Patents by Inventor Luis A. Aguirre
Luis A. Aguirre has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9914989Abstract: A process by which molten solder is purified in-situ, making the soldering process more efficient and yielding better results, particularly for lead-free soldering. Lead-free solder becomes practical for use since the temperature for reliable soldering is reduced. A layer of active additive is maintained on the surface of molten solder for scavenging metal oxide from the solder and assimilating metal oxide into a liquid layer. The active additive is an organic liquid having nucleophilic and/or electrophilic groups. As an example, a layer of dimer acid maintained on a wave soldering apparatus scavenges metal oxide from the bath, and assimilates dross that may form on the surface. Scavenging metal oxide cleanses the bath and lowers viscosity of the solder, and PC boards or the like soldered on the wave have reliable solder joints.Type: GrantFiled: December 15, 2015Date of Patent: March 13, 2018Assignee: MS2 Technologies, LLCInventors: Lawrence C. Kay, Erik J. Severin, Luis A. Aguirre
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Patent number: 9513412Abstract: Methods and systems for forming a displacement scale comprising TIR prisms on a substrate are described. A system for forming the displacement scale includes one or more rollers having a pattern of total internal reflection (TIR) prism features in negative relief. As the rollers are rotated, the scale is formed on the substrate. The rollers may also include pattern features in negative relief. Rotation of the rollers simultaneously forms the displacement scale and the pattern features on the substrate. The TIR prism features of the displacement scale may be oriented to provide measurement of one or more of lateral displacement, longitudinal displacement and angular displacement.Type: GrantFiled: June 18, 2008Date of Patent: December 6, 2016Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Daniel H. Carlson, Dale L. Ehnes, Daniel S. Wertz, Luis A. Aguirre, Levent Biyikli, Alan B. Campbell
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Publication number: 20160312334Abstract: A process by which molten solder is purified in-situ, making the soldering process more efficient and yielding better results, particularly for lead-free soldering. Lead-free solder becomes practical for use since the temperature for reliable soldering is reduced. A layer of active additive is maintained on the surface of molten solder for scavenging metal oxide from the solder and assimilating metal oxide into a liquid layer. The active additive is an organic liquid having nucleophilic and/or electrophilic groups. As an example, a layer of dimer acid maintained on a wave soldering apparatus scavenges metal oxide from the bath, and assimilates dross that may form on the surface. Scavenging metal oxide cleanses the bath and lowers viscosity of the solder, and PC boards or the like soldered on the wave have reliable solder joints.Type: ApplicationFiled: December 15, 2015Publication date: October 27, 2016Inventors: Lawrence C. Kay, Erik J. Severin, Luis A. Aguirre
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Patent number: 9212407Abstract: A process by which molten solder is purified in-situ, making the soldering process more efficient and yielding better results, particularly for lead-free soldering. Lead-free solder becomes practical for use since the temperature for reliable soldering is reduced. A layer of active additive is maintained on the surface of molten solder for scavenging metal oxide from the solder and assimilating metal oxide into a liquid layer. The active additive is an organic liquid having nucleophilic and/or electrophilic groups. As an example, a layer of dimer acid maintained on a wave soldering apparatus scavenges metal oxide from the bath, and assimilates dross that may form on the surface. Scavenging metal oxide cleanses the bath and lowers viscosity of the solder, and PC boards or the like soldered on the wave have reliable solder joints.Type: GrantFiled: November 18, 2013Date of Patent: December 15, 2015Assignee: MS2 Technologies, LLCInventors: Lawrence C. Kay, Erik J. Severin, Luis A. Aguirre
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Patent number: 8789981Abstract: Disclosed is an expandable envelope that comprises a light directing film this both transmits and reflects light. In its inflated form and along with a light source, the envelope forms a light balloon that due to the light directing film provides directed light to an area surrounding the balloon.Type: GrantFiled: October 1, 2010Date of Patent: July 29, 2014Assignee: 3M Innovative Properties CompanyInventors: Michael R. Harms, Lance E. Behymer, Justin W. Wilhelm, Lars A. Smeenk, Mark H. Smith, Luis A. Aguirre, Felix Bierbaum, Karl K. Stensvad
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Publication number: 20140196572Abstract: A process by which molten solder is purified in-situ, making the soldering process more efficient and yielding better results, particularly for lead-free soldering. Lead-free solder becomes practical for use since the temperature for reliable soldering is reduced. A layer of active additive is maintained on the surface of molten solder for scavenging metal oxide from the solder and assimilating metal oxide into a liquid layer. The active additive is an organic liquid having nucleophilic and/or electrophilic groups. As an example, a layer of dimer acid maintained on a wave soldering apparatus scavenges metal oxide from the bath, and assimilates dross that may form on the surface. Scavenging metal oxide cleanses the bath and lowers viscosity of the solder, and PC boards or the like soldered on the wave have reliable solder joints.Type: ApplicationFiled: November 18, 2013Publication date: July 17, 2014Applicant: MS2 TECHNOLOGIES, LLCInventors: Lawrence C. Kay, Erik J. Severin, Luis A. Aguirre
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Patent number: 8584925Abstract: A process by which molten solder is purified in-situ, making the soldering process more efficient and yielding better results, particularly for lead-free soldering. Lead-free solder becomes practical for use since the temperature for reliable soldering is reduced. A layer of active additive is maintained on the surface of molten solder for scavenging metal oxide from the solder and assimilating metal oxide into a liquid layer. The active additive is an organic liquid having nucleophilic and/or electrophilic groups. As an example, a layer of dimer acid maintained on a wave soldering apparatus scavenges metal oxide from the bath, and assimilates dross that may form on the surface. Scavenging metal oxide cleanses the bath and lowers viscosity of the solder, and PC boards or the like soldered on the wave have reliable solder joints.Type: GrantFiled: August 15, 2011Date of Patent: November 19, 2013Assignee: MS2 Technologies, LLCInventors: Lawrence C. Kay, Erik J. Severin, Luis A. Aguirre
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Patent number: 8532137Abstract: A method and architecture for Packet-Aware Transport Networks (PATN) which supports both packet and traditional TDM services and which leverages an assemblage of emerging technologies to provide efficient aggregation and switching of packet traffic in metro networks. The PATN provides significant cost savings to carriers by reducing the number of network elements, reducing transport costs through statistical multiplexing, and eliminating the need for redundant multiplexing operations.Type: GrantFiled: March 26, 2004Date of Patent: September 10, 2013Assignee: AT&T Intellectual Property II, L.P.Inventors: Thomas Scott Afferton, Luis Aguirre-Torres, Robert Duncan Doverspike, Charles Robert Kalmanek, Jr., Kadangode K. Ramakrishnan
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Patent number: 8405831Abstract: Methods and systems for indicating the displacement of a flexible web are described. An elongated, flexible web includes an integral scale having scale features configured to modulate energy directed towards the web. A transport mechanism provides relative movement between the web relative to a transducer. The transducer detects energy modulated by the scale features and generates a signal indicting a continuous web displacement based on the modulated energy.Type: GrantFiled: June 18, 2008Date of Patent: March 26, 2013Assignee: 3M Innovative Properties CompanyInventors: Daniel H. Carlson, Dale L. Ehnes, Daniel S. Wertz, Luis A. Aguirre, Levent Biyikli, Alan B. Campbell
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Publication number: 20120081908Abstract: Disclosed is an expandable envelope that comprises a light directing film this both transmits and reflects light. In its inflated form and along with a light source, the envelope forms a light balloon that due to the light directing film provides directed light to an area surrounding the balloon.Type: ApplicationFiled: October 1, 2010Publication date: April 5, 2012Inventors: Michael R. Harms, Lance E. Behymer, Justin W. Wilhelm, Lars A. Smeenk, Mark H. Smith, Luis A. Aguirre, Felix Bierbaum, Karl K. Stensvad
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Publication number: 20110296952Abstract: A process by which molten solder is purified in-situ, making the soldering process more efficient and yielding better results, particularly for lead-free soldering. Lead-free solder becomes practical for use since the temperature for reliable soldering is reduced. A layer of active additive is maintained on the surface of molten solder for scavenging metal oxide from the solder and assimilating metal oxide into a liquid layer. The active additive is an organic liquid having nucleophilic and/or electrophilic groups. As an example, a layer of dimer acid maintained on a wave soldering apparatus scavenges metal oxide from the bath, and assimilates dross that may form on the surface. Scavenging metal oxide cleanses the bath and lowers viscosity of the solder, and PC boards or the like soldered on the wave have reliable solder joints.Type: ApplicationFiled: August 15, 2011Publication date: December 8, 2011Inventors: Lawrence C. Kay, Erik J. Severin, Luis A. Aguirre
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Publication number: 20110062215Abstract: A process by which molten solder is purified in-situ, making the soldering process more efficient and yielding better results, particularly for lead-free soldering. Lead-free solder becomes practical for use since the temperature for reliable soldering is reduced. A layer of active additive is maintained on the surface of molten solder for scavenging metal oxide from the solder and assimilating metal oxide into a liquid layer. The active additive is an organic liquid having nucleophilic and/or electrophilic groups. As an example, a layer of dimer acid maintained on a wave soldering apparatus scavenges metal oxide from the bath, and assimilates dross that may form on the surface. Scavenging metal oxide cleanses the bath and lowers viscosity of the solder, and PC boards or the like soldered on the wave have reliable solder joints.Type: ApplicationFiled: November 23, 2010Publication date: March 17, 2011Inventors: Lawrence C. Kay, Erik J. Severin, Luis A. Aguirre
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Patent number: 7861915Abstract: A process by which molten solder is purified in-situ, making the soldering process more efficient and yielding better results, particularly for lead-free soldering. Lead-free solder becomes practical for use since the temperature for reliable soldering is reduced. A layer of active additive is maintained on the surface of molten solder for scavenging metal oxide from the solder and assimilating metal oxide into a liquid layer. The active additive is an organic liquid having nucleophilic and/or electrophilic groups. As an example, a layer of dimer acid maintained on a wave soldering apparatus scavenges metal oxide from the bath, and assimilates dross that may form on the surface. Scavenging metal oxide cleanses the bath and lowers viscosity of the solder, and PC boards or the like soldered on the wave have reliable solder joints.Type: GrantFiled: April 18, 2005Date of Patent: January 4, 2011Assignee: MS2 Technologies, LLCInventors: Lawrence C. Kay, Erik J. Severin, Luis A. Aguirre
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Publication number: 20100196607Abstract: Methods and systems for forming a displacement scale comprising TIR prisms on a substrate are described. A system for forming the displacement scale includes one or more rollers having a pattern of total internal reflection (TIR) prism features in negative relief. As the rollers are rotated, the scale is formed on the substrate. The rollers may also include pattern features in negative relief. Rotation of the rollers simultaneously forms the displacement scale and the pattern features on the substrate. The TIR prism features of the displacement scale may be oriented to provide measurement of one or more of lateral displacement, longitudinal displacement and angular displacement.Type: ApplicationFiled: June 18, 2008Publication date: August 5, 2010Applicant: 3M INNOVATIVE PROPERTIES COMPANYInventors: Daniel H. Carlson, Dale L. Ehnes, Daniel S. Wertz, Luis A. Aguirre, Levent Biyikli, Alan B. Campbell
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Publication number: 20100187277Abstract: Methods and systems for indicating the displacement of a flexible web are described. An elongated, flexible web includes an integral scale having scale features configured to modulate energy directed towards the web. A transport mechanism provides relative movement between the web relative to a transducer. The transducer detects energy modulated by the scale features and generates a signal indicting a continuous web displacement based on the modulated energy.Type: ApplicationFiled: June 18, 2008Publication date: July 29, 2010Inventors: Daniel H. Carlson, Dale L. Ehnes, Daniel S. Wertz, Luis A. Aguirre, Levent Biyikli, Alan B. Campbell
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Publication number: 20100188668Abstract: Methods and systems for determining the displacement of a substrate using a scale comprising TIR scale features are described. A scale that includes a number of total internal reflection (TIR) prisms as scale elements is disposed on the substrate. Light directed towards the scale is modulated by the TIR prisms. A signal indicating a displacement of the substrate is generated based on the modulated light. The signal 10 may be used to determine the web position, to control web movement, and/or to measure various web parameters.Type: ApplicationFiled: June 18, 2008Publication date: July 29, 2010Applicant: 3M INNOVATIVE PROPERTIES COMPANYInventors: Daniel H. Carlson, Dale L. Ehnes, Daniel S. Wertz, Luis A. Aguirre, Levent Biyikli, Alan B. Campbell
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Patent number: 7414547Abstract: A calibration system for a rotary encoder comprises a rotary encoder disposed on a manufacturing substrate, the rotary encoder including an encoder pattern. The calibration system also includes a calibration pattern written onto a surface of the substrate, the calibration pattern comprising a ring that includes a grating pattern, where a radial position of the grating pattern corresponds to an error value of the position of the encoder pattern. A method of calibrating the errors of a rotary encoder and a method of fabricating a high resolution rotary encoder on a surface of a manufacturing substrate are also provided.Type: GrantFiled: December 22, 2006Date of Patent: August 19, 2008Assignee: 3M Innovative Properties CompanyInventors: Wei Wang, Levent Biyikli, Luis A. Aguirre
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Publication number: 20080149816Abstract: A calibration system for a rotary encoder comprises a rotary encoder disposed on a manufacturing substrate, the rotary encoder including an encoder pattern. The calibration system also includes a calibration pattern written onto a surface of the substrate, the calibration pattern comprising a ring that includes a grating pattern, where a radial position of the grating pattern corresponds to an error value of the position of the encoder pattern. A method of calibrating the errors of a rotary encoder and a method of fabricating a high resolution rotary encoder on a surface of a manufacturing substrate are also provided.Type: ApplicationFiled: December 22, 2006Publication date: June 26, 2008Inventors: Wei Wang, Levent Biyikli, Luis A. Aguirre
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Publication number: 20070276403Abstract: Instruments and methods are provided for delivering multiple implants to multiple implant locations in a patient without requiring a second implant to be loaded onto or engaged to the delivery instrument after delivery of a first implant. The implants can be sequentially engaged using the delivery instrument to the patient or to receptacles of one or more receiving members secured to the patient.Type: ApplicationFiled: May 12, 2006Publication date: November 29, 2007Inventors: Richard Franks, Harold Taylor, Rolando Puno, Mitch Campbell, Luis Aguirre
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Publication number: 20050230457Abstract: A process by which molten solder is purified in-situ, making the soldering process more efficient and yielding better results, particularly for lead-free soldering. Lead-free solder becomes practical for use since the temperature for reliable soldering is reduced. A layer of active additive is maintained on the surface of molten solder for scavenging metal oxide from the solder and assimilating metal oxide into a liquid layer. The active additive is an organic liquid having nucleophilic and/or electrophilic groups. As an example, a layer of dimer acid maintained on a wave soldering apparatus scavenges metal oxide from the bath, and assimilates dross that may form on the surface. Scavenging metal oxide cleanses the bath and lowers viscosity of the solder, and PC boards or the like soldered on the wave have reliable solder joints.Type: ApplicationFiled: April 18, 2005Publication date: October 20, 2005Inventors: Lawrence Kay, Erik Severin, Luis Aguirre