Abstract: Disclosed are a system, method and device for negotiating a data transmission mode over an attachment unit interface (DDI). A data transceiver circuit may be coupled to one or more data lanes of the DDI. A negotiation section may receive a link pulse signal on at least one data lane in the DDI during a negotiation period and selectively configure the data transceiver to transmit and receive data on one or more data lanes according to a data transmission mode based upon the received link pulse signal.

Abstract: Described are methods of processing one or more semiconductor wafers wherein the one or more wafers are processed in the presence of a gaseous antistatic agent. The method generally comprises performing one or more chemical treatment, rinsing, and/or drying steps in the presence of a gaseous antistatic agent. Preferably, a gaseous antistatic agent is present during at least a portion of a drying step and more preferably, during at least a portion of both a rinsing step and a drying step. In one preferred embodiment, the gaseous antistatic agent comprises carbon dioxide.

Abstract: A Test Adapter for actively testing chip package such as a ball grid array in operation with a printed circuit board are disclosed. The test adapter provides accessible test points for monitoring input and output signals of an operating chip package. The adapter includes an interface adapter board having a plurality of contact pads disposed on its surface, in a pattern corresponding to the footprint of the chip package. A plurality of contact terminals protrude from the bottom of the interface adapter board and are connected to the contact pads on the upper surface, and are configured to engage a receiving socket mounted to a printed circuit board. A plurality of test pins are also connected to the contact pins such that test probes can be connected to the test pins and the input/output signals associated with the chip package can be monitored by the probes.