Abstract: A packaging structure and a method of forming a packaging structure are provided. The packaging structure, such as an interposer, is formed by optionally bonding two carrier substrates together and simultaneously processing two carrier substrates. The processing includes forming a sacrificial layer over the carrier substrates. Openings are formed in the sacrificial layers and pillars are formed in the openings. Substrates are attached to the sacrificial layer. Redistribution lines may be formed on an opposing side of the substrates and vias may be formed to provide electrical contacts to the pillars. A debond process may be performed to separate the carrier substrates. Integrated circuit dies may be attached to one side of the redistribution lines and the sacrificial layer is removed.

Abstract: A system and method for a zero stand-off configuration are provided. An embodiment comprises forming a seal layer over a conductive region that is part of a first substrate and breaching the seal with a conductive member of a second substrate in order to bond the first substrate to the second substrate.

Abstract: A packaging structure and a method of forming a packaging structure are provided. The packaging structure, such as an interposer, is formed by optionally bonding two carrier substrates together and simultaneously processing two carrier substrates. The processing includes forming a sacrificial layer over the carrier substrates. Openings are formed in the sacrificial layers and pillars are formed in the openings. Substrates are attached to the sacrificial layer. Redistribution lines may be formed on an opposing side of the substrates and vias may be formed to provide electrical contacts to the pillars. A debond process may be performed to separate the carrier substrates. Integrated circuit dies may be attached to one side of the redistribution lines and the sacrificial layer is removed.

Abstract: Many 3D mesh models have a large number of small connected components that are repeated in various positions, scales and orientations. The respective positions are defined by the position of at least one reference point per component. For an enhanced encoding of the positions of the respective reference points, a given space is divided into segments and the number of points lying in each particular segment is determined. When a cell with at least n points is subdivided into child cells, an indication is added indicating if all points of a parent are in only one child cell. If so, the index of the only non-empty child node is encoded, while otherwise the number of points in one of the two child cells is decremented and encoded. The invention avoids non-effective subdivisions of a cell, and therefore improves the compression efficiency.

Abstract: Systems and methods for producing energetic neutrals include a remote plasma generator configured to generate plasma in a plasma region. An ion extractor is configured to extract high energy ions from the plasma. A substrate support is arranged in a processing chamber and is configured to support a substrate. A neutral extractor and gas dispersion device is arranged between the plasma region and the substrate support. The neutral extractor and gas dispersion device is configured to extract energetic neutrals from the high energy ions, to supply the energetic neutrals to the substrate and to disperse precursor gas into the processing chamber.

Abstract: A system and method for a zero stand-off configuration are provided. An embodiment comprises forming a seal layer over a conductive region that is part of a first substrate and breaching the seal with a conductive member of a second substrate in order to bond the first substrate to the second substrate.

Abstract: A sputtering target is provided that includes a planar backing plate and a target material formed over the planar backing plate and including an uneven sputtering surface including thick portions and thin portions and configured in conjunction with a sputtering apparatus such as a magnetron sputtering tool with a fixed magnet arrangement. The uneven surface is designed in conjunction with the magnetic fields that will be produced by the magnet arrangement such that the thicker target portions are positioned at locations where target erosion occurs at a high rate. Also provided is the magnetron sputtering system and a method for utilizing the target with uneven sputtering surface such that the thickness across the target to become more uniform in time as the target is used.

Abstract: Embodiments of mechanisms of a backside illuminated image sensor device structure are provided. The backside illuminated image sensor device structure includes a substrate having a frontside and a backside and a pixel array formed in the frontside of the substrate. The backside illuminated image sensor device structure further includes an antireflective layer formed over the backside of the substrate, and the antireflective layer is made of silicon carbide nitride.

Abstract: A system and method for a zero stand-off configuration are provided. An embodiment comprises forming a seal layer over a conductive region that is part of a first substrate and breaching the seal with a conductive member of a second substrate in order to bond the first substrate to the second substrate.

Abstract: The invention provides a method for generating an n dimensional vector as a shape descriptor of a model, and corresponding apparatus and shape descriptor. The method comprises: determining a type element of the vector to describe the basic shape of the model; and calculating n?1 metric elements of the vector, each of which represents the percentage of all of a feature of the model falling into one of n?1 layers divided as a function of the type element.

Abstract: Embodiments of mechanisms of a backside illuminated image sensor device structure are provided. The backside illuminated image sensor device structure includes a substrate having a frontside and a backside and a pixel array formed in the frontside of the substrate. The backside illuminated image sensor device structure further includes an antireflective layer formed over the backside of the substrate, and the antireflective layer is made of silicon carbide nitride.

Abstract: A method for processing Machine-to-Machine (M2M) platform services and a M2M platform are disclosed. The method comprises: receiving a service request sent by a terminal; selecting a corresponding application according to capacity required by the service request; and forwarding the service request to the corresponding application, and feeding back a response result of the application to the terminal. The method for processing M2M platform services and the M2M platform in accordance with the present implement a platform for providing a variety applications for users.

Abstract: A packaging structure and a method of forming a packaging structure are provided. The packaging structure, such as an interposer, is formed by optionally bonding two carrier substrates together and simultaneously processing two carrier substrates. The processing includes forming a sacrificial layer over the carrier substrates. Openings are formed in the sacrificial layers and pillars are formed in the openings. Substrates are attached to the sacrificial layer. Redistribution lines may be formed on an opposing side of the substrates and vias may be formed to provide electrical contacts to the pillars. A debond process may be performed to separate the carrier substrates. Integrated circuit dies may be attached to one side of the redistribution lines and the sacrificial layer is removed.

Abstract: A gas release device is formed of two plates combined together. Each of the plates includes an intake groove. Each of the intake grooves is linked with a first distribution groove. Each of the first distribution grooves is linked with two second distribution grooves. Each of the second distribution grooves is linked with two third distribution grooves. Each of the third distribution grooves is linked with two fourth distribution grooves. Each of the fourth distribution grooves is linked with two fifth distribution grooves. Each of the fifth distribution grooves has a venthole. After a gas of a vapor deposition source enters the intake groove, the gas passes through the first, second, third, fourth, and fifth distribution grooves in order and then substantially equal amount of the gas is finally released out of each of the ventholes.

Abstract: A gas release device for a coating process includes an upper plate, a first intermediate plate, a second intermediate plate, and a lower plate, four of which are superposed on each other from top to bottom. The upper plate is linked and communicates with the first intermediate plate through a first passage. The first intermediate plate is linked and communicates with the second intermediate plate through at least two second passages. The second intermediate plate is linked with the lower plate through at least four third passages. The lower plate includes at least four ventholes. In light of this, after a gas of a vapor deposition source enters the inlet, the gas of the same amount can be released out of each venthole to make the thickness of a thin film uniform for relatively higher quality of the coating process.

Abstract: A system and method for a zero stand-off configuration are provided. An embodiment comprises forming a seal layer over a conductive region that is part of a first substrate and breaching the seal with a conductive member of a second substrate in order to bond the first substrate to the second substrate.

Abstract: Many 3D mesh models have a large number of small connected components that are repeated in various positions, scales and orientations. The respective positions are defined by the position of at least one reference point per component. For an enhanced encoding of the positions of the respective reference points, a given space is divided into segments and the number of points lying in each particular segment is determined. When a cell with at least n points is subdivided into child cells, an indication is added indicating if all points of a parent are in only one child cell. If so, the index of the only non-empty child node is encoded, while otherwise the number of points in one of the two child cells is decremented and encoded. The invention avoids non-effective subdivisions of a cell, and therefore improves the compression efficiency.

Abstract: A light emitting diode package structure includes a substrate, LED bare chips and a lens. The substrate has an upper surface, a lower surface and a side surface between the upper surface and the lower surface. The upper surface is provided with a circuit pattern. The side surface is provided with a groove. The LED bare chips are fixed on the upper surface and electrically connected with the circuit pattern. The lens covers the LED bare chips, the upper surface and the circuit pattern by an injection molding process so as to be inserted into the groove. With this arrangement, the connecting strength between the substrate and the lens can be enhanced, thereby achieving waterproof and anti-electrostatic effects. Further, material cost of the present invention is reduced greatly.

Abstract: A sputtering target is provided that includes a planar backing plate and a target material formed over the planar backing plate and including an uneven sputtering surface including thick portions and thin portions and configured in conjunction with a sputtering apparatus such as a magnetron sputtering tool with a fixed magnet arrangement. The uneven surface is designed in conjunction with the magnetic fields that will be produced by the magnet arrangement such that the thicker target portions are positioned at locations where target erosion occurs at a high rate. Also provided is the magnetron sputtering system and a method for utilizing the target with uneven sputtering surface such that the thickness across the target to become more uniform in time as the target is used.

Abstract: A method for processing Machine-to-Machine (M2M) platform services and a M2M platform are disclosed. The method comprises: receiving a service request sent by a terminal; selecting a corresponding application according to capacity required by the service request; and forwarding the service request to the corresponding application, and feeding back a response result of the application to the terminal. The method for processing M2M platform services and the M2M platform in accordance with the present implement a platform for providing a variety applications for users.