Abstract: A memory device includes a plurality of memory dies. Each memory die of the plurality of memory dies includes a memory die and control logic, operatively coupled with the memory die, to perform operations including receiving, during a current auxiliary data communication cycle, a token to enable auxiliary data communication, in response to receiving the token, determining whether to communicate auxiliary data via an auxiliary data channel to at least one other memory die of a plurality of memory dies, and in response to determining to communicate the auxiliary data via the auxiliary data channel to the at least one other memory die, causing the auxiliary data to be communicated to the at least one other memory die.

Abstract: A method includes selecting a particular ready/busy pin (R/B #) among a plurality of R/B # pins that are associated with respective memory dice among a plurality of memory dice of a memory device. The method further includes receiving, by at least one memory dice among the plurality of memory dice, signaling indicative of performance of a memory access while the particular R/B # pin is set to low, and, initiating an internal clocking signal subsequent to receipt of the signaling indicative of performance of the memory access, wherein the internal clocking signal is associated with timing of operations performed by the plurality of memory dice.

Abstract: A first command associated with a first memory die is communicated via a first portion of an interface of the memory sub-system. A second command associated with a second memory die is communicated via the first portion of the interface to a second memory die. A data burst corresponding to the first memory die is caused to be communicated via a second portion of the interface, where the second command is communicated via the first portion of the interface concurrently with the data burst communicated via the second portion of the interface.

Abstract: Multiple copies of a stored data are sensed from a subset of memory cells of an array of memory cells into a plurality of latch elements in a page buffer coupled to the array of memory cells. Two or more latch elements are selected by enabling a respective select line of each of the two or more latch elements. An output data is determined based on a sensing of the conducting line driven by the two or more latch elements.

Abstract: A variety of applications can include a memory device having a memory die designed to control a power budget for a cache and a memory array of the memory die. A first flag received from a data path identifies a start of a cache operation on the data and a second flag from the data path identifies an end of the cache operation. A controller for peak power management can be implemented to control the power budget based on determination of usage of current associated with the cache from the first and second flags. In various embodiments, the controller can be operable to feedback a signal to a memory controller external to the memory die to adjust an operating speed of an interface from the memory controller to the memory die. Additional devices, systems, and methods are discussed.

Abstract: A method includes receiving a request to perform a memory access operation, wherein the memory access operation includes a set of sub-operations, selecting a current quantization data structure from a plurality of current quantization data structures, wherein each current quantization data structure of the plurality of current quantization data structures maintains, for each sub-operation of the set of sub-operations, a respective current quantization value reflecting an amount of current that is consumed by the respective sub-operation based on a set of peak power management (PPM) operation parameters, and causing the memory access operation to be performed using PPM based on the current quantization data structure.

Abstract: Operations include generating a voltage level associated with a digital signal corresponding to a write operation associated with one or more memory cells of a memory device, comparing the voltage level to a reference voltage level to generate a comparison result, generating based on the comparison result, a command to adjust a duty cycle associated with the digital signal; and adjusting the duty cycle associated with digital signal based on the command.

Abstract: A memory device includes a plurality of input/output (I/O) nodes, a circuit, a latch, a memory, and control logic. The plurality of I/O nodes receive a predefined data pattern. The circuit adjusts a delay for each I/O node as the predefined data pattern is received. The latch latches the data received on each I/O node. The memory stores the latched data. The control logic compares the stored latched data to an expected data pattern and sets the delay for each I/O node based on the comparison.

Abstract: Disclosed are systems and methods involving memory-side write training to improve data valid window. In one implementation, a method for performing memory-side write training may comprise delaying a rising edge or a falling edge of a first data signal, delaying a rising edge or a falling edge of a second data signal, and aligning the two adjusted signals to reduce a window of time that the data signals are not valid and thereby improve or optimize the data valid window (DVW) of a memory array. According to implementations herein, various edges of data signals and clock signals may be adjusted or delayed via dedicated trim cells or circuitry present in the data paths located on the memory side of a system.

Abstract: In some implementations, a memory device may receive a command to read data in a first format from non-volatile memory, the data being stored in a second format in the non-volatile memory, the second format comprising a plurality of copies of the data in the first format. The memory device may compare, using an error correction circuit, the plurality of copies of the data to determine a dominant bit state for bits of the data. The memory device may store the dominant bit state for bits of the data in the non-volatile memory as error-corrected data in the first format. The memory device may cause the error-corrected data to be read from the non-volatile memory in the first format as a response to the command to read the data in the first format.

Abstract: Operations include establishing a queue storing a list of data burst commands to be communicated via a multiplexed interface coupled to the set of memory dies, communicating, during a first time period, a first data burst command in the queue to a first memory die of the set of memory dies via the multiplexed interface, and communicating, during a second time period, a second data burst command in the queue to a second memory die of the set of memory dies via the multiplexed interface, where a first latency associated with the first data burst command occurs during the second time period.

Abstract: A memory device includes memory dies, a first memory die of the memory dies including a memory array and control logic, operatively coupled with the memory array, to perform peak power management (PPM) operations including receiving a token from another memory die, in response to receiving the token, determining whether to reserve a data window during a token circulation time period having a first size determined based on a common clock signal shared among the memory dies and, in response to determining to reserve the data window, causing the data window to be reserved. The data window has a second size different from the first size determined based on the common clock signal. The operations further include causing a data frame to be generated within the data window. The data frame has a third size determined from the second size and includes current consumption information for the memory device.

Abstract: Operations include monitoring a logical level of a first pin of the plurality of pins while a data burst is active, wherein the first pin is associated with at least one of a read enable signal or a data strobe signal, determining whether a period of time during which the logical level of the first pin is held at a first logical level satisfies a threshold condition, in response to determining that the period of time satisfies the threshold condition, continuing to monitor the logical level of the first pin, determining whether the logical level of the first pin changed from the first logical level to a second logical level, and in response to determining that the logical level of the first pin changed from the first logical to the second logical level, causing warmup cycles to be performed.

Abstract: A memory device includes a memory array and processing logic, operatively coupled with the memory array, to perform operations including causing a data burst to be initiated by toggling a logical level of a control pin from a first level corresponding to a data burst inactive mode to a second level corresponding to a data burst active mode, wherein the data burst corresponds to a data transfer across an interface bus, causing the data burst to be suspended by toggling the logical level of the control pin from the second level to a third level corresponding to a data burst suspend mode, and causing the data burst to be resumed by toggling the logical level of the control pin from the third level to the second level.

Abstract: A memory device includes a plurality of input/output (I/O) nodes, a circuit, a latch, a memory, and control logic. The plurality of I/O nodes receive a predefined data pattern. The circuit adjusts a delay for each I/O node as the predefined data pattern is received. The latch latches the data received on each I/O node. The memory stores the latched data. The control logic compares the stored latched data to an expected data pattern and sets the delay for each I/O node based on the comparison.

Abstract: Memories for receiving or transmitting voltage signals might include an input or output buffer including a first stage having first and second inputs and configured to generate a current sink and source at its first and second outputs responsive to a voltage difference between its first and second inputs, and a second stage having a first input connected to the first output of the first stage, a second input connected to the second output of the first stage, a first voltage signal node connected to its first input through a first resistance, and a second voltage signal node connected to its second input through a second resistance, wherein a first inverter is connected in parallel with the first resistance, a second inverter is connected in parallel with the second resistance, and a pair of cross-coupled inverters are connected between the first voltage signal node and the second voltage signal node.

Abstract: A method includes selecting a particular ready/busy pin (R/B#) among a plurality of R/B# pins that are associated with respective memory dice among a plurality of memory dice of a memory device. The method further includes receiving, by at least one memory dice among the plurality of memory dice, signaling indicative of performance of a memory access while the particular R/B# pin is set to low, and, initiating an internal clocking signal subsequent to receipt of the signaling indicative of performance of the memory access, wherein the internal clocking signal is associated with timing of operations performed by the plurality of memory dice.

Abstract: A variety of applications can include a memory device having a memory die designed to control a power budget for a cache and a memory array of the memory die. A first flag received from a data path identifies a start of a cache operation on the data and a second flag from the data path identifies an end of the cache operation. A controller for peak power management can be implemented to control the power budget based on determination of usage of current associated with the cache from the first and second flags. In various embodiments, the controller can be operable to feedback a signal to a memory controller external to the memory die to adjust an operating speed of an interface from the memory controller to the memory die. Additional devices, systems, and methods are discussed.

Abstract: A memory device including a memory array operatively coupled to an array data bus and a deserializer circuit operatively coupled with the array data bus. The deserializer circuit includes a first ring counter including a first set of flip-flops to sequentially output a set of rising edge clock signals based on a reference clock input and a second ring counter portion including a second set of flip-flop circuits to sequentially output a set of falling edge clock signals based on the reference clock input. A rising data circuit portion of the deserializer circuit includes a set of flip-flops that each receive a rising data portion from a respective latch circuit in response to a rising edge clock signal. A falling data circuit portion of the deserializer circuit includes a set of flip-flops that each receive a falling data portion from a respective latch circuit in response to a falling edge clock signal.

Abstract: A variety of applications can include apparatus or methods that provide a well ring for resistive ground power domain segregation. The well ring can be implemented as a n-well in a p-type substrate. Resistive separation between ground domains can be generated by biasing a n-well ring to an external supply voltage. This approach can provide a procedure, from a process standpoint, that provides relatively high flexibility to design for chip floor planning and simulation, while providing sufficient noise rejection between independent ground power domains when correctly sized. Significant noise rejection between ground power domains can be attained.