Patents by Inventor Li Lin
Li Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11977979Abstract: Systems and techniques are provided for generating one or more models. For example, a process can include obtaining a plurality of input images corresponding to faces of one or more people during a training interval. The process can include determining a value of the coefficient representing at least the portion of the facial expression for each of the plurality of input images during the training interval. The process can include determining, from the determined values of the coefficient representing at least the portion of the facial expression for each of the plurality of input images during the training interval, an extremum value of the coefficient representing at least the portion of the facial expression during the training interval. The process can include generating an updated bounding value for the coefficient representing at least the portion of the facial expression based on the initial bounding value and the extremum value.Type: GrantFiled: July 23, 2021Date of Patent: May 7, 2024Assignee: QUALCOMM IncorporatedInventors: Kuang-Man Huang, Min-Hui Lin, Ke-Li Cheng, Michel Adib Sarkis
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Patent number: 11979971Abstract: An extreme ultra violet (EUV) radiation source apparatus includes a collector mirror, a target droplet generator for generating a tin (Sn) droplet, a rotatable debris collection device, one or more coils for generating an inductively coupled plasma (ICP), a gas inlet for providing a source gas for the ICP, and a chamber enclosing at least the collector mirror and the rotatable debris collection device. The gas inlet and the one or more coils are configured such that the ICP is spaced apart from the collector mirror.Type: GrantFiled: April 10, 2019Date of Patent: May 7, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yen-Shuo Su, Chun-Lin Chang, Han-Lung Chang, Li-Jui Chen, Po-Chung Cheng
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Publication number: 20240145398Abstract: A carrier structure is provided, in which at least one positioning area is defined on a chip-placement area of a package substrate, and at least one alignment portion is disposed on the positioning area. Therefore, the precision of manufacturing the alignment portion is improved by disposing the positioning area on the chip-placement area, such that the carrier structure can provide a better alignment mechanism for the chip placement operation.Type: ApplicationFiled: December 8, 2022Publication date: May 2, 2024Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Cheng-Liang HSU, Wan-Rou CHEN, Hsin-Yin CHANG, Tsung-Li LIN, Hsiu-Jung LI, Chiu-Lien LI, Fu-Quan XU, Yi-Wen LIU, Chih-Chieh SUN
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Publication number: 20240146205Abstract: A flyback power converter includes a power transformer, a first lossless voltage conversion circuit, a first low-dropout linear regulator and a secondary side power supply circuit. The first low-dropout linear regulator (LDO) generates a first operation voltage as power supply for being supplied to a sub-operation circuit. The secondary side power supply circuit includes a second lossless voltage conversion circuit and a second LDO. The second LDO generates a second operation voltage. The first operation voltage and the second operation voltage are shunted to a common node. When a first lossless conversion voltage is greater than a first threshold voltage, the second LDO is enabled to generate the second operation voltage to replace the first operation voltage as power supply supplied to the sub-operation circuit; wherein the second lossless conversion voltage is lower than the first lossless switching voltage.Type: ApplicationFiled: September 23, 2023Publication date: May 2, 2024Inventors: Shin-Li Lin, He-Yi Shu, Shih-Jen Yang, Ta-Yung Yang, Yi-Min Shiu, Chih-Ching Lee, Yu-Chieh Hsieh, Chao-Chi Chen
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Publication number: 20240144890Abstract: A backlight control circuit for a surface light emitting device is provided. The backlight control circuit includes a driving circuit. The driving circuit is configured to generate a plurality of driving currents to drive the surface light emitting device such that a plurality of backlight blocks of the surface light emitting device generate a plurality of brightness values. The surface light emitting device is divided into a first backlight area and a second backlight area. The second backlight area is closer to an edge of the surface light emitting device than the first backlight area. A first driving current of the plurality of driving currents is utilized for driving the light source of the first backlight area. A second driving current of the plurality of driving currents is utilized for driving the light source of the second backlight area. The second driving current is greater than the first driving current.Type: ApplicationFiled: January 2, 2024Publication date: May 2, 2024Applicant: Radiant Opto-Electronics CorporationInventors: Li-Fei Wang, Yu-Lin Hsieh, Sheng-Kai Fang, Pei-Ling Kao
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Publication number: 20240147867Abstract: Magnetoelectric magnetic tunnel junction (MEMTJ) logic devices comprise a magnetoelectric switching capacitor coupled to a pair of magnetic tunnel junctions (MTJs) by a conductive layer. The logic state of the MEMTJ is represented by the magnetization orientation of the ferromagnetic layer of the magnetoelectric capacitor, which can be switched through the application of an appropriate input voltage to the MEMTJ. The magnetization orientation of the magnetoelectric capacitor ferromagnetic layer is read out by the MTJs. The conductive layer is positioned between the capacitor and the MTJs. The MTJ ferromagnetic free layers are exchange coupled to the ferromagnetic layer of the magnetoelectric capacitor. The potential of an MTJ free layer is based on a supply voltage applied to the reference layer of the MTJ. The MTJ reference layers have a magnetization orientation that is parallel or antiparallel to the magnetization orientations of the ferromagnetic layer of the magnetoelectric capacitor.Type: ApplicationFiled: October 31, 2022Publication date: May 2, 2024Applicant: Intel CorporationInventors: Punyashloka Debashis, Dominique A. Adams, Hai Li, Chia-Ching Lin, Dmitri Evgenievich Nikonov, Kaan Oguz, John J. Plombon, Ian Alexander Young
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Publication number: 20240145632Abstract: A micro light emitting device includes an epitaxial structure, a conductive layer, and a first insulating layer. The epitaxial structure has a first surface and a second surface opposite to the first surface, and includes a first semiconductor layer, an active layer and a second semiconductor layer that are arranged in such order in a direction from the first surface to the second surface. The conductive layer is formed on a surface of the first semiconductor layer away from the active layer. The first insulating layer is formed on the surface of the first semiconductor layer away from the active layer, and exposes at least a part of the conductive layer.Type: ApplicationFiled: October 23, 2023Publication date: May 2, 2024Inventors: Ming-Chun TSENG, Shaohua HUANG, Hongwei WANG, Kang-Wei PENG, Su-Hui LIN, Xiaomeng LI, Chi-Ming TSAI, Chung-Ying CHANG
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Publication number: 20240145653Abstract: A manufacturing method of a display device includes forming light emitting components on a first substrate, the light emitting components include a first side and a second side, and the second side is away from the first substrate; forming a circuit layer on the first substrate and on the second side of the light emitting components; forming a first protective layer on the circuit layer and forming an insulating layer on the first protective layer; removing the first substrate after forming a second substrate on the insulating layer; forming a black matrix layer on the first side of the light emitting components, and the black matrix layer includes openings; forming light conversion layers in the openings of the black matrix layer; forming a second protective layer on the black matrix layer and the light conversion layers; and forming a third substrate on the second protective layer.Type: ApplicationFiled: May 12, 2023Publication date: May 2, 2024Applicant: HANNSTAR DISPLAY CORPORATIONInventors: Chun-I Chu, Yu-Chi Chiao, Yung-Li Huang, Hung-Ming Chang, Cheng-Yu Lin, Huan-Hsun Hsieh, CHeng-Pei Huang
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Patent number: 11974311Abstract: A method for wireless communication performed by a user equipment (UE) is provided. The method includes receiving, from a base station (BS), a Radio Resource Control (RRC) configuration to configure a first semi-persistent scheduling (SPS) physical downlink shared channel (PDSCH) and generating first uplink control information (UCI) in response to the first SPS PDSCH, where the RRC configuration includes a first parameter that indicates a priority of the first UCI.Type: GrantFiled: March 1, 2023Date of Patent: April 30, 2024Assignee: Hannibal IP LLCInventors: Wan-Chen Lin, Yu-Hsin Cheng, Heng-Li Chin, Hsin-Hsi Tsai
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Patent number: 11969844Abstract: A method for detecting and compensating CNC tools being implemented in an electronic device, receives from a detector first parameters and second parameters in respect of a first tool. Such first parameters include at least one of service life, blade break information, and blade chipping information of the first tool, and such second parameters include at least one of length extension information, length wear information, radial wear information, and blade thickness wear information of the first tool. Based on the first parameters, instructions to process the workpiece are transmitted or not. Upon receiving the second parameters, instructions to adjust operation of the first tool are transmitted, to compensate for deterioration in normal use.Type: GrantFiled: April 12, 2021Date of Patent: April 30, 2024Assignee: Fulian Yuzhan Precision Technology Co., LtdInventors: Hsing-Chih Hsu, Zhao-Yao Yi, Lei Zhu, Chang-Li Zhang, Er-Yang Ma, Chih-Sheng Lin, Feng Xie, Ming-Tao Luo
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Patent number: 11974410Abstract: Aspects discussed herein include an electronic device and an associated connector interface. The electronic device comprises an enclosure that defines an internal volume, a plurality of external surfaces, and a recess from an external surface of the plurality of external surfaces. The recess has circumferential slot(s) extending to the external surface and that receive flange(s) of an external connector. The electronic device further comprises a connector interface connected with one or more electronic components disposed in the internal volume. The connector interface comprises first conductor(s) that are exposed at the recess. While the flange(s) are received in the circumferential slot(s), rotation of the external connector causes the flange(s) to slide within the circumferential slot(s) into a retained position, in which second conductor(s) of the external connector, having a fixed disposition relative to the flange(s), are connected to the first conductor(s).Type: GrantFiled: August 5, 2022Date of Patent: April 30, 2024Assignee: Samsara, Inc.Inventors: Jennifer Lin, Christian Almer, Somasundara Pandian, Li-Wei Cheng, David Gal
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Patent number: 11972974Abstract: An IC structure includes a transistor, a source/drain contact, a metal oxide layer, a non-metal oxide layer, a barrier structure, and a via. The transistor includes a gate structure and source/drain regions on opposite sides of the gate structure. The source/drain contact is over one of the source/drain regions. The metal oxide layer is over the source/drain contact. The non-metal oxide layer is over the metal oxide layer. The barrier structure is over the source/drain contact. The barrier structure forms a first interface with the metal oxide layer and a second interface with the non-metal oxide layer, and the second interface is laterally offset from the first interface. The via extends through the non-metal oxide layer to the barrier structure.Type: GrantFiled: January 13, 2022Date of Patent: April 30, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Sung-Li Wang, Shuen-Shin Liang, Yu-Yun Peng, Fang-Wei Lee, Chia-Hung Chu, Mrunal Abhijith Khaderbad, Keng-Chu Lin
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Patent number: 11973302Abstract: The present disclosure provides a method for aligning a master oscillator power amplifier (MOPA) system. The method includes ramping up a pumping power input into a laser amplifier chain of the MOPA system until the pumping power input reaches an operational pumping power input level; adjusting a seed laser power output of a seed laser of the MOPA system until the seed laser power output is at a first level below an operational seed laser power output level; and performing a first optical alignment process to the MOPA system while the pumping power input is at the operational pumping power input level, the seed laser power output is at the first level, and the MOPA system reaches a steady operational thermal state.Type: GrantFiled: February 20, 2023Date of Patent: April 30, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chun-Lin Louis Chang, Henry Tong Yee Shian, Alan Tu, Han-Lung Chang, Tzung-Chi Fu, Bo-Tsun Liu, Li-Jui Chen, Po-Chung Cheng
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Publication number: 20240136681Abstract: A battery cover includes a top cover assembly and an insulating support. The top cover assembly can be fixedly connected with a case to form an accommodation space for accommodating a core, and the top cover assembly can be welded with a tab on the core. The insulating support can be accommodated in the accommodation space. The insulating support and the top cover assembly form an accommodation cavity for accommodating the tab, and the insulating support is provided with a notch for the tab to pass through.Type: ApplicationFiled: September 4, 2023Publication date: April 25, 2024Inventors: Chenneng LIN, Liquan CHEN, Shuaishuai SONG, Li GONG, Shansong WU, Dongmei SONG, Lei WU, Jin TAN
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Publication number: 20240132887Abstract: Disclosed herein are, inter alia, inhibitors of protein arginine methyltransferase 9 and pharmaceutical compositions thereof, and methods comprising the use of protein arginine methyltransferase 9 inhibitors for the treatment of a protein arginine methyltransferase 9-modulated disease or disorder, such as a hematological cancer.Type: ApplicationFiled: October 6, 2023Publication date: April 25, 2024Applicants: City of Hope, Western University of Health SciencesInventors: Ling Li, Haojie Dong, Lei Zhang, Xin He, Yun Lyna Luo, Yi-Chun Lin
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Patent number: 11964201Abstract: A modular pneumatic somatosensory device comprises a main body, a plurality of airbags, a plurality of inflating modules and a control module. The airbags are detachably disposed at different positions of the main body, and at least a part of the airbags have different sizes. The inflating modules are detachably disposed on the main body, and each inflating module is correspondingly connected with at least one of the airbags. The control module is detachably disposed on the main body and is electrically connected with the inflating modules. The control module controls the inflating modules to inflate the corresponding airbags according to a control signal.Type: GrantFiled: February 3, 2022Date of Patent: April 23, 2024Assignee: NATIONAL YANG MING CHIAO TUNG UNIVERSITYInventors: Jen-Hui Chuang, June-Hao Hou, Chi-Li Cheng, Han-Ting Lin
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Publication number: 20240128233Abstract: A sensor package structure and a manufacturing method thereof are provided. The sensor package structure includes a substrate, a fixing adhesive layer disposed on the substrate, a sensor chip adhered to the fixing adhesive layer, an annular adhering layer disposed on the sensor chip, a light-permeable sheet adhered to the annular adhering layer, and a plurality of metal wires that are electrically coupled to the substrate and the sensor chip. The size of the light-permeable sheet is smaller than that of the sensor chip.Type: ApplicationFiled: June 6, 2023Publication date: April 18, 2024Inventors: CHIA-SHUAI CHANG, WEN-FU YU, BAE-YINN HWANG, WEI-LI WANG, CHIEN-HUNG LIN
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Publication number: 20240128291Abstract: A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a light-permeable layer, an adhesive layer having a ring-shape and sandwiched between the sensor chip and the light-permeable layer, and an encapsulant formed on the substrate. The adhesive layer has two adhering surfaces having a same area and a middle cross section located at a middle position between the two adhering surfaces. An area of the middle cross section is 115% to 200% of an area of any one of the two adhering surfaces. The adhesive layer can provide for light to travel therethrough, and enables the light therein to change direction and to attenuate. The sensor chip, the adhesive layer, and the light-permeable layer are embedded in the encapsulant, and an outer surface of the light-permeable layer is at least partially exposed from the encapsulant.Type: ApplicationFiled: June 6, 2023Publication date: April 18, 2024Inventors: CHIA-SHUAI CHANG, CHIEN-HUNG LIN, WEI-LI WANG, WEN-FU YU, BAE-YINN HWANG
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Publication number: 20240128139Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate along a predetermined direction for being electrically coupled to each other, a light-permeable layer, an adhesive layer having a ring-shape and sandwiched between the sensor chip and the light-permeable layer, and an encapsulant formed on the substrate. The adhesive layer is formed with at least one type of a buffering cavity, wave-shaped slots, and rectangular slots, which penetrate therethrough along the predetermined direction. The buffering cavity can be located in the adhesive layer, and any one type of the wave-shaped slots and the rectangular slots can be respectively recessed in an inner side and an outer side of the adhesive layer. A minimum width of the adhesive layer is greater than or equal to 50% of a predetermined width between the inner side and the outer side.Type: ApplicationFiled: June 6, 2023Publication date: April 18, 2024Inventors: WEI-LI WANG, JYUN-HUEI JIANG, WEN-FU YU, BAE-YINN HWANG, CHIEN-HUNG LIN
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Patent number: 11960082Abstract: An object detection method is suitable for a virtual reality system. The object detection method includes a plurality of first cameras of a head-mounted display (HMD) to capture a plurality of first frames. A plurality of second frames are captured through a plurality of second cameras in a tracker, wherein, the object detector searches for the object position in the first frames and the second frames.Type: GrantFiled: July 13, 2022Date of Patent: April 16, 2024Assignee: HTC CORPORATIONInventors: Jyun-Jhong Lin, Chun-Kai Huang, Heng-Li Hsieh, Yun-Jung Chang