Abstract: An electronic device is provided, including a main body and a camera module. The camera module has a frame, a lens unit disposed in the frame, a guiding member, and a hinge. The guiding member is affixed to the main body and has a rail and a spring sheet. The hinge pivotally connects to the frame and the guiding member. When the camera module is in the retracted position, the camera module is hidden in a recess of the main body. When the camera module slides out of the recess from the retracted position along the rail into the operational position, the spring sheet is pressed by the hinge to increase the friction between the hinge and the guiding member.

Abstract: A hybrid RF-acoustic relay is provided where some but not all of the incident RF power is rectified to power the relay and, optionally, to provide power for further link features. The remaining fraction of the incident RF power is used to directly drive an acoustic transceiver array in communication with one or more acoustically powered nodes. In this manner, power, control and communication can be efficiently provided to acoustically powered nodes even in situations where an RF link or an acoustic link would perform poorly.

Abstract: A method of processing liquid crystal polymer film is provided. The method includes the following steps. A metal substrate is provided. A liquid crystal polymer film is provided. The liquid crystal polymer film and the metal substrate are laminated to form a composite layer. The composite layer is heated at a first temperature and a processed liquid crystal polymer film is obtained through the separation of the heated liquid crystal polymer film from the substrate. A processing device of liquid crystal polymer film is further provided, including a lamination member, a transport member, a heating member, and a separation member.

Abstract: A method, system, and computer program product for data reorganization and logs reorganization. The method includes receiving, by one or more processing units, original data. The method also includes classifying, by the one or more processing units, the original data into different types based on a trained type classification model. The method also includes generating, by the one or more processing units, at least one severity for at least part of the original data based on a trained severity classification model, the at least part of the original data corresponding to at least one type. The method also includes outputting, by the one or more processing units, at least one message, the at least one message indicating the severity of the at least part of the original data.

Abstract: A sound source device and a signal receiver are disposed at first and second ports of a target object, respectively. A sound of a specific frequency of the sound source device is introduced into the target object to generate a resonant sound wave. A computer simulates a signal generated when the resonant sound wave is received by the signal receiver and regarding the signal as reference information. The reference information comprises first data having characteristics of the resonant sound wave, and data having features of an imaginary defect formed on the target object. The features of the imaginary defect correspond to the characteristics of the resonant sound wave. When the target object has a real defect, the sound of the specific frequency of the sound source device is introduced into the target object. Features of the real defect are derived by comparing the first data with the second data.

Abstract: The disclosure relates to resource recycling, and more particularly to a green and efficient method for recycling waste aramid-mica composite paper. The method includes: dissolution of aramid-mica composite paper scraps, separation of mica flakes; phase separation, filtration, recycling of organic solvent and collection of aramid fiber.

Abstract: An aramid-mica composite insulating nanopaper and a preparation method thereof are disclosed. A mixture of mica and urea is subjected to a solid-phase ball milling, to obtain nano mica modified with amino groups on the surface, which is then assembled with the aramid nanofiber by stepwise suction filtration according to the present disclosure, to form an ordered nanopaper, thereby obtaining an aramid-mica composite insulating nanopaper with ultra-high insulation performances.

Abstract: The present disclosure provides a semiconductor package structure and a method of manufacturing the same. The semiconductor package structure includes a substrate, a first electronic component, an interlayer, a third electronic component and an encapsulant. The first electronic component is disposed on the substrate. The first electronic component has an upper surface and a lateral surface and a first edge between the upper surface and the lateral surface. The interlayer is on the upper surface of the first electronic component. The third electronic component is attached to the upper surface of the first electronic component via the interlayer. The encapsulant encapsulates the first electronic component and the interlayer. The interlayer does not contact the lateral surface of the first electronic component.

Abstract: An acoustic resonance diagnostic method for detecting structural degradation is provided. The method includes steps as follows: Firstly, a training model is built using a deep neural network. At least two training acoustic signals are inputted to the training model to carry a training. A diagnostic model is built according to a result of the training using a CNN. A plurality of under-test sound wave signals are captured from an under-test section of an under-test structure. An AI is used to filter data invalid for detecting structural degradation from the under-test sound wave signals. A structural degradation state of the under-test section is determined according to a remaining portion of the under-test sound wave signals through the diagnostic model.

Abstract: A method of processing liquid crystal polymer film is provided. The method includes the following steps. A metal substrate is provided. A liquid crystal polymer film is provided. The liquid crystal polymer film and the metal substrate are laminated to form a composite layer. The composite layer is heated at a first temperature and a processed liquid crystal polymer film is obtained through the separation of the heated liquid crystal polymer film from the substrate. A processing device of liquid crystal polymer film is further provided, including a lamination member, a transport member, a heating member, and a separation member.

Abstract: Disclosed in the present invention are a method and a system for monitoring unmanned aerial vehicles based on three-dimensional light field technology. Provided is an unmanned aerial vehicle monitoring method based on three-dimensional light field technology, comprising: beginning unmanned aerial vehicle monitoring; by means of a light field camera, acquiring low resolution video image information; determining whether the acquired video image information is an unmanned aerial vehicle; performing graphic reconstruction on an unmanned aerial vehicle image therein; and acquiring reconstructed light field image depth and position information to monitor the unmanned aerial vehicle and emitting an alert. The method and the system for monitoring in the present invention are able to acquire a clear stereoscopic image, thus raising efficiency and accuracy in the process of unmanned aerial vehicle monitoring or detection.

Abstract: The disclosure provides a structure diagnosis system and a structure diagnosis method. The structure diagnosis system includes: a lidar scanner scanning a structure to generate a point cloud data; an input interface receiving the point cloud data; and a processor receiving the point cloud data and generating a point cloud data set. The processor executes a surface degradation and geometry abnormal coupling diagnosis module to: marking a first point cloud range of a surface degradation area according to color space value of the point cloud data set; marking a second point cloud range of a geometry abnormal area according to coordinate value of the point cloud data set; when an abnormal area includes the first point cloud range and the second point cloud range at least partially overlapping each other, determining surface degradation or geometry abnormal occurring at the abnormal area and mark the abnormal area with a predetermined mode.

Abstract: An interface of integrated circuit (IC) die includes a plurality of the contact elements formed as a contact element pattern corresponding to a parallel bus. The contact elements are arranged in an array of rows and columns and divided into a transmitting group and a receiving group. The contact elements of the transmitting group have a first contact element sequence and the contact elements of the receiving group have a second contact element sequence, the first contact element sequence is identical to the second contact element sequence. The contact elements with the first contact element sequence and the second contact element sequence are matched when the contact element pattern is geometrically rotated by 180° with respect to a row direction and a column direction.

Abstract: Disclosed is a light field technology-based unmanned aerial vehicle monitoring system. Said unmanned aerial vehicle monitoring system comprises: a first camera, configured to continuously obtain image information in a monitored area; a second camera, the second camera being a light field camera including a compound eye lens, and being configured to obtain, when it is determined that the obtained image information is of an unmanned aerial vehicle, light field information of the unmanned aerial vehicle; a vertical rotating platform and a horizontal rotating platform arranged perpendicular to each other, wherein the first camera and the second camera can rotate synchronously under the control of the vertical rotating platform and the horizontal rotating platform; and a computer processor, configured to calculate depth information of the unmanned aerial vehicle by means of the obtained light field information so as to obtain the position of the unmanned aerial vehicle.

Abstract: The disclosure discloses nano TiO2-doped anti-ultraviolet para-aramid nano paper and a preparation method thereof. First, nano TiO2 is selected as an ultraviolet absorbent which has a good absorption effect on ultraviolet rays, and the anti-ultraviolet characteristic of aramid paper-based material can be well improved through addition of nano TiO2. Second, macroscopic para-aramid fiber is dissolved under the action of a DMSO/KOH system, and the surface of the prepared aramid nano fiber is rich in C?O and N—H. This method is simple in process and does not harm the fiber itself, and can effectively improve the mechanical strength, interface binding performance and processability of a base material. The nano TiO2-doped anti-ultraviolet para-aramid nano paper prepared by the disclosure is simple in preparation process, excellent in material property.

Abstract: A positioning structure adapted for installing and fixing at least two storage devices having different sizes is provided. Each storage device has a plugging end and a fixing end. The positioning structure includes a casing, a socket disposed on the casing, at least two position-limiting components protruding from the casing, and a fixing bracket detachably engaged with any one of the position-limiting components. The plugging end of each storage device is adapted to be plugged into the socket. The position-limiting components respectively keep a first distance and a second distance greater than the first distance from the socket. According to the size of the storage device to be installed, the fixing bracket is engaged with the position-limiting component keeping the first distance from the socket or the position-limiting component keeping the second distance from the socket to fix the fixing end of the storage device to the fixing bracket.

Abstract: An acoustic resonance diagnostic method for detecting structural degradation is provided. The method includes steps as follows: Firstly, a training model is built using a deep neural network. At least two training acoustic signals are inputted to the training model to carry a training. A diagnostic model is built according to a result of the training using a convolutional neural network. An under-test sound wave signal is captured from an under-test section of an under-test structure through direct contact, non-contact, or indirect contact. A structural degradation state of the under-test section is determined according to the under-test sound wave signal through the diagnostic model.

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first substrate and a second substrate. The first substrate has a first surface and a second surface opposite to the first surface of the first substrate. The second substrate has a first surface facing the first substrate and a second surface opposite to the first surface of the second substrate. The semiconductor device package also includes a first electronic component disposed on the first surface of the second substrate and electrically connected to the first surface of the second substrate. The semiconductor device package also includes a first encapsulant and a second encapsulant between the first substrate and the second substrate. The first encapsulant is different from the second encapsulant. A method of manufacturing a semiconductor device package is also disclosed.

Abstract: A semiconductor device package includes a substrate, a first electronic component, a second electronic component, a package body and a shield. The substrate has a first surface and a second surface opposite to the first surface. The substrate defines a cavity from the second surface extending into the substrate. The first electronic component is disposed on the first surface of the substrate. The second electronic component is disposed within the cavity of the substrate. The package body is disposed on a portion of the first surface of the substrate and covers the first electronic component. The shield is disposed on external surfaces of the package body.