Abstract: This invention concerns a process useful for ablating features from a substrate, including the steps of illuminating the substrate with laser light that has passed through a mask to form an ablated feature in the substrate, wherein the mask is orbited perpendicular to the angle of the laser light during formation of the feature thereby forming a selected wall shape. This invention also concerns an apparatus useful for making holes in a substrate having a radiation source; a mask positioned between the radiation source and a substrate to be irradiated with radiation from the radiation source, wherein the mask is capable of following a trajectory perpendicular to the angle of the radiation.

Abstract: A Method and Apparatus for ablating features from a substrate, such as drilling holes in a polymer substrate for an ink jet printhead, by illuminating the substrate that has passed through a mask that is continuously orbited or moved in a two dimensional pattern. The mask is capable of following a trajectory perpendicular to the angle of the radiation.