Abstract: An access point for a home network is provided. The access point includes a processor circuit. When executing software, the processor circuit is configured to receive media stream data from a media source external to the access point. Further, the processor circuit is configured to generate output data for a display device based on the received media stream data. The access point also includes an output interface for connecting to the display device. The output interface is configured to output the output data.

Abstract: An aramid-mica composite insulating nanopaper and a preparation method thereof are disclosed. A mixture of mica and urea is subjected to a solid-phase ball milling, to obtain nano mica modified with amino groups on the surface, which is then assembled with the aramid nanofiber by stepwise suction filtration according to the present disclosure, to form an ordered nanopaper, thereby obtaining an aramid-mica composite insulating nanopaper with ultra-high insulation performances.

Abstract: A lithium ion electrolyte, a preparation method and application thereof are provided. The lithium ion electrolyte includes: an ester solvent, a lithium salt and an electrolyte additive, where the electrolyte additive includes a compound as shown in the following formula I. According to the electrolyte provided by the present disclosure, all components have a synergistic effect and are matched with one another, so that the electrolyte can improve the interface stability of a high-nickel positive electrode material and prolong the cycle life of a lithium ion battery and a lithium ion capacitor.

Abstract: A control system for a power tool is disclosed. The control system comprises: a sensing unit configured to sense an operating characteristic of the power tool; a first control unit configured to determine whether the operating characteristic is within a safe operational range, and to output a first control signal at least partially based on the determination; a second control unit configured to determine whether the operating characteristic is within a safe operational range independently of the first control unit, and to output a second control signal at least partially based on the determination; and an output unit configured to receive the first and second control signals and to activate the power tool when the first and second control signals are received.

Abstract: An electronic device includes a circuit board, a shielding member, and a testing pin. The circuit board includes a grounding area. The shielding member is located on a side of the circuit board and includes a shielding layer and an insulating layer. The shielding layer is electrically connected to the grounding area. The insulating layer is located on a side of the shielding layer away from the circuit board. The testing pin is disposed on the circuit board and electrically connected to the shielding layer.

Abstract: A motor driven apparatus including a motor, a first switching module and a second switching module on a current path from one terminal of a battery to another terminal of the battery, and a MCU connected to the first and second switching module. The first and second switching module are connected in series to each other, while the first switching module is connected to the motor and adapted to drive the motor. The MCU is adapted to control the first second switching module separately. The MCU is further adapted to, upon its energization, attempt to control the second switching module to be in a cut-off state until the MCU determines that the first switching module is normal. The MCU attempts to detect failures of the switching elements in the first switching module before it enables operation of the motor.

Abstract: A semiconductor device package includes a substrate, a first electronic component, a second electronic component, a package body and a shield. The substrate has a first surface and a second surface opposite to the first surface. The substrate defines a cavity from the second surface extending into the substrate. The first electronic component is disposed on the first surface of the substrate. The second electronic component is disposed within the cavity of the substrate. The package body is disposed on a portion of the first surface of the substrate and covers the first electronic component. The shield is disposed on external surfaces of the package body.

Abstract: A lithium ion electrolyte, a preparation method and application thereof are provided. The lithium ion electrolyte includes: an ester solvent, a lithium salt and an electrolyte additive, where the electrolyte additive includes a compound as shown in the following formula I. According to the electrolyte provided by the present disclosure, all components have a synergistic effect and are matched with one another, so that the electrolyte can improve the interface stability of a high-nickel positive electrode material and prolong the cycle life of a lithium ion battery and a lithium ion capacitor.

Abstract: Techniques are disclosed relating to automatically generating and analyzing database queries. In various embodiments, a database inquiry assistance system maintains a first machine learning model trained using query history data for a database and a second machine learning model using analysis history for the database. In an embodiment, the system receives from a user system a request for an inquiry into data stored in the database and identifies a sequence of queries for responding to the request, where identifying the sequence of queries includes applying the second machine learning model to the request. The system generates corresponding database query code for implementing one or more of the queries in the sequence of queries, where generating the corresponding database query code includes applying the first machine learning model to descriptors of one or more of the queries, and sends a plan identifying the sequence of queries to the user system.

Abstract: The technology provides for a wireless charger. The wireless charger may have a transmitter antenna array, one or more detectors, one or more sensors, and one or more processors. For instance, the processors may determine, based on signals from the detectors, that one or more receiver antennas are located within a near-field range of the transmitter antenna array. The processors may then control the transmitter antenna array to focus electromagnetic waves on a first receiver antenna of the one or more receiver antennas, and control the transmitter antenna array to transmit power to the first receiver antenna. In some instances, the processors may further determine, based on signals from the sensors, that a person is located within the near-field range of the transmitter antenna array. Based on this determination, the processors may control the transmitter antenna array to stop transmitting power to the first receiver antenna.

Abstract: A transceiver module includes a housing, a circuit board and a pull member. The housing has a received space and a guiding slot. The circuit board is disposed in the received space. The pull member is connected to the housing, and the pull member has a plate-shaped structure and an engaging structure. The plate-shaped structure extends along a long axis, and the engaging structure has a first curved portion connected to the plate-shaped structure. The plate-shaped structure forms two notches, and the engaging structure is located between the two notches.

Abstract: Methods, systems, and devices for techniques for error correction at a memory device are described. In some examples, as part of transmitting a command to access data stored at a memory device, a host device may transmit a combined error control code to the memory device that may be generated using the command and associated inversion information. The memory device may use the received combined error control code to perform an error control procedure on both the command and the inversion information. In some examples, while in a direct link error control code procedure mode, the host system may transmit a command to access data stored at the memory device. The host system may use a same pin or channel to transmit both an error control code for the command and an error control code for the associated data.

Abstract: An interface of integrated circuit (IC) die includes a plurality of the contact elements formed as a contact element pattern corresponding to a parallel bus. The contact elements are arranged in an array of rows and columns and divided into a transmitting group and a receiving group. The contact elements of the transmitting group have a first contact element sequence and the contact elements of the receiving group have a second contact element sequence, the first contact element sequence is identical to the second contact element sequence. The contact elements with the first contact element sequence and the second contact element sequence are matched when the contact element pattern is geometrically rotated by 180° with respect to a row direction and a column direction.

Abstract: The disclosure provides a structure diagnosis system and a structure diagnosis method. The structure diagnosis system includes: a lidar scanner scanning a structure to generate a point cloud data; an input interface receiving the point cloud data; and a processor receiving the point cloud data and generating a point cloud data set. The processor executes a surface degradation and geometry abnormal coupling diagnosis module to: marking a first point cloud range of a surface degradation area according to color space value of the point cloud data set; marking a second point cloud range of a geometry abnormal area according to coordinate value of the point cloud data set; when an abnormal area includes the first point cloud range and the second point cloud range at least partially overlapping each other, determining surface degradation or geometry abnormal occurring at the abnormal area and mark the abnormal area with a predetermined mode.

Abstract: A positioning structure adapted for installing and fixing at least two storage devices having different sizes is provided. Each storage device has a plugging end and a fixing end. The positioning structure includes a casing, a socket disposed on the casing, at least two position-limiting components protruding from the casing, and a fixing bracket detachably engaged with any one of the position-limiting components. The plugging end of each storage device is adapted to be plugged into the socket. The position-limiting components respectively keep a first distance and a second distance greater than the first distance from the socket. According to the size of the storage device to be installed, the fixing bracket is engaged with the position-limiting component keeping the first distance from the socket or the position-limiting component keeping the second distance from the socket to fix the fixing end of the storage device to the fixing bracket.

Abstract: The present disclosure provides a semiconductor package structure and a method of manufacturing the same. The semiconductor package structure includes a substrate, a first electronic component, an interlayer, a third electronic component and an encapsulant. The first electronic component is disposed on the substrate. The first electronic component has an upper surface and a lateral surface and a first edge between the upper surface and the lateral surface. The interlayer is on the upper surface of the first electronic component. The third electronic component is attached to the upper surface of the first electronic component via the interlayer. The encapsulant encapsulates the first electronic component and the interlayer. The interlayer does not contact the lateral surface of the first electronic component.

Abstract: A method of processing liquid crystal polymer film is provided. The method includes the following steps. A metal substrate is provided. A liquid crystal polymer film is provided. The liquid crystal polymer film and the metal substrate are laminated to form a composite layer. The composite layer is heated at a first temperature and a processed liquid crystal polymer film is obtained through the separation of the heated liquid crystal polymer film from the substrate. A processing device of liquid crystal polymer film is further provided, including a lamination member, a transport member, a heating member, and a separation member.

Abstract: Methods, systems, and devices for techniques for error correction at a memory device are described. In some examples, as part of transmitting a command to access data stored at a memory device, a host device may transmit a combined error control code to the memory device that may be generated using the command and associated inversion information. The memory device may use the received combined error control code to perform an error control procedure on both the command and the inversion information. In some examples, while in a direct link error control code procedure mode, the host system may transmit a command to access data stored at the memory device. The host system may use a same pin or channel to transmit both an error control code for the command and an error control code for the associated data.

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first substrate and a second substrate. The first substrate has a first surface and a second surface opposite to the first surface of the first substrate. The second substrate has a first surface facing the first substrate and a second surface opposite to the first surface of the second substrate. The semiconductor device package also includes a first electronic component disposed on the first surface of the second substrate and electrically connected to the first surface of the second substrate. The semiconductor device package also includes a first encapsulant and a second encapsulant between the first substrate and the second substrate. The first encapsulant is different from the second encapsulant. A method of manufacturing a semiconductor device package is also disclosed.