date of Patent: July 9, 2002Assignee: Chemfab CorporationInventors: John A. Effenberger, Christopher M. Comeaux, Lawrence D. David, Timothy P. Pollock, Katherine M. Sahlin, Laura A. Socha, Richard L. Stone, John W. Verbicky
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Patent number: 6355565Abstract: A ferric nitrate-alumina based slurry useful for Chemical-Mechanical-Polishing of tungsten metallurgy and silica based oxides on semiconductor substrates in which the suspension and stability of abrasive material in the slurry is essentially stable. The slurry formulation is balanced to provide low residue of foreign material after polishing and due to its reduced ferric nitrate concentration will be less corrosive than prior art slurries. The recipe for the slurry includes of a 30% wt silica suspension, about 800 ml of 40% by wt ferric nonahydrate, liters and enough 70% wt nitric acid to adjust the pH of the slurry to about 1.2 to 1.4.Type: GrantFiled: July 12, 2001Date of Patent: March 12, 2002Assignee: International Business Machines CorporationInventors: Paul M. Feeney, Timothy C. Krywanczyk, Lawrence D. David, Matthew T. Tiersch, Eric J. White
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Publication number: 20010052587Abstract: A ferric nitrate-alumina based slurry useful for Chemical-Mechanical-Polishing of tungsten metallurgy and silica based oxides on semiconductor substrates in which the suspension and stability of abrasive material in the slurry is essentially stable. The slurry formulation is balanced to provide low residue of foreign material after polishing and due to its reduced ferric nitrate concentration will be less corrosive than prior art slurries. The recipe for the slurry includes of a 30% wt silica suspension, about 800 ml of 40% by wt ferric nonahydrate, liters and enough 70% wt nitric acid to adjust the pH of the slurry to about 1.2 to 1.4.Type: ApplicationFiled: July 12, 2001Publication date: December 20, 2001Applicant: International Business Machines CorporationInventors: Paul M. Feeney, Timothy C. Krywanczyk, Lawrence D. David, Matthew T. Tiersch, Eric J. White
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Publication number: 20010034414Abstract: A blended solid composition is provided containing a fibrillatable microparticulate PTFE polymer in an unfibrillated state and at least one elastomeric and/or fluoroplastic component. The composition is useful in making microfiber-reinforced solid compositions and articles produced therefrom.Type: ApplicationFiled: April 6, 2001Publication date: October 25, 2001Inventors: John A. Effenberger, Christopher M. Comeaux, Lawrence D. David, Timothy P. Pollock, Katherine M. Sahlin, Laura A. Socha, Richard L. Stone, John W. Verbicky
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Patent number: 6294105Abstract: A ferric nitrate-alumina based slurry useful for Chemical-Mechanical-Polishing of tungsten metallurgy and silica based oxides on semiconductor substrates in which the suspension and stability of abrasive material in the slurry is essentially stable. The slurry formulation is balanced to provide low residue of foreign material after polishing and due to its reduced ferric nitrate concentration will be less corrosive than prior art slurries. The recipe for the slurry includes of a 30% wt silica suspension, about 800 ml of 40% by wt ferric nonahydrate and enough 70% wt nitric acid to adjust the pH of the slurry to about 1.2 to 1.4.Type: GrantFiled: December 23, 1997Date of Patent: September 25, 2001Assignee: International Business Machines CorporationInventors: Paul M. Feeney, Timothy C. Krywanczyk, Lawrence D. David, Matthew T. Tiersch, Eric J. White
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Patent number: 6284151Abstract: A ferric nitrate-alumina based slurry useful for Chemical-Mechanical-Polishing of tungsten metallurgy on semiconductor substrates in which the suspension and stability of abrasive material in the slurry is essentially stable. The slurry formulation is balanced to provide low residue of foreign material after polishing and due to its reduced ferric nitrate concentration will be less corrosive than prior art slurries. The recipe for the slurry includes 375 ml of a 9% wt alumina suspension, about 200 grams ferric nonahydrate, water to dilute to about 4.5 liters and enough 70% wt nitric acid to adjust the pH of the slurry to about 1.0 to 1.5.Type: GrantFiled: December 23, 1997Date of Patent: September 4, 2001Assignee: International Business Machines CorporationInventors: Timothy C. Krywanczyk, Lawrence D. David
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Patent number: 6239223Abstract: A blended solid composition is provided containing a fibrillatable microparticulate PTFE polymer in an unfibrillated state and at least one elastomeric and/or fluoroplastic component. The composition is useful in making microfiber-reinforced solid compositions and articles produced therefrom.Type: GrantFiled: June 12, 1998Date of Patent: May 29, 2001Assignee: Chemfab CorporationInventors: John A. Effenberger, Christopher M. Comeaux, Lawrence D. David, Timothy P. Pollock, Katherine M. Sahlin, Laura A. Socha, Richard L. Stone, John W. Verbicky
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Patent number: 6221269Abstract: A method is provided for etching and removing extraneous molybdenum or debris on ceramic substrates such as semiconductor devices and also for molybdenum etching in the fabrication of molybdenum photomasks. The method employs a multi-step process using an acidic aqueous solution of a ferric salt to remove (etch) the molybdenum debris followed by contacting the treated substrate with an organic quaternary ammonium hydroxide to remove any molybdenum black oxides which may have formed on the exposed surface of treated molybdenum features in ceramic substrates. The method is environmentally safe and the waste solutions may be easily waste treated for example by precipitating the ferric salts as ferric hydroxide and removing anions such as sulfate by precipitation with lime. The method replaces the currently used method of employing ferricyanide salts which create serious hazardous waste disposal and environmental problems.Type: GrantFiled: January 19, 1999Date of Patent: April 24, 2001Assignee: International Business Machines CorporationInventors: Krishna G. Sachdev, Umar M. Ahmad, Hsing H. Chen, Lawrence D. David, Charles H. Perry, Donald R. Wall
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Patent number: 6130170Abstract: A process and etchant solution for chemical wet etching of thin film metals in the presence of a protected metal. The etching solution has a pH range of about 2.7 to 4.0. The etching solution may include hydrogen peroxide, potassium sulfate, and potassium EDTA, and it reduces or eliminates the incidence of etch-resistant metal without damaging the protected metal.Type: GrantFiled: August 26, 1999Date of Patent: October 10, 2000Assignee: International Business Machines CorporationInventors: Lawrence D. David, Lisa A. Fanti
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Patent number: 6015505Abstract: A process and etchant solution for chemical wet etching of thin film metals in the presence of a protected metal. The etching solution has a pH range of about 2.7 to 4.0. The etching solution may include hydrogen peroxide, potassium sulfate, and potassium EDTA, and it reduces or eliminates the incidence of etch-resistant metal without damaging the protected metal.Type: GrantFiled: October 30, 1997Date of Patent: January 18, 2000Assignee: International Business Machines CorporationInventors: Lawrence D. David, Lisa A. Fanti
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Patent number: 5525761Abstract: A copper-based paste for multilayer ceramic substrate vias and lines including copper particles as the majority constituent of the paste, a refractory metal additive selected from the group consisting of chromium, tantalum, and tungsten, and organic materials.This copper-based paste has particular applicability to the formation of vias and lines in ceramic packages wherein the vias and lines would have a composition principally of copper with additions of the refractory metal.Type: GrantFiled: June 6, 1995Date of Patent: June 11, 1996Assignee: International Business Machines CorporationInventors: Lawrence D. David, Shaji Farooq, Anthony Mastreani, Srinivasa S-N. Reddy, Rao V. Vallabhaneni
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Patent number: 5518131Abstract: A molybdenum etching process which reduces hazardous treatment waste is disclosed. Etchants which can be used are ferric sulfate and ferric ammonium sulfate. Waste products resulting from this etch are Fe(OH).sub.3 and CaSO.sub.4.Type: GrantFiled: July 7, 1994Date of Patent: May 21, 1996Assignee: International Business Machines CorporationInventors: Hsing H. Chen, Lawrence D. David, Derek B. Harris
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Patent number: 5512711Abstract: A copper-based paste for multilayer ceramic substrate vias and lines including copper particles as the majority constituent of the paste, a refractory metal additive selected from the group consisting of chromium, tantalum, and tungsten, and organic materials. This copper-based paste has particular applicability to the formation of vias and lines in ceramic packages wherein the vias and lines would have a composition principally of copper with additions of the refractory metal.Type: GrantFiled: June 10, 1994Date of Patent: April 30, 1996Assignee: International Business Machines CorporationInventors: Lawrence D. David, Shaji Farooq, Anthony Mastreani, Srinivasa S-N. Reddy, Rao V. Vallabhaneni
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Patent number: 5277725Abstract: The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.Type: GrantFiled: May 11, 1992Date of Patent: January 11, 1994Assignee: International Business Machines CorporationInventors: John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant, Jon A. Casey, David R. Clarke, George Czornyj, Allen J. Dam, Lawrence D. David, Renuka S. Divakaruni, Werner E. Dunkel, Ajay P. Giri, Liang-Choo Hsia, James N. Humenik, Steven M. Kandetzke, Daniel P. Kirby, John U. Knickerbocker, Sarah H. Knickerbocker, Anthony Mastreani, Amy T. Matts, Robert W. Nufer, Charles H. Perry, Srinivasa S. N. Reddy, Salvatore J. Scilla, Mark A. Takacs, Lovell B. Wiggins
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Patent number: 5213704Abstract: A process for making a compliant thermally conductive, preferably dielectric, compound that enhances the power dissipation capability of high-powered electrical components such as bipolar VLSI semiconductor chips. The compound has chemically stable thermal conduction and viscosity properties; is not subject to phase separation during use and may be applied in small gaps to maximize thermal conduction. The compound preferably comprises a liquid carrier having thermal filler particles dispersed therein and a coupling agent having a functionality which is reactive with the calcined surface of the thermal filler particles, and a functionality having preferential wetting of the thermal filler particles over self-condensation. Additional additives such as fumed silica and polyisobutylene enhance the phase stability and resistance to thermo-mechanical shear force degradation of the thermally conductive compound encountered during functional usage, e.g., fluctuating power cycles.Type: GrantFiled: September 13, 1991Date of Patent: May 25, 1993Assignee: International Business Machines CorporationInventors: Herbert R. Anderson, Jr., Richard B. Booth, Lawrence D. David, Mark O. Neisser, Harbans S. Sachdev, Mark A. Takacs
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Patent number: 5135595Abstract: The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addresssed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.Type: GrantFiled: March 30, 1990Date of Patent: August 4, 1992Assignee: International Business Machines CorporationInventors: John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant, Jon A. Casey, David R. Clarke, George Czornyj, Allen J. Dam, Lawrence D. David, Renuka S. Divakaruni, Werner E. Dunkel, Ajay P. Giri, Liang-Choo Hsia, James N. Humenik, Steven M. Kandetzke, Daniel P. Kirby, John U. Knickerbocker, Sarah H. Knickerbocker, Anthony Mastreani, Amy T. Matts, Robert W. Nufer, Charles H. Perry, Srinivasa S. N. Reddy, Salvatore J. Scilla, Mark A. Takacs, Lovell B. Wiggins
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Patent number: 5094769Abstract: A compliant thermally conductive, preferably dielectric, compound that enhances the power dissipation capability of high-powered electrical components such as bipolar VLSI semiconductor chips. The compound has chemically stable thermal conduction and viscosity properties; is not subject to phase separation during use and may be applied in small gaps to maximize thermal conduction. The compound preferably comprises a liquid carrier having thermal filler particles dispersed therein and a coupling agent having a functionality which is reactive with the calcined surface of the thermal filler particles, and a functionality having preferential wetting of the thermal filler particles over self-condensation. Additional additives such as fumed silica and polyisobutylene enhance the phase stability and resistance to thermo-mechanical shear force degradation of the thermally conductive compound encountered during functional usage, e.g., fluctuating power cycles.Type: GrantFiled: May 13, 1988Date of Patent: March 10, 1992Assignee: International Business Machines CorporationInventors: Herbert R. Anderson, Jr., Richard B. Booth, Lawrence D. David, Mark O. Neisser, Harbans S. Sachdev, Mark A. Takacs