Abstract: A display device having a non-display region is provided. The display device includes a first conductive line to which a voltage is applied and a second conductive line which is at least partially overlapped with the first conductive line. There is a distance between the first conductive line and the second conductive line in a normal direction of the display device is greater than or equal to 3500 angstroms, and less than or equal to 4500 angstroms.

Abstract: Devices and methods of manufacture for a hybrid interposer within a semiconductor device. A semiconductor device may include a package substrate and a hybrid interposer. The hybrid interposer may include an organic interposer material layer, and a non-organic interposer material layer positioned between the organic interposer material layer and the package substrate. The semiconductor device may further include an integrated device positioned within the hybrid interposer. In one embodiment, the integrated device may be positioned within the organic interposer material layer. In another embodiment, the integrated device may be positioned within the non-organic interposer material layer. In a further embodiment, the integrated device may be positioned within the organic interposer material layer and the non-organic interposer material layer.

Abstract: A rotation-type optical module includes a driving element, a turntable, an optical material, a balancing ring, and a first weight substance. The driving element includes a body and a rotating shaft body. The turntable is sleeved on the rotating shaft body and includes a first surface and a second surface. The optical material is disposed on the first surface of the turntable. The balancing ring is disposed between the driving element and the turntable and includes a third surface and a fourth surface, and the third surface and the second surface face each other. The balancing ring includes an outer retaining wall and at least one inner retaining wall which protrude from the fourth surface, and the first weight substance abuts between the outer retaining wall and the at least one inner retaining wall. A projection apparatus including the foregoing rotation-type optical module is further provided.

Abstract: To minimize the width of a non-light-emitting border region around an opening in the active area, data lines may be stacked in the border region. Data line portions may be formed using three metal layers in three different planes within the border region. A metal layer that forms a positive power signal distribution path in the active area may serve as a data line portion in the border region. A metal layer may be added in the border region to serve as a data line portion in the border region. Data line signals may also be provided to pixels on both sides of an opening in the active area using supplemental data line paths. A supplemental data line path may be routed through the active area of the display to electrically connect data line segments on opposing sides of an opening within the display.

Abstract: A self-tapping screw for use in securing at least two materials together. The self-tapping screw may include a screw cap that receives a screw body to reinforce the strength of the screw head. The screw cap is composed of a zinc-aluminum alloy that may be die casted and provides additional strength and hardness to the attached screw body. The screw cap has a rolled flange that helps to securely retain the flat rim of the attached screw body.

Abstract: An electronic device for updating on-board data of power off status is provided, which combines a rewritable memory, an embedded controller, and a second network socket onto a motherboard. The rewritable memory includes a target storage area. The embedded controller includes a second network interface electrically connected to the second network socket, for receiving a writing command and a binary file. After receiving power of a standby mode, the embedded controller executes a data writing program to receive the writing command and the binary file via the second network socket and the second network interface, and writes the binary data file into the target storage area of the rewritable memory by using the data writing program.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A wavelength conversion element includes a substrate, an adhesion layer and a wavelength conversion material. The substrate has a bearing surface having an adhesion zone. The adhesion zone has a central portion and two edge portions respectively on two sides of the central portion. The adhesion layer is disposed on the adhesion zone and includes a first adhesive and a second adhesive. The first adhesive is disposed at the edge portions. The second adhesive is disposed at the central portion. Operating temperature of the first adhesive is lower than operating temperature of the second adhesive. Viscosity of the first adhesive is larger than viscosity of the second adhesive. The wavelength conversion material is fixed on the bearing surface by the first adhesive and the second adhesive. A projection apparatus having the wavelength conversion element is provided, and the durability of the wavelength conversion element and the projection apparatus is improved.

Abstract: A foldable treadmill includes a working base, a cover pivotally connected with the working base, a walking belt mounted on the working base, at least two rollers arranged in the walking belt, a support board arranged in the walking belt, two handle units mounted on the working base, and a front support rack mounted on the cover. The working base has two first receiving grooves. The cover has a second receiving groove. The two handle units are removably received in the two first receiving grooves of the working base respectively. Each of the two handle units includes an upright pivotally connected with the working base, and a first handle pivotally connected with the upright. The front support rack is pivotally connected with the cover and received in the second receiving groove of the cover.

Abstract: A method of fabricating integrated passive device dies includes forming a first plurality of integrated passive devices on a substrate, forming a plurality of micro-bumps on the first plurality of integrated passive devices such that the plurality of micro-bumps act as electrical connections to the integrated passive devices, and dicing the substrate to form an integrated passive device die including a second plurality of integrated passive devices. The micro-bumps may be formed in an array or staggered configuration and may have a pitch that is in a range from 20 microns to 100 microns. The integrated passive devices may each include a seal ring and the integrated passive device die may have an area that is a multiple of an integrated passive device area. The method may further include dicing the substrate in various ways to generate integrated passive device dies having different sizes and numbers of integrated passive devices.

Abstract: An interposer may include a first metal trace located on a first dielectric layer, a second dielectric layer located on the first dielectric layer, a line-shaped via located in the second dielectric layer and connected to the first metal trace, and a second metal trace located on the second dielectric layer and connected to the line-shaped via.

Abstract: The present invention provides a novel Lactobacillus fermentum strain, named Lactobacillus fermentum strain V3, and its use in manufacturing a pharmaceutical composition or a food composition for regulating intestinal microflora and treating and/or preventing an inflammatory diseases and/or a cancer.

Abstract: An electronic device includes a frame and a display stack. The frame defines a first part of an interior volume. The display stack includes a cover attached to the frame. The cover may define a second part of the interior volume. The display stack also includes an array of organic light-emitting diodes (OLEDs) including an array of emissive electroluminescent (EL) regions, and at least one organic photodetector (OPD) disposed between the cover and at least one emissive EL region in the array of emissive electroluminescent regions. The at least one emissive EL region emits light through the at least one OPD. In alternative embodiments, the OLEDs may be stacked on the OPDs, or the OLEDs and OPDs may be interspersed with each other instead of stacked.

Abstract: A display device is provided. The display device includes a panel. The panel includes a display region and a non-display region and has a normal direction in which the non-display region is adjacent to the display region. The non-display region includes a first conductive line and a second conductive line. A common voltage is applied to the first conductive line. The second conductive line is at least partially overlapped with the first conductive line. There is a distance between the first conductive line and the second conductive line in the normal direction. The distance is greater than or equal to 3500 ?, and less than or equal to 4500 ?.

Abstract: A wavelength conversion module includes a wavelength conversion wheel, a driving assembly, thermal conductive adhesive structures, and a deflector. The wavelength conversion wheel includes a turntable and a wavelength conversion layer. The driving assembly is connected to the turntable, and the wavelength conversion layer and the thermal conductive adhesive structures are respectively located on two opposite sides of the turntable. The deflector is connected to the wavelength conversion wheel along the axis through the thermal conductive adhesive structures. A plurality of heat dissipation channels are formed among the deflector, the turntable and the thermal conductive adhesive structures. An air inlet is defined by each of the heat dissipation channels and the deflector near the axis, and an air outlet is defined between each of the heat dissipation channels and a periphery of the deflector. An area of the air inlet is larger than an area of the air outlet.

Abstract: An opening is formed through a dielectric material layer to physically expose a top surface of a conductive material portion in, or over, a substrate. A metallic nitride liner is formed on a sidewall of the opening and on the top surface of the conductive material portion. A metallic adhesion layer including an alloy of copper and at least one transition metal that is not copper is formed on an inner sidewall of the metallic nitride liner. A copper fill material portion may be formed on an inner sidewall of the metallic adhesion layer. The metallic adhesion layer is thermally stable, and remains free of holes during subsequent thermal processes, which may include reflow of the copper fill material portion. An additional copper fill material portion may be optionally deposited after a reflow process.

Abstract: A method includes forming an insulating layer over a conductive feature; etching the insulating layer to expose a first surface of the conductive feature; covering the first surface of the conductive feature with a sacrificial material, wherein the sidewalls of the insulating layer are free of the sacrificial material; covering the sidewalls of the insulating layer with a barrier material, wherein the first surface of the conductive feature is free of the barrier material, wherein the barrier material includes tantalum nitride (TaN) doped with a transition metal; removing the sacrificial material; and covering the barrier material and the first surface of the conductive feature with a conductive material.

Abstract: The present invention provides a novel Streptococcus thermophilus strain ST4, and its use in manufacturing a medicament and/or food composition for treating and/or preventing an inflammatory disease and/or a cancer.

Abstract: An opening is formed through a dielectric material layer to physically expose a top surface of a conductive material portion in, or over, a substrate. A metallic nitride liner is formed on a sidewall of the opening and on the top surface of the conductive material portion. A metallic adhesion layer including an alloy of copper and at least one transition metal that is not copper is formed on an inner sidewall of the metallic nitride liner. A copper fill material portion may be formed on an inner sidewall of the metallic adhesion layer. The metallic adhesion layer is thermally stable, and remains free of holes during subsequent thermal processes, which may include reflow of the copper fill material portion. An additional copper fill material portion may be optionally deposited after a reflow process.

Abstract: Systems and methods for detection of incident light are described. An optical imaging sensor is positioned at least partially within an active display area of a display and is configured to detect and characterize one or more properties of light incident to the active display area of the display.