Abstract: A touch pad includes a first conductive pattern layer, a second conductive pattern layer, a first trace, a second trace, a first bonding pad, and a second bonding pad. The first conductive pattern layer includes a first touch electrode extending in a first direction. The second conductive pattern layer includes a second touch electrode extending in a second direction. A first end of the first trace is coupled to the first touch electrode, and a second end of the first trace is coupled to the first bonding pad. A first end of the second trace is coupled to the second touch electrode, and a second end of the second trace is coupled to the second bonding pad. The first direction intersects the second direction.

Abstract: Semiconductor structure and its fabrication method are provided. The method includes providing a substrate, where the substrate includes a first region having a first metal structure and a second region having a second metal structure; forming a device layer on each of top surfaces of the substrate, the first metal structure and the second metal structure; forming a first through hole in the device layer at the first region, where the first through hole exposes at least a portion of surfaces of the first metal structure, and forming a second through hole in the device layer at the second region, where the second through hole passes through the first device and exposes at least a portion of surfaces of the second metal structure; and using a selective metal growth process, forming a first plug in the first through hole and forming a second plug in the second through hole.

Abstract: A semiconductor device and a method of fabricating the semiconductor device are disclosed. The method includes: providing a device wafer and a carrier wafer, the device wafer including an SOI substrate comprising, stacked from the bottom upward, a lower substrate, a buried insulator layer and a semiconductor layer; bonding the device wafer at a front side thereof to the carrier wafer; removing at least the lower substrate through thinning the device wafer from a backside thereof, wherein the backside of the device wafer opposes the front side thereof; and providing a high-resistance substrate and bonding the device wafer at the backside thereof to the high-resistance substrate, the high-resistance substrate having a resistivity higher than that of the lower substrate. With the present disclosure, lower signal loss and improved signal linearity can be achieved while avoiding a significant cost increase.

Abstract: The present disclosure provides a pad structure and a testkey structure and a testing method for a semiconductor device. The pad structure includes: an insulating dielectric layer formed on a substrate; a metal interconnection structure formed in the insulating dielectric layer, the metal interconnection structure comprising a first section and a second section, which are insulated from each other; and a pad formed on the top of the insulating dielectric layer so as to be exposed therefrom at least at its top surface, electrically connected to the first section, and insulated from the second section. With this disclosure, reduced capture of plasma is achievable, mitigating adverse impact of plasma on the semiconductor device.

Abstract: The present invention discloses a heat fusing device for a smart trash receptacle, including: a heating wire for fusion-cutting and thermally sealing an open end of a trash bag, the heating wire being connected to a heat-fusing circuit; a base having heat-resistant and insulating properties, the base having a first end surface on which the heating wire is arranged; and a control mechanism communicatively coupled to the heat-fusing circuit for control thereof. The present invention also discloses a smart trash receptacle incorporating the heat fusing device and a method for controlling a heat fusing temperature. With the present invention, during automatic bagging by the smart trash receptacle, good contact between the heating wire and the trash bag can be ensured while preventing adhesion of the trash bag. This results in improved sealing quality and enables the fulfillment of two tasks, i.e., thermoplastic sealing and thermal fusion-cutting, in the same action of the heat fusing device.

Abstract: A semiconductor device and a method of fabricating same are disclosed. The semiconductor device includes: an SOI substrate including, stacked from the bottom upward, a lower substrate, a buried insulator layer and a semiconductor layer, wherein active regions surrounded by trench isolation structures are formed in the semiconductor layer; a gate electrode layer formed over the semiconductor layer, the gate electrode layer extending from active regions to trench isolation structures; and a source region and a drain region formed in the active regions that are on opposing sides of the gate electrode layer, wherein at least one end portion of the gate electrode layer laterally spans over interfaces of the active regions and the trench isolation structures toward the source region and/or the drain region. Thereby leakage at the interfaces of the active regions and the trench isolation structures can be reduced, resulting in improved performance of the semiconductor device.

Abstract: A memory device includes a local input/output circuit and a main input/output circuit. The local input/output circuit is configured to generate a first local write signal based on a first global write signal and a second global write signal, and configured to transmit the first local write signal to a plurality of first bit lines. The main input/output circuit include a first latch and logic elements. The first latch is configured to generate a first bit write mask signal based on a clock signal. The logic elements are configured to generate the first global write signal and the second global write signal based on the clock signal and the first bit write mask signal.

Abstract: Embodiments of the present disclosure provide a ranging apparatus, a lidar, and a mobile robot. The ranging apparatus includes: a laser emitting unit configured to emit pulse laser to a target object to be ranged; a first receiving unit configured to receive the pulse laser reflected from the target object and generate a corresponding first signal, wherein the first signal is for calculating and determining distance according to the triangle ranging principle; and a second receiving unit configured to receive the pulse laser reflected from the target object and generate a corresponding second signal, wherein the second signal is for calculating and determining distance according to the time-of-flight principle.

Abstract: A method for processing an image, an electronic device and a storage medium are provided. The method includes acquiring a first face image; extracting a face highlight area from the first face image, in which the face highlight area is an area having a brightness value not lower than a first predetermined brightness threshold in a face area of the first face image; obtaining a second face image by decreasing the brightness value of the face highlight area based on a predetermined highlight darkening parameter; obtaining a third face image by converting a color format of the second face image into a RGB color format and decreasing an intensity of each color channel of each pixel in the second face image, and obtaining a target face image by blending the third face image and the first face image.

Abstract: A circuit includes a first inverter, a second inverter, a first header circuit and a second header circuit. The first inverter is configured to convert a first global write signal into a first local write signal transmitted to a complement bit line. The second inverter is configured to convert a second global write signal into a second local write signal transmitted to a bit line. The first header circuit connects or disconnects a power terminal of the first inverter with a positive reference voltage supply in response to a write enable signal and the second global write signal. The second header circuit connects or disconnects a power terminal of the second inverter with the positive reference voltage supply in response to a write enable signal and the first global write signal.

Abstract: A circuit includes a first inverter, a second inverter, a first header circuit and a second header circuit. The first inverter is configured to convert a first global write signal into a first local write signal transmitted to a complement bit line. The second inverter is configured to convert a second global write signal into a second local write signal transmitted to a bit line. The first header circuit connects or disconnects a power terminal of the first inverter with a positive reference voltage supply in response to a write enable signal and the second global write signal. The second header circuit connects or disconnects a power terminal of the second inverter with the positive reference voltage supply in response to a write enable signal and the first global write signal.

Abstract: A method for processing an image, an electronic device and a storage medium are provided. The method includes acquiring a first face image; extracting a face highlight area from the first face image, in which the face highlight area is an area having a brightness value not lower than a first predetermined brightness threshold in a face area of the first face image; obtaining a second face image by decreasing the brightness value of the face highlight area based on a predetermined highlight darkening parameter; obtaining a third face image by converting a color format of the second face image into a RGB color format and decreasing an intensity of each color channel of each pixel in the second face image, and obtaining a target face image by blending the third face image and the first face image.

Abstract: A touch substrate includes a base, a first electrode layer, a dielectric layer and a second electrode layer that are sequentially stacked on the base. The first electrode layer has first electrode regions and first auxiliary regions, and the second electrode layer has second electrode regions and second auxiliary regions. The first electrode layer includes a first mesh electrode including first mesh sub-electrodes and second mesh sub-electrodes. A region where each first mesh sub-electrode is located overlaps a second electrode region, and a region where each second mesh sub-electrode is located overlaps a second auxiliary region. The second electrode layer includes a second mesh electrode including third mesh sub-electrodes and fourth mesh electrodes. A region where each third mesh sub-electrode is located overlaps a first electrode region, and a region where the fourth mesh sub-electrode is located overlaps a first auxiliary region.

Abstract: The present invention discloses a trash bag fitting device, including a vacuum assembly and a motor for driving the vacuum assembly. The vacuum assembly includes an air inlet and an air outlet. The air inlet communicates with the inside of the main body, with the air outlet in communication with the outside of the main body of the trash receptacle. With the combination of the weakness-free trash bag, problems of non-automatic or complex bag fitting and inconvenience of use witnessed in conventional smart trash receptacles can be overcome. The present invention discloses a smart trash receptacle incorporating the trash bag fitting device. The smart trash receptacle includes a trash bag detection device, including a transmitter for transmitting a signal and a receiver for receiving a signal, the signal received by the receiver is a direct signal transmitted from the transmitter or a signal from the transmitter that is reflected.

Abstract: The present disclosure provides a display panel, a method for detecting the same, and a display device. The display panel includes a bending region and a rigid region. The display panel includes at least three pressure-sensitive devices inside, and the at least three pressure-sensitive devices are at least partially overlapped with the bending region respectively. The display panel further includes a detection circuit, the detection circuit is electrically connected to the at least three pressure-sensitive devices via detection lines, and the detection circuit is configured to receive detection signals generated by the at least three pressure-sensitive devices.

Abstract: A touch pad includes a first conductive pattern layer, a second conductive pattern layer, a first trace, a second trace, a first bonding pad, and a second bonding pad. The first conductive pattern layer includes a first touch electrode extending in a first direction. The second conductive pattern layer includes a second touch electrode extending in a second direction. A first end of the first trace is coupled to the first touch electrode, and a second end of the first trace is coupled to the first bonding pad. A first end of the second trace is coupled to the second touch electrode, and a second end of the second trace is coupled to the second bonding pad. The first direction intersects the second direction.

Abstract: A touch substrate includes a base, a first electrode layer, a dielectric layer and a second electrode layer that are sequentially stacked on the base. The first electrode layer has first electrode regions and first auxiliary regions, and the second electrode layer has second electrode regions and second auxiliary regions. The first electrode layer includes a first mesh electrode including first mesh sub-electrodes and second mesh sub-electrodes. A region where each first mesh sub-electrode is located overlaps a second electrode region, and a region where each second mesh sub-electrode is located overlaps a second auxiliary region. The second electrode layer includes a second mesh electrode including third mesh sub-electrodes and fourth mesh electrodes. A region where each third mesh sub-electrode is located overlaps a first electrode region, and a region where the fourth mesh sub-electrode is located overlaps a first auxiliary region.

Abstract: The present disclosure relates to fluid absorbent cores including at least one absorption layer, the layer including at least 80% by weight of water-absorbent polymer particles, 0 to 10% by weight of an adhesive and from 0 to 10% by weight of fibrous material, wherein the water-absorbent polymer particles within the absorption layer are water-absorbent polymer particles having a vortex of 40 s or less and having a roundness of 0.79 to 0.85 and/or a CRC of 38 g/g to 85 g/g.

Abstract: A facial expression recognition method includes extracting a first feature from color information of pixels in a first image, and extracting a second feature of facial key points from the first image.

Abstract: The present disclosure provides a display panel, a method for detecting the same, and a display device. The display panel includes a bending region and a rigid region. The display panel includes at least three pressure-sensitive devices inside, and the at least three pressure-sensitive devices are at least partially overlapped with the bending region respectively. The display panel further includes a detection circuit, the detection circuit is electrically connected to the at least three pressure-sensitive devices via detection lines, and the detection circuit is configured to receive detection signals generated by the at least three pressure-sensitive devices.