Abstract: A photosensitive polyimide resin for ultraviolet curing-based three-dimensional printing, which is prepared from 40-60 parts by weight of an active group-containing polyimide resin; 20-50 parts by weight of an organic activator; and 2-5 parts by weight of a photoinitiator. This application further provides a method for preparing the photosensitive polyimide resin.

Abstract: An electronic device can include a first die, a second die, and an interconnect. The first die or the second die has a principal function as a power module or a memory. The first die includes a first bond pad, and the second die includes a second bond pad. The device sides of the first and second dies are along the same sides as the first and second bond pads. In an embodiment, the first die and the second die are in a chip first, die face-up configuration. The first and the second bond pads are electrically connected along a first solderless connection that includes the interconnect. In another embodiment, each material within the electrical connection between the first and the second bond pads has a flow point or melting point temperature of at least 300° C.

Abstract: Various semiconductor chip packages are disclosed. In one aspect, a semiconductor chip package is provided that includes a fan-out redistribution layer (RDL) structure that has plural stacked polymer layers, plural metallization layers, plural conductive vias interconnecting adjacent metallization layers of the metallization layers, and plural rivets configured to resist delamination of one or more of the polymer layers. Each of the plural rivets includes a first head, a second head and a shank connected between the first head and the second head. The first head is part of one of the metallization layers. The shank includes at least one of the conductive vias and at least one part of another of the metallization layers.

Abstract: The present disclosure provides a multi-scale three-dimensional (3D) engineering geological model construction system and method. A regional geological model of a target region, a site geological model of each engineering site, and a drilling geological model of each drilling well are constructed. The geological model of each drilling well is superimposed to the site geological model of the corresponding engineering site in the way of step-by-step superimposition, and the site geological model of each engineering site fused with the drilling geological model is superimposed to the regional geological model of the target region. Thus, multi-scale geological model fusion of drilling well, engineering site, and regional mountain is realized.

Abstract: Disclosed are a method and a device for a rational allocation of regional multi-source water resources driven by bilateral classified water prices, belonging to the field of water resources management. The method establishes a supply-side and demand-side classified water price model based on a regional comprehensive water price by using a full-cost water price theory, solves the classified water price model and an established regional multi-source water resource allocation model driven by expected classified water prices of the supply-side and the demand-side by adopting a cooperative game method to obtain regional multi-source water resource allocation results, and the regional multi-source water resource allocation results include a water resource allocation strategy corresponding to the expected classified water prices of the supply-side and the demand-side.

Abstract: Systems, methods, and apparatus including computer-readable mediums for managing training wells for target wells in machine learning are provided. In one aspect, a method includes: for each training well of a plurality of training wells, building a training network for the training well based on well log data of the training well, predicting a target well log of a target well using the training network built for the training well, determining a relevancy level between the training well and the target well based on the predicted target well log of the target well and a measured target well log of the target well, and selecting relevant training wells among the plurality of training wells based on the relevancy levels associated with the plurality of training wells.

Abstract: Various semiconductor chips and packages are disclosed. In one aspect, an apparatus is provided that includes a semiconductor chip that has a side, and plural conductive pillars on the side. Each of the conductive pillars includes a pillar portion that has an exposed shoulder facing away from the semiconductor chip. The shoulder provides a wetting surface to attract melted solder. The pillar portion has a first lateral dimension at the shoulder. A solder cap is positioned on the pillar portion. The solder cap has a second lateral dimension smaller than the first lateral dimension.

Abstract: A chip for hybrid bonded interconnect bridging for chiplet integration, the chip comprising: a first chiplet; a second chiplet; an interconnecting die coupled to the first chiplet and the second chiplet through a hybrid bond.

Abstract: Various semiconductor chip packages are disclosed. In one aspect, a semiconductor chip package includes a package substrate that has a first side and a second side opposite to the first side. A semiconductor chip is mounted on the first side. Plural metal anchor structures are coupled to the package substrate and project away from the first side. A molding layer is on the package substrate and at least partially encapsulates the semiconductor chip and the anchor structures. The anchor structures terminate in the molding layer and anchor the molding layer to the package substrate.

Abstract: Compounds, compositions and methods are provided for mitochondrial modulation. The subject mitochondrial modulator compounds generally include a head group linked to a charged moiety. In certain cases, the head group is a heterocyclic or a heteroaryl group. Aspects of the subject methods include a method of modulating mitochondria. Aspects of the subject methods include treating a subject having a metabolic syndrome-related disease or a symptom thereof by administering to the subject a therapeutically effective amount of a subject compound. In certain cases, the disease is selected from hyperlipidemia, type 2 diabetes, fatty liver disease, obesity, cardiovascular disease and stroke. In certain cases, the symptom is selected from abdominal obesity, insulin resistance, hyperinsulinemia, high levels of blood fats, increased blood pressure, and elevated serum lipids.

Abstract: A method for storing emission rights for point and nonpoint source pollution based on internet of things is provided. In the method, agricultural nonpoint source pollution is monitored based on internet of things; monitoring data of the agricultural nonpoint source pollution is collected and processed; data on migration of the agricultural nonpoint source pollution is analyzed, and an emission reduction amount of storable nonpoint source pollution of the agricultural nonpoint source pollution is calculated; and the emission reduction amount of storable nonpoint source pollution is added to a regional emission rights storage system as reserve emission rights. In this way, the emission reduction amount of nonpoint source pollution can be allocated to industrial point source pollution, and it is possible to combine agricultural nonpoint source pollution emission reductions and industrial point source pollution emissions, to achieve free distribution therebetween.

Abstract: Various semiconductor chip packages are disclosed. In one aspect, a semiconductor chip package includes a package substrate that has a first side and a second side opposite to the first side. A semiconductor chip is mounted on the first side. Plural metal anchor structures are coupled to the package substrate and project away from the first side. A molding layer is on the package substrate and at least partially encapsulates the semiconductor chip and the anchor structures. The anchor structures terminate in the molding layer and anchor the molding layer to the package substrate.

Abstract: Various semiconductor chips with solder capped probe test pads are disclosed. In accordance with one aspect of the present invention, a semiconductor chip is provided that includes a substrate, plural input/output (I/O) structures on the substrate and plural test pads on the substrate. Each of the test pads includes a first conductor pad and a first solder cap on the first conductor pad.

Abstract: A chip for hybrid bonded interconnect bridging for chiplet integration, the chip comprising: a first chiplet; a second chiplet; an interconnecting die coupled to the first chiplet and the second chiplet through a hybrid bond.

Abstract: A monocular vision-based method for measuring displacement and trajectory of planar motion. In this method, a sequence image of a motion of a high-contrast feature mark fixed on a moving plane to be measured is collected using a camera. A sub-pixel coordinate of a feature edge of a linear motion of the sequence in an X direction and a Y direction is extracted using a sub-pixel edge detection method, and the sub-pixel coordinate is converted into a corresponding world coordinate. The world coordinate of the feature edge is fitted based on a least squares principle to obtain a straight line of the feature edge to realize decoupling measurement of a displacement in the X direction and the Y direction. The planar motion trajectory is obtained through measuring the displacement in the X direction and the Y direction.

Abstract: A method for triggering a search for a high-RAT network includes when it is detected that a WI-FI of a terminal device is disconnected, a terminal device moves out of an elevator, or a terminal device moves to another location with a better signal, the terminal device is triggered to start background searching for a network, and attempt to camp on and register with the high-RAT network.

Abstract: A (Z)-solanone has the steric formula of: or with the name of (S,Z)-5-isopropyl-8-methyl-6,8-diene-2-one or (R,Z)-5-isopropyl-8-methyl-6,8-diene-2-one. A process for the preparation of the (Z)-type solanone and the use thereof in flavoring of cigarette shred are further disclosed. The process includes the following steps: (1) reacting isopentanal and methyl vinyl ketone, under the action of a catalyst and a co-catalyst, to give (S)-2-isopropyl-5-carbonylhexanal or (R)-2-isopropyl-5-carbonylhexanal; (2) reacting the (S)-2-isopropyl-5-carbonylhexanal or the (R)-2-isopropyl-5-carbonylhexanal obtained in step (1) with (iodomethyl)triphenylphosphonium iodide, to give (S,Z)-7-iodo-5-isopropyl-6-ene-2-one or (R,Z)-7-iodo-5-isopropyl-6-ene-2-one; and (3) reacting the (S,Z)-7-iodo-5-isopropyl-6-ene-2-one or the (R,Z)-7-iodo-5-isopropyl-6-ene-2-one obtained in step (2) with pinacol isopropenylborate in the presence of a catalyst to give the (Z)-solanone.

Abstract: A (Z)-solanone has the steric formula of: with the name of (S,Z)-5-isopropyl-8-methyl-6,8-diene-2-one or (R,Z)-5-isopropyl-8-methyl-6,8-diene-2-one. A process for the preparation of the (Z)-type solanone and the use thereof in flavoring of cigarette shred are further disclosed. The process includes the following steps: (1) reacting isopentanal and methyl vinyl ketone, under the action of a catalyst and a co-catalyst, to give (S)-2-isopropyl-5-carbonylhexanal or (R)-2-isopropyl-5-carbonylhexanal; (2) reacting the (S)-2-isopropyl-5-carbonylhexanal or the (R)-2-isopropyl-5-carbonylhexanal obtained in step (1) with (iodomethyl)triphenylphosphonium iodide, to give (S,Z)-7-iodo-5-isopropyl-6-ene-2-one or (R,Z)-7-iodo-5-isopropyl-6-ene-2-one; and (3) reacting the (S,Z)-7-iodo-5-isopropyl-6-ene-2-one or the (R,Z)-7-iodo-5-isopropyl-6-ene-2-one obtained in step (2) with pinacol isopropenylborate in the presence of a catalyst to give the (Z)-solanone.

Abstract: Various semiconductor chips and packages are disclosed. In one aspect, an apparatus is provided that includes a semiconductor chip that has a side, and plural conductive pillars on the side. Each of the conductive pillars includes a pillar portion that has an exposed shoulder facing away from the semiconductor chip. The shoulder provides a wetting surface to attract melted solder. The pillar portion has a first lateral dimension at the shoulder. A solder cap is positioned on the pillar portion. The solder cap has a second lateral dimension smaller than the first lateral dimension.

Abstract: Disclosed is a polishing fluid for improving surfaces formed by fused deposition molding with ABS, consisting of 30%-40% by weight of polymethyl methacrylate and 60%-70% by weight of a mixture. This application further discloses a method of preparing the polishing fluid by mixing under heating. The polishing fluid provided herein can quickly form a film on surfaces of the workpiece to be processed and fill depressions of the surfaces of the workpiece while dissolving the protrusions on the surfaces to render the surfaces smooth and even.