Patents by Inventor Lin Yang

Lin Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11979750
    Abstract: The disclosure discloses a method and device in a communication node for wireless communication. The communication node receives first information, and performs Q energy detections respectively in Q time sub-pools within a first sub-band, and if energy detected by each energy detection of the Q energy detections is lower than a first threshold, starts to transmit a first radio signal at a first time-instant; the first information is used to determine K candidate time-instant subsets; a target time-instant subset is one of the K candidate time-instant subsets, the first time-instant belongs to the target time-instant subset; a frequency-domain bandwidth of the first sub-band is used to determine the target time-instant subset out of the K candidate time-instant subsets, and frequency-domain resources occupied by the first radio signal belong to the first sub-band. The disclosure can improve access fairness.
    Type: Grant
    Filed: May 11, 2023
    Date of Patent: May 7, 2024
    Assignee: SHANGHAI LANGBO COMMUNICATION TECHNOLOGY COMPANY LIMITED
    Inventors: Zheng Liu, Xiaobo Zhang, Lin Yang
  • Patent number: 11978289
    Abstract: A method, apparatus and non-transitory computer readable storage medium for driving evaluation are provided. The method includes: collecting a set of performance events during conduction of one or more driving tasks; calculating, based on the collected set of performance events and respective weights for the performance events contained in the collected set of performance events, an aggregated performance indicator.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: May 7, 2024
    Assignee: GUANGZHOU AUTOMOBILE GROUP CO., LTD.
    Inventors: Hai Xiao, Jin Shang, Lin Chen, Yongling Sun, Xiaosong Yang
  • Patent number: 11978640
    Abstract: In a method of forming a pattern over a semiconductor substrate, a target layer to be patterned is formed over a substrate, a mask pattern including an opening is formed in a mask layer, a shifting film is formed in an inner sidewall of the opening, a one-directional etching operation is performed to remove a part of the shifting film and a part of the mask layer to form a shifted opening, and the target layer is patterned by using the mask layer with the shifted opening as an etching mask. A location of the shifted opening is laterally shifted from an original location of the opening.
    Type: Grant
    Filed: April 9, 2021
    Date of Patent: May 7, 2024
    Inventors: Yi-Chen Lo, Yi-Shan Chen, Chih-Kai Yang, Pinyen Lin
  • Patent number: 11979352
    Abstract: The present disclosure provides a method and a device in a User Equipment (UE) and a base station used for wireless communications. The UE receives first information; determines first sub-information out of the M piece(s) of sub-information; receives a first radio signal in a first time-frequency resource set; the first information comprises the M piece(s) of sub-information, each of the M piece(s) of sub-information indicates a reference signal group, and a reference signal group comprises at least one reference signal. The first sub-information indicates a first reference signal group. A reference signal in a reference signal group indicated by at least one of the M piece(s) of sub-information is transmitted by a first serving cell, and the first serving cell is not added by the UE. The above method not only obtains performance advancement brought by serving cell handover, but also avoid time delay and service interrupt.
    Type: Grant
    Filed: February 21, 2023
    Date of Patent: May 7, 2024
    Assignee: SHANGHAI LANGBO COMMUNICATION TECHNOLOGY COMPANY LIMITED
    Inventors: Keying Wu, Xiaobo Zhang, Lin Yang
  • Patent number: 11979356
    Abstract: The disclosure provides a method and a device in a communication node for wireless communication. The communication node first receives first information and second information, and then transmits a first radio signal in W1 time sub-window(s); the first information is used for determining X candidate time window(s), any one of the X candidate time window(s) has a time length equal to a first time length, and the first time length is fixed; for a subcarrier spacing of a subcarrier occupied by the first radio signal, one of the X candidate time window(s) comprises Y candidate time sub-window(s), and the Y is related to the subcarrier spacing of the subcarrier occupied by the first radio signal; the second information is used for indicating W candidate time sub-window(s) out of the Y candidate time sub-window(s); and each of the W1 time sub-window(s) is one of the W candidate time sub-window(s).
    Type: Grant
    Filed: July 2, 2023
    Date of Patent: May 7, 2024
    Assignee: SHANGHAI LANGBO COMMUNICATION TECHNOLOGY COMPANY LIMITED
    Inventors: Zheng Liu, Xiaobo Zhang, Lin Yang
  • Publication number: 20240142175
    Abstract: Disclosed are an unblocking apparatus for a furnace discharging pipe and a use method. The unblocking apparatus includes a rail, a rail car that may move along the rail, an unblocking drive mechanism arranged on the rail car, a heat-unblocking component, a cold-unblocking component, and a material receiving component that is used to receive a blocking material in the discharging pipe, and a drive end of the unblocking drive mechanism is detachably connected with one end of the heat-unblocking component and the cold-unblocking component respectively. The present application effectively handles different blockage situations of the furnace discharging pipe by connecting the unblocking drive mechanism with an unblocking rod capable of heat-unblocking and a drilling rod capable of cold-unblocking, thereby two modes of heat-unblocking and cold-unblocking are performed on the furnace discharging pipe; and the discharging pipe may be unblocked by a remote operation.
    Type: Application
    Filed: October 23, 2023
    Publication date: May 2, 2024
    Applicants: China Nuclear Sichuan Environmental Protection Engineering Co., Ltd., China Building Materials Academy, China Nuclear Power Engineering Co., Ltd.
    Inventors: Weidong XU, Yu CHANG, Yongchang ZHU, Hong DUAN, Chunyu TIAN, Wei WU, Debo YANG, Qingbin ZHAO, Shuaizhen WU, Lin WANG, Zhu CUI, Heyi GUO, Maosong FAN, Yuancheng SUN, Jie MEI, Xiaoli AN, Yongxiang ZHAO, Qinda LIU
  • Publication number: 20240144789
    Abstract: Disclosed are visual recognition and sensor fusion weight detection system and method. An example method includes: tracking, by a sensor system, objects and motions within a selected area of a store; activating, by the sensor system, a first computing device positioned in the selected area in response to detecting a presence of a customer within the selected area: identifying, by the sensor system, the customer and at least one item carried by the customer; transmitting, by the sensor system, identifying information of the customer and the at least one item to a computing server system via a communication network; measuring, by the first computing device, a weight of the at least one item; transmitting, by the first computing device, the weight to the computing server system via the communication network; and generating, by the computing server system, via the communication network, transaction information of the at least one item.
    Type: Application
    Filed: January 10, 2024
    Publication date: May 2, 2024
    Inventors: Lin Gao, Shiyuan Yang
  • Publication number: 20240145554
    Abstract: Various embodiments of the present disclosure are directed towards a method for forming a semiconductor structure, the method includes forming a buffer layer over a substrate. An active layer is formed on the buffer layer. A top electrode is formed on the active layer. An etch process is performed on the buffer layer and the substrate to define a plurality of pillar structures. The plurality of pillar structures include a first pillar structure laterally offset from a second pillar structure. At least portions of the first and second pillar structures are spaced laterally between sidewalls of the top electrode.
    Type: Application
    Filed: January 11, 2024
    Publication date: May 2, 2024
    Inventors: Yao-Chung Chang, Chun Lin Tsai, Ru-Yi Su, Wei Wang, Wei-Chen Yang
  • Publication number: 20240145600
    Abstract: A semiconductor device includes a gate electrode, a gate insulating layer, an active layer, a source electrode and a drain electrode. The gate insulating layer is disposed between the gate electrode and the active layer, the source electrode and the drain electrode are arranged on one side of the gate insulating layer, wherein the gate insulating layer includes multilayer oxide films stacked on each other and at least one interface layer between the multilayer oxide films, and the material of the at least one interface layer is different from the material of the oxide films.
    Type: Application
    Filed: January 20, 2023
    Publication date: May 2, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Chih WEN, Yi-Lin YANG, Hai-Ching CHEN
  • Publication number: 20240143391
    Abstract: The present application discloses a dispatching and control cloud data processing method, device and system. The method includes the following operations: pilot node device acquires a global scheduling task, decomposes the global scheduling task to obtain scheduling tasks, issues the scheduling tasks to collaborative node device, acquires data collection ranges and data processing rules of the collaborative node devices, and delivers them to the collaborative node devices; the collaborative node devices receive and execute the scheduling tasks issued by the pilot node device; receives the data collection ranges and the data processing rules issued by the pilot node device, acquires, based on the scheduling tasks, collected data in the data collection ranges, processes the acquired collected data according to the data processing rules to obtain the processed data, uploads the processed data to the pilot node device; the pilot node device receives the processed data uploaded by the collaborative node devices.
    Type: Application
    Filed: August 12, 2021
    Publication date: May 2, 2024
    Inventors: Dapeng LI, Lixin LI, Qingbo YANG, Lei TAO, Yunhao HUANG, Fangchun DI, Xuri SONG, Xiaolin QI, Nan YANG, Can CUI, Wenyue XIA, Ruili YE, Shuzhou WU, Lin XIE, Zhoujie ZHANG
  • Publication number: 20240145381
    Abstract: In some embodiments, the present disclosure relates an integrated chip including a substrate. A conductive interconnect feature is arranged over the substrate. The conductive interconnect feature has a base feature portion with a base feature width and an upper feature portion with an upper feature width. The upper feature width is narrower than the base feature width such that the conductive interconnect feature has tapered outer feature sidewalls. An interconnect via is arranged over the conductive interconnect feature. The interconnect via has a base via portion with a base via width and an upper via portion with an upper via width. The upper via width is wider than the base via width such that the interconnect via has tapered outer via sidewalls.
    Type: Application
    Filed: January 9, 2024
    Publication date: May 2, 2024
    Inventors: Shin-Yi Yang, Hsin-Yen Huang, Ming-Han Lee, Shau-Lin Shue, Yu-Chen Chan, Meng-Pei Lu
  • Publication number: 20240139301
    Abstract: The disclosure provides a method of active immunotherapy for a cancer patient, comprising administering vaccines against Globo series antigens (i.e., Globo H, SSEA-3 and SSEA-4). Specifically, the method comprises administering Globo H-CRM197 (OBI-833/821) in patients with cancer. The disclosure also provides a method of selecting a cancer patient who is suitable as treatment candidate for immunotherapy. Exemplary immune response can be characterized by reduction of the severity of disease, including but not limited to, prevention of disease, delay in onset of disease, decreased severity of symptoms, decreased morbidity and delayed mortality.
    Type: Application
    Filed: November 19, 2021
    Publication date: May 2, 2024
    Inventors: Ming-Tain LAI, Cheng-Der Tony YU, I-Ju CHEN, Wei-Han LEE, Chueh-Hao YANG, Chun-Yen TSAO, Chang-Lin HSIEH, Chien-Chih OU, Chen-En TSAI
  • Publication number: 20240144688
    Abstract: An automated checkout system accesses an image of an item inside a shopping cart and a location of the shopping cart within a store. The automated checkout system identifies a set of candidate items located within a threshold distance of the location of the shopping cart based on an item map. The item map describes a location of each item within the store and the location of each candidate item corresponds to a location of the candidate item on the item map. The automated checkout system inputs visual features of the item extracted from the image to a machine-learning model to identify the item by determining a similarity score between the item and each candidate item of the set of candidate items. After identifying the item, the automated checkout system displays a list comprising the item and additional items within the shopping cart to a user.
    Type: Application
    Filed: November 30, 2022
    Publication date: May 2, 2024
    Inventors: Lin Gao, Yilin Huang, Shiyuan Yang, Xiaofei Zhou, Xiao Zhou, Qunwei Liu
  • Publication number: 20240144904
    Abstract: Described herein are window retrofits including a monolithic silica aerogel slab having (i) an average haze value of <5% as calculated in accordance with ASTM standard D1003-13 and (ii) a U-factor of <0.5 BTU/sf/hr/° F., and a transparent polymer envelope sealed at an internal pressure of ?1 atmosphere, wherein the monolithic silica aerogel slab is encapsulated in the transparent polymer envelope. The monolithic aerogel slab can have a transmittance>94% at 8 mm thickness. The window retrofit can be bonded to a glass sheet.
    Type: Application
    Filed: June 27, 2023
    Publication date: May 2, 2024
    Inventors: Evelyn N. Wang, Gang Chen, Xuanhe Zhao, Elise M. Strobach, Bikramjit S. Bhatia, Lin Zhao, Sungwoo Yang, Lee A. Weinstein, Thomas A. Cooper, Shaoting Lin
  • Publication number: 20240145498
    Abstract: Some embodiments relate to an integrated chip including a substrate having a first side and a second side opposite the first side. The integrated chip further includes a first photodetector positioned in a first pixel region within the substrate. A floating diffusion region with a first doping concentration of a first polarity is positioned on the first side of the substrate in the first pixel region. A first body contact region with a second doping concentration of a second polarity different from the first polarity is positioned on the second side of the substrate in the first pixel region.
    Type: Application
    Filed: January 4, 2023
    Publication date: May 2, 2024
    Inventors: Hao-Lin Yang, Fu-Sheng Kuo, Ching-Chun Wang, Hsiao-Hui Tseng, Tzu-Jui Wang, Chen-Jong Wang, Dun-Nian Yaung
  • Patent number: 11973422
    Abstract: The present invention discloses a high step-down modular DC power supply, belonging to the field of power electronics technology, and the high step-down modular DC power supply includes an upper modular cascade circuit string, a lower modular cascade circuit string, a load, and an input source, where the upper modular cascade circuit string includes i upper sub-module circuits, and the lower modular cascade circuit string includes j lower sub-module circuits. A combination manner of module circuits includes: upper module string cascading, lower module string cascading, and hybrid cascading of the upper module string and the lower module string. The power supply is formed to be a high voltage step-down ratio power supply with high voltage direct current input and low voltage direct current output through modular cascading.
    Type: Grant
    Filed: May 20, 2021
    Date of Patent: April 30, 2024
    Assignee: ZHEJIANG UNIVERSITY
    Inventors: Wuhua Li, Chushan Li, Lin Zhu, Huan Yang, Shengdao Ren, Huiqiang Yan, Jing Sheng, Xiangning He
  • Publication number: 20240133674
    Abstract: A high-resolution handheld OCT imaging system related to the optical imaging field solves the issues of handheld OCT systems with low resolution and the inability to measure the skin's stratum corneum thickness accurately. Through adopting the visible wavelength band of supercontinuum laser as the light source, mainly applying reflectors instead of lenses in the OCT system, and replacing fiber propagation with optical propagation in free space in the interference optical paths, to significantly reduce dispersion loss in the axial resolution and improve the axial resolution of OCT systems. The filter, attenuator, grating, camera, and other components are separated from the handheld module through modular design to reduce the handheld terminal's size and weight and realize the system construction. The invention improves the axial resolution, obtains the thickness information of whole-body skin's stratum corneum, and provides technical approaches for skin diagnosis and related medicine development.
    Type: Application
    Filed: January 3, 2023
    Publication date: April 25, 2024
    Inventors: Shuixing Zhang, Wei Li, Jie Tian, Lin Yin, Zhiyun Yang
  • Publication number: 20240136213
    Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.
    Type: Application
    Filed: January 3, 2024
    Publication date: April 25, 2024
    Inventors: Chun-Jung HUANG, Yung-Lin HSU, Kuang Huan HSU, Jeff CHEN, Steven HUANG, Yueh-Lun YANG
  • Publication number: 20240133949
    Abstract: An outlier IC detection method includes acquiring first measured data of a first IC set, training the first measured data for establishing a training model, acquiring second measured data of a second IC set, generating predicted data of the second IC set by using the training model according to the second measured data, generating a bivariate dataset distribution of the second IC set according to the predicted data and the second measured data, acquiring a predetermined Mahalanobis distance on the bivariate dataset distribution of the second IC set, and identifying at least one outlier IC from the second IC set when at least one position of the at least one outlier IC on the bivariate dataset distribution is outside a range of the predetermined Mahalanobis distance.
    Type: Application
    Filed: October 3, 2023
    Publication date: April 25, 2024
    Applicant: MEDIATEK INC.
    Inventors: Yu-Lin Yang, Chin-Wei Lin, Po-Chao Tsao, Tung-Hsing Lee, Chia-Jung Ni, Chi-Ming Lee, Yi-Ju Ting
  • Publication number: 20240134114
    Abstract: A dispersion-compensation microstructure fiber uses pure silica glass as the background material. It includes the core, the first-type defects, the second-type defects and the cladding. The air holes in the fiber cross section are arranged in the equilateral triangle lattice with the same adjacent air-hole to air-hole spacing. The core is formed by omitting 1 air hole. The first-type defects are formed by the 6 air holes locating at the vertices of hexagonal third-layer porous structure surrounding the core and their surrounding background material. The second-type defects are formed by the air holes in the first air-hole layer surrounding each first-type defect and their surrounding background material. The second-type defects act as the porous structure to surround the first-type defects and the fundamental defect modes, and can also combine with the first-type defects to act as the core of the second-order defect modes.
    Type: Application
    Filed: December 22, 2023
    Publication date: April 25, 2024
    Applicant: YANSHAN UNIVERSITY
    Inventors: Wei WANG, Chang ZHAO, Xiaochen KANG, Hongda YANG, Wenchao LI, Zheng LI, Lin SHI