Abstract: A light emitting semiconductor element includes at least two electrically conductive units, at least a light emitting semiconductor die and a light transmitting layer. A groove is located between the two electrically conductive units. The light emitting semiconductor die is cross over the electrically conductive units. The light transmitting layer covers the light emitting semiconductor and partially fills within the groove for linking the electrically conductive units.

Abstract: A light emitting semiconductor element includes at least two electrically conductive units, at least a light emitting semiconductor die and a light transmitting layer. A groove is located between the two electrically conductive units. The light emitting semiconductor die is cross over the electrically conductive units. The light transmitting layer covers the light emitting semiconductor and partially fills within the groove for linking the electrically conductive units.

Abstract: A light-emitting element includes two electrically conductive layers, a flexible insulating layer, a light-emitting chip and an encapsulating body. A groove is formed between the electrically conductive layers. The flexible insulating layer is disposed within the groove and links the electrically conductive layers. The light-emitting chip is placed on one of the electrically conductive layers or crossing over the flexible insulating layer. The light-emitting chip is electrically connected to the electrically conductive layers and covered by the encapsulating body.

Abstract: A light emitting element including an epitaxy layer, at least one first electrode, at least one second electrode, a first bonding pad and a second bonding pad. The epitaxy layer includes in sequence a first semiconductor layer, an active layer and a second semiconductor layer, and the first semiconductor layer has an exposed portion exposed from the second semiconductor layer and the active layer. The first electrode is disposed at the exposed portion. The second electrode is disposed at the second semiconductor layer. The first bonding pad is connected with the first electrode. The second bonding pad is connected with the second electrode. Two light emitting elements with different structures and the light emitting module utilizing the light emitting elements mentioned above are also disclosed.

Abstract: A light emitting semiconductor element includes at least two electrically conductive units, at least a light emitting semiconductor die and a light transmitting layer. A groove is located between the two electrically conductive units. The light emitting semiconductor die is cross over the electrically conductive units. The light transmitting layer covers the light emitting semiconductor and partially fills within the groove for linking the electrically conductive units.

Abstract: A lighting apparatus includes a circuit board, at least one LED, an optical element, a lampshade and at least one fluorescent material. The LED is disposed on the circuit board. The optical element is disposed above the LED, and has at least one reflective surface so that light emitted from the LED to the optical element partially penetrates through and is partially reflected by the optical element. The lampshade covers the circuit board, the LED and the optical element. The fluorescent material is doped within the lampshade.

Abstract: An illumination apparatus includes a first light-emitting device, a second light-emitting device, and a third light-emitting device. The light emitted from the third light-emitting device is selectively mixed with the light emitted from the first light-emitting device or the second light-emitting device to form a white light having a chromaticity coordinate point substantially located on a Black Body Locus. A color of the light emitted from the third light-emitting device is determined by linear relationships between chromaticity coordinate points corresponding to wavelengths of the lights emitted form the first light-emitting device and the second light-emitting device and corresponding to a color temperature of the white light. A method for generating a white light is also disclosed herein.

Abstract: A lighting apparatus includes a circuit board, a plurality of light-emitting diode (LED) units and an optical element. The optical element is transflective. The LED units and the optical element are disposed on the circuit board. The optical element has at least one reflective surface so that lights emitted from the LED units to the optical element partially penetrate through and are partially reflected by the optical element.

Abstract: A multi-directional bulb-type lamp is disclosed. The multi-directional bulb-type lamp includes a carrying body, a flexible substrate, and a plurality of LED dies. The flexible substrate is a substrate extending toward multi-directions and attached to the carrying body along a surface thereof. The LED dies are directly disposed on the flexible substrate and electrically connected thereto. Whereby, structures of the bulb-type lamp will be simplified for easy assembly, and multi-directional lighting will be reached.

Abstract: A light emitting diode comprises a multi-layer semiconductor, a first electrode and a second electrode. The multi-layer semiconductor has a light emitting active layer substantially perpendicular to the predetermined surface, a first semiconductor layer located on a surface of the light emitting active layer and a second semiconductor layer located on an opposite surface of the light emitting active layer. The first electrode is provided adjacent to and electrically connect to the first semiconductor layer. The second electrode is provided adjacent to and electrically connect to the second semiconductor layer. In addition, a method of fabricating LED element and a light emitting device having the LED elements are provided.

Abstract: A lighting device includes a lighting engine and at least a wavelength-converting element. The lighting engine includes a circuit board, a blue light emitting diode and a red light emitting diode. The blue light emitting diode and a red light emitting diode are disposed on the circuit board. The wavelength-converting element covers at least the blue light emitting diode. A wavelength-converted light is generated by converting a part of light emitted by the lighting engine through the wavelength-converting element. White light having a color temperature within a range from 2580K to 3220K on the black-body radiation of the CIE-1931 chromaticity diagram is generated by mixing the wavelength-converted light and non-converted light emitted by the lighting engine.

Abstract: A highly directional light source device, more specifically, a light emitting element electrically connected on a substrate to produce light, and one interior having a photon recycler with a reflective surface, covered and set on one side of this substrate, and an opening set in the center of the top of the cover which corresponds with the light emitting element, thereby allowing the light from the light emitting element to be directly emitted out the opening, and then to be reflected back to the light emitting element through the reflective surface of the photon recycler, and after light is reflected or refracted according to the structure of the light emitting element, again through the opening the light is emitted onto the photon recycler, thereby achieving increased Étendue of the highly directional light source device and achieving the goal of effective light emission.

Abstract: A LED package structure includes a supporting substrate, a first electrically-conductive structure, a LED chip, an insulating layer and a second electrically-conductive structure. The supporting substrate includes a top surface, a bottom surface and a first channel. The first electrically-conductive structure is filled in the first channel and partially formed on the top and bottom surfaces of the supporting substrate. The LED chip is disposed over the supporting substrate. The insulating layer is formed over the supporting substrate and on bilateral sides of the LED chip. The insulating layer has a second channel corresponding to the first electrically-conductive structure. The second electrically-conductive structure is filled in the second channel and partially formed on the insulating layer, and connected with an electrode of the LED chip. The LED chip and the top and bottom surfaces of the supporting substrate are connected with each other through the first and second electrically-conductive structures.

Abstract: A LED light source in a single package for raising the color-rendering index is provided. The LED light source comprises a substrate, at least one covering layer, a primary light source, and a secondary light source. The primary and the secondary light sources are formed on the substrate and coated with the at least one covering layer to provide a first output light and a second output light, respectively. The total output light is a mixed color of the first output light and the second output light.