Patents by Inventor Li Yang

Li Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240121071
    Abstract: Methods and apparatuses are described herein for multiple access schemes for Wireless Local Area Network (WLAN) with full-duplex radios. For example, an access point (AP), in response to receiving a request to send (RTS) from a first station (STA), may transmit a full-duplex clear to send (FD CTS) to the first STA and a full-duplex request to send (FD RTS) to a second STA. In response to transmitting the FD RTS to the second STA, the AP may receive a clear to send (CTS) from the second STA. The AP may transmit, to both the first STA and the second STA, a FD trigger frame that includes scheduling information to enables FD communication with the first STA for uplink (UL) data and the second STA for downlink (DL) data at a same time. The scheduling information may include timing information and channel information for the FD communication.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 11, 2024
    Applicant: INTERDIGITAL PATENT HOLDINGS, INC.
    Inventors: Oghenekome Oteri, Hanqing Lou, Li Hsiang Sun, Alphan Sahin, Robert L. Olesen, Xiaofei Wang, Rui Yang
  • Patent number: 11955378
    Abstract: A bonding method of package components and a bonding apparatus are provided. The method includes: providing at least one first package component and a second package component, wherein the at least one first package component has first electrical connectors and a first dielectric layer at a bonding surface of the at least one first package component, and the second package component has second electrical connectors and a second dielectric layer at a bonding surface of the second package component; bringing the at least one first package component and the second package component in contact, such that the first electrical connectors approximate or contact the second electrical connectors; and selectively heating the first electrical connectors and the second electrical connectors by electromagnetic induction, in order to bond the first electrical connectors with the second electrical connectors.
    Type: Grant
    Filed: July 29, 2022
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Li Hsiao, Chih-Hang Tung, Chen-Hua Yu, Tung-Liang Shao, Su-Chun Yang
  • Patent number: 11955423
    Abstract: Methods for forming dummy under-bump metallurgy structures and semiconductor devices formed by the same are disclosed. In an embodiment, a semiconductor device includes a first redistribution line and a second redistribution line over a semiconductor substrate; a first passivation layer over the first redistribution line and the second redistribution line; a second passivation layer over the first passivation layer; a first under-bump metallurgy (UBM) structure over the first redistribution line, the first UBM structure extending through the first passivation layer and the second passivation layer and being electrically coupled to the first redistribution line; and a second UBM structure over the second redistribution line, the second UBM structure extending through the second passivation layer, the second UBM structure being electrically isolated from the second redistribution line by the first passivation layer.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ting-Li Yang, Po-Hao Tsai, Ming-Da Cheng, Yung-Han Chuang, Hsueh-Sheng Wang
  • Publication number: 20240109955
    Abstract: Disclosed are antigen binding polypeptides and antigen binding polypeptide complexes (e.g., antibodies and antigen binding fragments thereof) having certain structural and/or functional features. Also disclosed are polynucleotides and vectors encoding such polypeptides and polypeptide complexes; host cells, pharmaceutical compositions and kits containing such polypeptides and polypeptide complexes; and methods of using such polypeptides and polypeptide complexes.
    Type: Application
    Filed: June 30, 2023
    Publication date: April 4, 2024
    Inventors: Juan LI, Chi-Jen WEI, Ronnie R. WEI, Zhi-Yong YANG, John R. MASCOLA, Gary J. NABEL, John MISASI, Amarendra PEGU, Lingshu WANG, Tongqing ZHOU, Misook CHOE, Olamide K. OLONINIYI, Bingchun ZHAO, Yi ZHANG, Eun Sung YANG, Man CHEN, Kwanyee LEUNG, Wei SHI, Nancy J. SULLIVAN, Peter D. KWONG, Richard A. KOUP, Barney S. GRAHAM, Peng HE
  • Publication number: 20240113217
    Abstract: An integrated circuit includes first and second trenches in a semiconductor substrate and a semiconductor mesa between the first and second trenches. A source region having a first conductivity type and a body region having an opposite second conductivity type are located within the semiconductor mesa. A trench shield is located within the first trench, and a gate electrode is over the trench shield between first and second sidewalls of the first trench. A gate dielectric is on a sidewall of the first trench between the gate electrode and the body region, and a pre-metal dielectric (PMD) layer is over the gate electrode. A gate contact through the PMD layer touches the gate electrode between the first and second sidewalls, and a trench shield contact through the PMD layer touches the trench shield between the first and second sidewalls.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 4, 2024
    Inventors: Hong Yang, Thomas Grebs, Yunlong Liu, Sunglyong Kim, Lindong Li, Peng Li, Seetharaman Sridhar, Yeguang Zhang, Sheng pin Yang
  • Patent number: 11949477
    Abstract: Systems, methods, and instrumentalities are disclosed for adaptation of multiple input multiple output (MIMO) mode in mmW Wireless Local Area Network (WLAN) systems. A first station (STA) may receive a mode change request from a second STA. The mode change request may indicate a mode change for a MIMO mode, a polarization mode, and/or an orthogonal frequency-division multiple access (OFDMA) mode. The mode change request may include one or more STA fields. The one or more STA fields may include a STA field associated with the first STA. Each of the one or more STA fields may include a MIMO mode subfield, a polarization mode subfield, and/or an OFDMA mode subfield. The first STA may change the MIMO mode, the polarization mode, and/or the OFDMA mode, for example, based on the mode change request. The first STA may send a mode change response to the second STA.
    Type: Grant
    Filed: November 1, 2021
    Date of Patent: April 2, 2024
    Assignee: InterDigital Patent Holdings, Inc.
    Inventors: Oghenekome Oteri, Hanqing Lou, Xiaofei Wang, Li-Hsiang Sun, Alphan Sahin, Rui Yang
  • Publication number: 20240107348
    Abstract: The present disclosure describes methods, system, and devices for configuring a user equipment (UE) with priority information for measurement task. One method includes sending, by the RAN node, a configuration message to the UE, the configuration message comprising the priority information, so that the UE performs a measurement task and reports at least one measurement result according to the priority information; and receiving, by the RAN node, the at least one measurement result from the UE. Another method includes receiving, by the UE, a configuration message from a radio access network (RAN) node, the configuration message comprising the priority information; and performing, by the UE, a measurement task and reporting at least one measurement result according to the priority information.
    Type: Application
    Filed: October 16, 2023
    Publication date: March 28, 2024
    Applicant: ZTE Corporation
    Inventors: Yan Xue, Feng Xie, Li Yang
  • Publication number: 20240101609
    Abstract: Embodiments of a recombinant human Parainfluenza Virus (hPIV) F ectodomain trimer stabilized in a prefusion conformation are provided. Also disclosed are nucleic acids encoding the hPIV F ectodomain trimer and methods of producing the hPIV F ectodomain trimer. Methods for inducing an immune response in a subject are also disclosed. In some embodiments, the method can be a method for treating or inhibiting a hPIV infection in a subject by administering a effective amount of the recombinant hPIV F ectodomain trimer to the subject.
    Type: Application
    Filed: December 12, 2023
    Publication date: March 28, 2024
    Applicants: The United States of America, as represented by the Secretary, Department of Health and Human Servi, Institute for Research in Biomedicine
    Inventors: Baoshan Zhang, Guillaume Stewart-Jones, Tongqing Zhou, John Mascola, Kai Xu, Yongping Yang, Paul Thomas, Gwo-Yu Chuang, Li Ou, Peter Kwong, Yaroslav Tsybovsky, Wing-Pui Kong, Aliaksandr Druz, Davide Corti, Antonio Lanzavecchia
  • Publication number: 20240103802
    Abstract: This disclosure discloses a multimedia processing method, apparatus, device, and medium. The method for multimedia processing includes: displaying an initial text content, wherein the initial text content corresponds to a target multimedia content; playing an associated multimedia content in response to a triggering operation for the associated multimedia content; wherein the associated multimedia content comprises a segment associated with a target text content in the target multimedia content, and the target text content is extracted from the initial text content.
    Type: Application
    Filed: December 5, 2023
    Publication date: March 28, 2024
    Inventors: Kojung CHEN, Jingsheng YANG, Wenming XU, Xiang ZHENG, Chunsai DU, Li ZHAO
  • Publication number: 20240107537
    Abstract: A method of multi-access point (multi-AP) communication performed by a wireless transmit/receive unit (WTRU) comprises: receiving a first trigger frame from a first access point (AP) of a plurality of APs, the first trigger frame comprising first information; receiving a second trigger frame from a second AP of the plurality of APs at a predetermined time duration after receiving the first trigger frame, the second trigger frame also comprising the first information of the first trigger frame; generating a synchronization frame based on the first trigger frame and the second trigger frame, the synchronization frame comprising synchronization information; transmitting the synchronization frame to at least the first AP and the second AP; and receiving a data transmission based on the synchronization information from each of the first AP and the second AP.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 28, 2024
    Applicant: InterDigital Patent Holdings, Inc.
    Inventors: Oghenekome Oteri, Hanqing Lou, Li-Hsiang Sun, Xiaofei Wang, Alphan Sahin, Rui Yang, Frank LaSita
  • Publication number: 20240106585
    Abstract: A wireless station (STA) for parameterized spatial reuse (PSR) operation. The STA may receive, from a first access point (AP) that the STA is not associated with, a trigger frame. The trigger frame includes a signal (SIG) field that includes a PSR field. The PSR field includes a plurality of subfields each corresponding to a respective subchannel associated with the trigger frame. This information includes transmission power level information. The STA may then determine, for each subchannel, using the transmission power level information, transmission power upper bounds for each of the subchannels.
    Type: Application
    Filed: November 24, 2021
    Publication date: March 28, 2024
    Applicant: INTERDIGITAL PATENT HOLDINGS, INC.
    Inventors: Hanqing Lou, Zinan Lin, Xiaofei Wang, Rui Yang, Li Hsiang Sun
  • Publication number: 20240103196
    Abstract: A radiographic inspection device and a method of inspecting an object are provided. The radiographic inspection device includes a support frame, where an inspection space applicable to inspect an object is formed within the support frame, and the inspection space has a first opening connecting to an outside; a transfer mechanism applicable to carry the object and move through the inspection space; a shielding curtain mounted at the first opening; and a driving mechanism. The driving mechanism includes: a driver mounted on the support frame; and a joint portion, where an upper end of the shielding curtain is connected to the joint portion. The driver is configured to synchronously drive two ends of the joint portion, so that the shielding curtain moves up and down with the joint portion to open or close the first opening.
    Type: Application
    Filed: January 18, 2022
    Publication date: March 28, 2024
    Inventors: Zhiqiang CHEN, Li ZHANG, Yi CHENG, Qingping HUANG, Mingzhi HONG, Minghua QIU, Yao ZHANG, Jianxue YANG, Lei ZHENG
  • Patent number: 11941572
    Abstract: Various embodiments are disclosed for providing machine learning routines with peripheral device data to infer driver activity and location. Peripheral device data may be collected on a peripheral device having a machine learning routine executing thereon to infer driver activity and perform improved estimation of driver location. Using driver activity and location estimation, contextually relevant delivery workflow assistance may be automatically provided to a delivery driver or other individual without requiring manual input, thereby improving driver safety and operational efficiency.
    Type: Grant
    Filed: March 16, 2021
    Date of Patent: March 26, 2024
    Assignee: AMAZON TECHNOLOGIES, INC.
    Inventors: Ruth Ravichandran, Hebaallah Aly Abdelhalim Aly Ismail, Zheng Wang, Shao-Wen Yang, Yang Pan, David Hung Huynh, Andrey Li, Hoshgeldy Tagangeldyevich Tachmuradov, Steven Larson
  • Patent number: 11942053
    Abstract: Disclosed are a display panel and a driving method therefor, and a display device. Two adjacent rows of sub-pixels are taken as a row group, and the row group is provided with a first sub row group and a second sub row group that are arranged in a column direction; a gate electrode of a first transistor in the first sub row group is electrically connected to a first gate line; a gate electrode of a second transistor in the second sub row group is electrically connected to a second gate line; two adjacent sub-pixels in the column direction share one third transistor, and a gate electrode of the third transistor in the row group is electrically connected to a third gate line; and the first transistor and the second transistor in one column of sub-pixels are electrically connected to a data line by means of the shared third transistor.
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: March 26, 2024
    Assignees: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Xianglei Qin, Jian Lin, Yong Zhang, Limin Zhang, Zepeng Sun, Zhichao Yang, Liangzhen Tang, Zhilong Duan, Honggui Jin, Yashuai An, Lingfang Nie, Jian Wang, Li Tian, Jing Pang, Xuechao Song
  • Patent number: 11942398
    Abstract: A semiconductor device includes a substrate, at least one via, a liner layer and a conductive layer. The substrate includes an electronic circuitry. The at least one via passes through the substrate. The at least one via includes a plurality of concave portions on a sidewall thereof. The liner layer fills in the plurality of concave portions of the at least one via. The conductive layer is disposed on the sidewall of the at least one via, covers the liner layer, and extends onto a surface of the substrate. The thickness of the conductive layer on the sidewall of the at least one via is varied.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Li Yang, Wen-Hsiung Lu, Jhao-Yi Wang, Fu Wei Liu, Chin-Yu Ku
  • Patent number: 11942424
    Abstract: An interconnect structure and a method of forming the interconnect structure are provided. The interconnect structure includes one or more metal lines in direct contact with a top surface of one or more devices and one or more vias in direct contact with top surfaces of the one or more metal lines. The interconnect structure also includes one or more dielectric pillars in direct contact with the top surface of the one or more devices. A height of a top surface of the one or more dielectric pillars above the one or more devices is equal to a height of a top surface of the one or more vias above the one or more devices.
    Type: Grant
    Filed: December 1, 2021
    Date of Patent: March 26, 2024
    Assignee: International Business Machines Corporation
    Inventors: Tao Li, Ruilong Xie, Tsung-Sheng Kang, Chih-Chao Yang
  • Patent number: 11941210
    Abstract: A detection circuit is provided herein, which includes a first transistor, a second transistor, a third transistor, a light sensor, a capacitor, and a fourth transistor. The first transistor has a control terminal, a first terminal, and a second terminal. The second transistor is coupled to the control terminal. The third transistor is coupled to the control terminal and the second terminal. The light sensor is coupled to the control terminal. The capacitor is coupled to the control terminal. The fourth transistor is coupled to the second terminal.
    Type: Grant
    Filed: November 21, 2022
    Date of Patent: March 26, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Ya-Li Tsai, Hui-Ching Yang, Yang-Jui Huang, Te-Yu Lee
  • Patent number: 11943164
    Abstract: Provided are a Minimization of Driving Test (MDT) Logs reporting method and device, a MDT Logs reporting control method and device, a storage medium, and an electronic device. UE receives first Logged MDT configuration information configured for a master base station, and receives second Logged MDT configuration information configured for at least one secondary base station; the UE exits a multi-connectivity operation mode, executes a first Logged MDT operation according to the first Logged MDT configuration information to acquire first MDT Logs, and executes a second Logged MDT operation according to the second Logged MDT configuration information to acquire second MDT Logs; and the UE re-establishes the multi-connectivity operation mode with a current master base station and at least one current secondary base station, and reports the first MDT Logs and/or the second MDT Logs to the current master base station and/or the at least one current secondary base station.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: March 26, 2024
    Assignee: ZTE CORPORATION
    Inventors: Li Yang, Dapeng Li, Jing Liu
  • Publication number: 20240092811
    Abstract: Monoalkyl tin triamide compounds having purity of at least about 99 mol % and the chemical formula RSn(NMe2)3 are described. R1 is selected from RA, RB, and RC; RA is a primary alkyl group having about 1 to 10 carbon atoms, RB is a secondary alkyl group having about 3 to 10 carbon atoms, and RC is a tertiary alkyl group having about 3 to 10 carbon atoms; each R2 is independently an alkyl group having about 1 to 10 carbon atoms; and a content of R1Sn(NR22)2(N(R2)CH2NR22) is less than about 1 mol %. Methods for synthesizing, purifying, and storing these compounds are also provided. The monoalkyl tin compounds may be used for the formation of high-resolution EUV lithography patterning precursors and are attractive due to their high purity and minimal concentration of dialkyl tin and other tin impurities.
    Type: Application
    Filed: November 14, 2023
    Publication date: March 21, 2024
    Inventors: Li YANG, Yuta HIOKI
  • Publication number: 20240095528
    Abstract: A method for increasing the temperature-resiliency of a neural network, the method comprising loading a neural network model into a resistive nonvolatile in-memory-computing chip, training the deep neural network model using a progressive knowledge distillation algorithm as a function of a teacher model, the algorithm comprising injecting, using a clean model as the teacher model, low-temperature noise values into a student model and changing, now using the student model as the teacher model, the low-temperature noises to high-temperature noises, and training the deep neural network model using a batch normalization adaptation algorithm, wherein the batch normalization adaptation algorithm includes training a plurality of batch normalization parameters with respect to a plurality of thermal variations.
    Type: Application
    Filed: September 8, 2023
    Publication date: March 21, 2024
    Applicant: Arizona Board of Regents on behalf of Arizona State University
    Inventors: Jae-sun Seo, Jian Meng, Li Yang, Deliang Fan