Patents by Inventor Lei Cai
Lei Cai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240147134Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 18, 2023Publication date: May 2, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137689Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 15, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137693Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 15, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137681Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 19, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137683Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 18, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137682Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 18, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137684Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 15, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137687Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 18, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137690Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 15, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137692Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 15, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240130216Abstract: The present invention relates to an iridium complex and application thereof. The iridium complex has a general formula of Ir(La)(Lb)(Lc), and has a structure as shown in a formula (1) as a ligand. The provided metal complex has the advantages of low sublimation temperature, good optical and electrical stability, high luminous efficiency, long service life, and high color saturation. The metal complex can be used in organic light-emitting devices, especially as a red light-emitting phosphorescent material, and has the potential of being applied in the AMOLED industry.Type: ApplicationFiled: October 24, 2021Publication date: April 18, 2024Applicant: GUANGDONG AGLAIA OPTOELECTRONIC MATERIALS CO., LTDInventors: Liangliang YAN, Lei DAI, Lifei CAI
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Publication number: 20240116966Abstract: The present invention relates to a binuclear metal platinum complex and application thereof. The binuclear metal platinum complex is a compound having a structure of a chemical formula (I). The compound is applied in an organic light-emitting diode, has lower driving voltage and higher luminous efficiency, and can significantly improve the service life of a device, thus having the potential of being applied in the field of display panels. The present invention further provides an organic light-emitting diode including a cathode, an anode, and an organic layer. The organic layer is one or more of a hole injection layer, a hole transport layer, a light-emitting layer, a hole blocking layer, an electron transport layer, and an electron injection layer. At least one of the organic layers includes the compound of the structural formula (I).Type: ApplicationFiled: October 24, 2021Publication date: April 11, 2024Applicant: GUANGDONG AGLAIA OPTOELECTRONIC MATERIALS CO., LTDInventors: Huiyang LI, Xinwei WU, Lei DAI, Lifei CAI
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Patent number: 11946799Abstract: A distributed fiber-optic acoustic sensing system and a signal processing method. The distributed fiber-optic acoustic sensing system is based on a high spatial resolution distributed fiber-optic acoustic sensor. The interval between adjacent sensing units is centimeter or millimeter level. Through specific digital signal processing, signal enhancement can be realized, noise in the system and environment are suppressed, at the same time, problems such as interference fading is solved, and the sensor signal-to-noise ratio of subunits can be increased by two to three orders of magnitude. Each subunit can serve as an independent high-sensitivity sensor for sensing. The multiple subunits can form one or more new sensor arrays. The azimuth estimation and spatial orientation of signal sources can be realized by the array signal processing method.Type: GrantFiled: June 7, 2021Date of Patent: April 2, 2024Assignee: Shanghai Institute of Optics And Fine Mechanics, Chinese Academy of SciencesInventors: Haiwen Cai, Bin Lu, Zhaoyong Wang, Lei Ye, Qing Ye, Ronghui Qu
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Patent number: D1022011Type: GrantFiled: February 20, 2022Date of Patent: April 9, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Zeteng Yan, Lei Zhong, Zhi Cai, Sunjie Huang, Haofeng Zhang, Xin Fu, Zhiqing Liu
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Patent number: D1022016Type: GrantFiled: February 20, 2022Date of Patent: April 9, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Zeteng Yan, Lei Zhong, Zhi Cai, Sunjie Huang, Haofeng Zhang, Xin Fu, Zhiqing Liu
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Patent number: D1022017Type: GrantFiled: February 20, 2022Date of Patent: April 9, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Sunjie Huang, Lei Zhong, Zhi Cai, Zeteng Yan, Haofeng Zhang, Xin Fu, Zhiqing Liu
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Patent number: D1022018Type: GrantFiled: February 20, 2022Date of Patent: April 9, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Zhi Cai, Lei Zhong, Zeteng Yan, Sunjie Huang, Haofeng Zhang, Xin Fu, Zhiqing Liu
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Patent number: D1022019Type: GrantFiled: February 20, 2022Date of Patent: April 9, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Lei Zhong, Zhi Cai, Zeteng Yan, Sunjie Huang, Haofeng Zhang, Xin Fu, Zhiqing Liu
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Patent number: D1022020Type: GrantFiled: February 20, 2022Date of Patent: April 9, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Lei Zhong, Zhi Cai, Zeteng Yan, Sunjie Huang, Haofeng Zhang, Xin Fu, Zhiqing Liu
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Patent number: D1022023Type: GrantFiled: February 20, 2022Date of Patent: April 9, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Zeteng Yan, Lei Zhong, Zhi Cai, Sunjie Huang, Haofeng Zhang, Xin Fu, Zhiqing Liu