Abstract: An integrated optical assembly with one or more integrated tunable lens elements within a lens barrel is described. The integrated optical assembly may be a part of an imaging device. The integrated optical assembly may include an optical element, a tunable lens element, and a lens barrel. The tunable lens element includes a tunable lens that is affixed to and communicatively coupled to a mount and is configured to adjust its optical power in accordance with an applied signal. The lens barrel is configured to hold the tunable lens element in optical series with at least one other optical element within the lens barrel. The lens barrel includes an integrated electrode that communicatively couples the mount to a controller which supplies the applied signal.

Abstract: Embodiments of the present disclosure relate to a camera device with optical image stabilization (OIS) having a range of motion that is asymmetric along two spatial dimensions. The camera device includes an image sensor, a lens assembly in an optical series with the image sensor, and an OIS assembly. The OIS assembly initiates a first motion of at least one of the image sensor and the lens assembly along a first direction parallel to a first axis, the first motion having a first range. The OIS assembly further initiates a second motion of at least one of the image sensor and the lens assembly along a second direction parallel to a second axis orthogonal to the first axis, the second motion having a second range different than the first range.

Abstract: Methods and wearable devices for optimizing power consumption using sensor-based position and use determinations are described here. One example method is performed at a device that includes a first sensor configured to operate with a first power consumption rate and a second sensor configured to operate with a second power consumption rate. The method includes, while a component associated with the second sensor is in an inactive state, receiving first sensor data, and determining whether the first sensor data indicates movement of the device. The method also includes, when movement of the device is indicated, operating the second sensor in an active state. The method further includes, after activating the second sensor, when second sensor data from the second sensor indicates that the device has been placed on a user’s body, continuing to operate the second sensor in the active state.

Abstract: A camera device for integration into an electronic wearable device. The camera device includes a lens assembly, an image sensor, a first actuator assembly, and a second actuator assembly. The first actuator assembly translates the lens assembly over a first range along an optical axis, wherein power consumed by the first actuator assembly increases with a distance the lens assembly is actuated along the optical axis from a neutral position of the lens assembly. The second actuator assembly translates the image sensor over a second range along the optical axis, wherein the second range is smaller than the first range. A method of packaging the camera device is further presented where a molded plastic layer is sandwiched between a first high density interconnect (HDI) tape substrate and a second HDI tape substrate. The molded plastic layer includes vias to interconnect electrodes of the first and second HDI tape substrates.

Abstract: Embodiments of the present disclosure relate to power saving mechanisms for a wearable camera device. The camera device comprises an image sensor and lens assembly in an optical series with the image sensor. At a first orientation of the camera device, an offset is between a center axis of the image sensor and an optical axis of the lens assembly. At a second orientation of the camera device, at least one of the image sensor and the lens assembly sag due to gravity such that the center axis and the optical axis substantially overlap while the camera device is in a neutral state. The lens assembly and the image sensor can further allow a dynamic amount of sag relative to each other.

Abstract: Embodiments of the present disclosure further relate to a camera device assembled such that to reduce (and in some cases minimize) auto-focusing actuation power when the camera device operates in a macro mode. The camera device includes an image sensor and a lens assembly in an optical series with the image sensor. During manufacturing of the camera device, the lens assembly is assembled within the camera device to have an optical axis substantially parallel to gravity and positioned to have an offset along the optical axis. The offset is determined during manufacturing of the camera device such that, when the camera device is in the macro mode, the lens assembly is positioned at a neutral position relative to the image sensor without actuation applied to the lens assembly.

Abstract: Embodiments of the present disclosure relate to a camera device assembled to reduce an auto-focusing actuation power for the most typical use case. The camera device comprises an image sensor and a lens assembly in an optical series with the image sensor. During assembling of the camera device, the lens assembly is assembled within the camera device to have an optical axis parallel to gravity and positioned to have an offset along the optical axis relative to a support assembly. The offset is determined during assembling of the camera device such that, when the camera device is oriented with a rotated optical axis orthogonal to gravity, the lens assembly is positioned at a neutral position relative to the image sensor without activation applied to the lens assembly.

Abstract: An optical element includes a single transparent substrate. A first metasurface disposed on the single transparent substrate is configured to focus an input beam of optical radiation that is incident on the optical element. A second metasurface disposed on the single transparent substrate is configured to split the input beam into an array of multiple output beams.

Abstract: An electronic module includes an operational subunit, having upper, lower and lateral surfaces, and including one or more electronic components, which are adjacent to the lower surface of the operational subunit and generate heat when the module is in operation. A heat sink is disposed in proximity to the lower surface of the operational subunit. A heat spreader, including a continuous sheet of a heat-conducting material, is folded to wrap around the operational subunit so that a lower side of the sheet is interposed between the lower surface of the operational subunit and the heat sink and a lateral side of the sheet extends around at least one of the lateral surfaces of the operational subunit.

Abstract: An electronic module includes an operational subunit, having upper, lower and lateral surfaces, and including one or more electronic components, which are adjacent to the lower surface of the operational subunit and generate heat when the module is in operation. A heat sink is disposed in proximity to the lower surface of the operational subunit. A heat spreader, including a continuous sheet of a heat-conducting material, is folded to wrap around the operational subunit so that a lower side of the sheet is interposed between the lower surface of the operational subunit and the heat sink and a lateral side of the sheet extends around at least one of the lateral surfaces of the operational subunit.

Abstract: Embodiments disclosed herein generally relate to a method for monitoring optical power in a HAMR device. In one embodiment, the method includes enhancing a thermal sensor bandwidth through advanced electrical detection techniques. The advanced electrical detection techniques include obtaining calibration waveform data for a thermal sensor by calibrating the thermal sensor, obtaining real-time waveform data for the thermal sensor that may deviate from the calibration waveform data, updating the calibration waveform data to include the real-time waveform data, repeating obtaining real-time waveform data and updating the calibration waveform data during writing operations. By updating the calibration waveform data, the bandwidth of the thermal sensor is determined by a fixed sampling time interval, and the thermal sensor rise time to steady state would not be a limitation to its response time.

Abstract: Provided herein are systems and apparatus for reducing vibration interaction between hard drives. In one implementation, an apparatus is provided comprising a backplane that comprises a substrate comprising an at least partially flexible material and a connector island assembly formed in the substrate. The connector island assembly comprises a spring element and a connector island. The spring element extends from a main portion of the substrate, and the connector island extends from the spring element. The connector island assembly is surrounded by the main portion of the substrate and configured to flex independently of the main portion of the substrate.

Abstract: Provided herein are systems and apparatus for reducing vibration interaction between hard drives. In one implementation, a flexible mount electrical connection comprises a mating connector configured to physically couple with a hard drive connector and a plurality of electrical pins having a connector portion positioned within the mating connector configured to electrically couple with hard drive connector pins positioned within the hard drive connector. Each electrical pin has an extended portion extending away from the mating connector. The extended portion has an attachment portion configured to electrically couple the respective electrical pin to a printed circuit board, and the extended portion has a shape formed therein configured to reduce transmission of vibrations in the connector portion along each axis of a three-dimensional space to the attachment portion.

Abstract: Provided herein are systems and apparatus for reducing vibration interaction between hard drives. In one implementation, an apparatus is provided comprising a backplane that comprises a substrate comprising an at least partially flexible material and a connector island assembly formed in the substrate. The connector island assembly comprises a spring element and a connector island. The spring element extends from a main portion of the substrate, and the connector island extends from the spring element. The connector island assembly is surrounded by the main portion of the substrate and configured to flex independently of the main portion of the substrate.

Abstract: Embodiments disclosed herein generally relate to a method for monitoring optical power in a HAMR device. In one embodiment, the method includes enhancing a thermal sensor bandwidth through advanced electrical detection techniques. The advanced electrical detection techniques include obtaining calibration waveform data for a thermal sensor by calibrating the thermal sensor, obtaining real-time waveform data for the thermal sensor that may deviate from the calibration waveform data, updating the calibration waveform data to include the real-time waveform data, repeating obtaining real-time waveform data and updating the calibration waveform data during writing operations. By updating the calibration waveform data, the bandwidth of the thermal sensor is determined by a fixed sampling time interval, and the thermal sensor rise time to steady state would not be a limitation to its response time.

Abstract: Embodiments disclosed herein generally relate to a method for monitoring optical power in a HAMR device. In one embodiment, the method includes enhancing a thermal sensor bandwidth through advanced electrical detection techniques. The advanced electrical detection techniques include obtaining calibration waveform data for a thermal sensor by calibrating the thermal sensor, obtaining real-time waveform data for the thermal sensor that may deviate from the calibration waveform data, updating the calibration waveform data to include the real-time waveform data, repeating obtaining real-time waveform data and updating the calibration waveform data during writing operations. By updating the calibration waveform data, the bandwidth of the thermal sensor is determined by a fixed sampling time interval, and the thermal sensor rise time to steady state would not be a limitation to its response time.

Abstract: Provided herein are systems and apparatus for reducing vibration interaction between hard drives. In one implementation, a flexible mount electrical connection comprises a mating connector configured to physically couple with a hard drive connector and a plurality of electrical pins having a connector portion positioned within the mating connector configured to electrically couple with hard drive connector pins positioned within the hard drive connector. Each electrical pin has an extended portion extending away from the mating connector. The extended portion has an attachment portion configured to electrically couple the respective electrical pin to a printed circuit board, and the extended portion has a shape formed therein configured to reduce transmission of vibrations in the connector portion along each axis of a three-dimensional space to the attachment portion.

Abstract: Systems and methods for providing a phase change memory that includes a phase change material, such as a chalcogenide material, in series with a heating element that comprises multiple thermal interfaces are described. The multiple thermal interfaces may cause the heating element to have a reduced bulk thermal conductivity or a lower heat transfer rate across the heating element without a corresponding reduction in electrical conductivity. The phase change material may comprise a germanium-antimony-tellurium compound or a chalcogenide glass. The heating element may include a plurality of conducting layers with different thermal conductivities. In some cases, the heating element may include two or more conducting layers in which the conducting layers comprise the same electrically conductive material or compound but are deposited or formed using different temperatures, carrier gas pressures, flow rates, and/or film thicknesses to create thermal interfaces between the two or more conducting layers.

Abstract: A data storage system assembly includes a rigid central plate with multiple data storage devices (DSDs) mounted on the central plate, where a first row of DSDs is coupled with a first side of the central plate, and a second row of DSDs is coupled with a second side of the central plate, both in a side-by-side arrangement. A plurality of flexible mounting grommets may be fastened to each DSD and coupled to the central plate, such as in an arrangement in which an even number of grommets are fastened to one side and an odd number of grommets are fastened to an opposing side of the DSD. Each respective DSD may be fastened to a corresponding adaptor plate, where each adaptor plate is coupled with the central plate. Flexible mounting grommets may be fastened to each adaptor plate and coupled to the central plate.

Abstract: A data storage system assembly includes a rigid central plate with multiple data storage devices (DSDs) mounted on the central plate, where a first row of DSDs is coupled with a first side of the central plate, and a second row of DSDs is coupled with a second side of the central plate, both in a side-by-side arrangement. A plurality of flexible mounting grommets may be fastened to each DSD and coupled to the central plate, such as in an arrangement in which an even number of grommets are fastened to one side and an odd number of grommets are fastened to an opposing side of the DSD. Each respective DSD may be fastened to a corresponding adaptor plate, where each adaptor plate is coupled with the central plate. Flexible mounting grommets may be fastened to each adaptor plate and coupled to the central plate.