Abstract: A data center cooling system has an indoor portion wherein heat is absorbed from components in the data center, and an outdoor heat exchanger portion wherein outside air is used to cool a first heat transfer fluid (e.g., water) present in at least the outdoor heat exchanger portion of the cooling system during a first mode. When an appropriate time has been reached to switch from the first mode to a second mode, the outdoor heat exchanger portion of the data cooling system is switched to a second heat transfer fluid, which is a relatively low performance heat transfer fluid (compared to the first fluid). It has a second heat transfer fluid freezing point, lower than the first heat transfer fluid freezing point, and sufficiently low to operate without freezing when the outdoor air temperature drops below a first predetermined relationship with the first heat transfer fluid freezing point.

Abstract: Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.

Abstract: Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.

Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from an electronic component(s). The cooling apparatus includes a liquid-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a region of reduced cross-sectional coolant flow area. The heat sink includes a coolant inlet and outlet in fluid communication with the compartment, and the region of reduced cross-sectional coolant flow area provides an increased effective heat transfer coefficient between a main heat transfer surface of the conductive structure and the coolant. The cooling apparatus further includes a coolant loop coupled to the coolant inlet and outlet to facilitate flow of coolant through the coolant-carrying compartment, and a coolant filter positioned to filter contaminants from the coolant passing through the heat sink.

Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a coolant. The cooling apparatus includes a coolant-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a varying cross-sectional coolant flow area through which coolant flows in a direction substantially parallel to a main heat transfer surface of the structure coupled to the electronic component(s). The coolant-cooled heat sink includes a coolant inlet and a coolant outlet in fluid communication with the coolant-carrying compartment, and the coolant flow area of the coolant-carrying compartment decreases, at least in part, in a direction of coolant flow through the coolant-carrying compartment.

Abstract: A cooled electronic system and cooling method are provided, wherein a field-replaceable bank of electronic components is cooled by an apparatus which includes an enclosure at least partially surrounding and forming a compartment about the electronic components, a fluid disposed within the compartment, and a heat sink associated with the enclosure. The field-replaceable bank extends, in part, through the enclosure to facilitate operative docking of the electronic components into one or more respective receiving sockets of the electronic system. The electronic components of the field-replaceable bank are, at least partially, immersed within the fluid to facilitate immersion-cooling of the components, and the heat sink facilitates rejection of heat from the fluid disposed within the compartment. In one embodiment, multiple thermal conductors project from an inner surface of the enclosure into the compartment to facilitate transfer of heat from the fluid to the heat sink.

Abstract: A method of facilitating cooling of an electronics board having a plurality of electronic components mounted to the board by providing an apparatus which includes an immersion-cooled electronic component section and a conduction-cooled electronic component section. The immersion-cooled section includes an enclosure at least partially surrounding and forming a compartment about multiple electronic components of the electronic components mounted to the electronics board, and a fluid disposed within the compartment. The multiple electronic components are, at least in part, immersed within the fluid to facilitate immersion-cooling of those components. The conduction-cooled electronic component section includes at least one electronic component of the electronic components mounted to the electronics board, and the at least one electronic component is indirectly liquid-cooled, at least in part, via conduction of heat from the at least one electronic component.

Abstract: Apparatuses and methods are provided for facilitating cooling of an electronic component. The apparatus includes a vapor-compression refrigeration system, which includes an expansion component, an evaporator, a compressor and a condenser coupled in fluid communication. The evaporator is coupled to and cools the electronic component. The apparatus further includes a contaminant separator coupled in fluid communication with the refrigerant flow path. The separator includes a refrigerant cold filter and a thermoelectric array. At least a portion of refrigerant passing through the refrigerant flow path passes through the cold filter, and the thermoelectric array provides cooling to the cold filter to cool refrigerant passing through the filter. By cooling refrigerant passing through the filter, contaminants solidify from the refrigerant, and are deposited in the cold filter.

Abstract: Cooling apparatuses and methods of fabricating thereof are provided which facilitate pumped immersion-cooling of an electronic component(s). The cooling apparatus includes an enclosure having a compartment accommodating the electronic component(s), and dielectric fluid within the compartment at least partially immersing the electronic component(s). A liquid-cooled heat sink is associated with the enclosure to cool at least one cooling surface associated with the compartment, and facilitate heat transfer to the heat sink from the electronic component(s) via the dielectric fluid. A pump is disposed external to the compartment and in fluid communication therewith to facilitate pumped dielectric fluid flow through the compartment. The pumped dielectric fluid flow through the compartment enhances heat transfer from the electronic component(s) to the liquid-cooled heat sink via the cooling surface(s).

Abstract: Methods of facilitating cooling an electronic system are provided, which include: providing a heat sink(s) configured to cool an electronic component(s), the heat sink(s) including a coolant-carrying channel for a first coolant, the first coolant providing two-phase cooling to the electronic component(s) and being discharged from the heat sink(s) as coolant exhaust with coolant vapor; providing a node-level condensation module coupled in fluid communication with the heat sink(s), the condensation module receiving first coolant exhaust from the heat sink(s) and being liquid-cooled via a second coolant to condense coolant vapor before return to a rack-level return manifold; automatically controlling at least one of liquid-cooling of the heat sink(s), or liquid-cooling of the condensation module(s); and providing a control valve for adjusting flow rate of the second coolant to the condensation module(s), the control valve being automatically controlled based on a characterization of the coolant vapor in the cool

Abstract: A pressure control unit and method are provided for facilitating single-phase heat transfer within a liquid-based cooling system. The pressure control unit includes a pressure vessel containing system coolant, and a pressurizing mechanism associated with the pressure vessel. A coolant line couples system coolant in the pressure vessel in fluid communication with the coolant loop of the cooling system, and a regulator mechanism couples to the pressurizing mechanism to maintain pressure within the pressure vessel at or above a defined pressure threshold, thus maintaining pressure within the coolant loop above the pressure threshold. The defined pressure threshold is set to facilitate system coolant within the coolant loop remaining single-phase throughout an operational temperature range of the system coolant within the coolant loop.

Abstract: Methods are provided for facilitating cooling of an electronic component. The methods include providing: a liquid-cooled structure, a thermal conduction path coupling the electronic component and the liquid-cooled structure, a coolant loop in fluid communication with a coolant-carrying channel of the liquid-cooled structure, and an outdoor-air-cooled heat exchange unit coupled to facilitate heat transfer from the liquid-cooled structure via, at least in part, the coolant loop. The thermoelectric array facilitates transfer of heat from the electronic component to the liquid-cooled structure, and the heat exchange unit cools coolant passing through the coolant loop by dissipating heat from the coolant to outdoor ambient air. In one implementation, temperature of coolant entering the liquid-cooled structure is greater than temperature of the outdoor ambient air to which heat is dissipated.

Abstract: Cooling control methods and systems include measuring a temperature of air provided to one or more nodes by an air-to-liquid heat exchanger; measuring a temperature of at least one component of the one or more nodes and finding a maximum component temperature across all such nodes; comparing the maximum component temperature to a first and second component threshold and comparing the air temperature to a first and second air threshold; and controlling a proportion of coolant flow and a coolant flow rate to the air-to-liquid heat exchanger and the one or more nodes based on the comparisons.

Abstract: A cooling unit and cooling method are provided for a container-type data center. The cooling unit includes a heat rejection unit, for rejecting heat from coolant passing through a coolant loop to air passing across the heat rejection unit, and a refrigeration unit controllable to selectively provide auxiliary cooling to at least a portion of the coolant passing through the coolant loop. The heat rejection unit includes a heat exchange assembly, having a first heat exchanger and a second heat exchanger, and one or more air-moving devices providing airflow across the first and second heat exchangers. The first heat exchanger couples in fluid communication with the coolant loop, and the second heat exchanger is coupled in fluid communication with a refrigeration loop of the refrigeration unit for rejecting heat from refrigerant passing through the refrigeration loop to the airflow passing across the second heat exchanger.

Abstract: Dehumidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet or outlet side of the rack, wherein air flows through the rack from the air inlet to the air outlet side. The heat exchanger is positioned for air passing through the electronics rack to pass across the heat exchanger, and is in fluid communication with a coolant loop for passing coolant therethrough at a temperature below a dew point temperature of the air passing across the heat exchanger so that air passing across the heat exchanger is dehumidified and cooled. A condensate collector, disposed below the heat exchanger, collects liquid condensate from the dehumidifying of air passing through the electronics rack, wherein the heat exchanger includes a plurality of sloped surfaces configured to facilitate drainage of liquid condensate from the heat exchanger to the condensate collector.

Abstract: A cooling apparatus and method are provided. The cooling apparatus includes a coolant-cooled heat exchanger for facilitating dissipation of heat generated within an electronics rack, and a coolant control apparatus. The coolant control apparatus includes at least one coolant recirculation conduit coupled in fluid communication between a facility coolant supply and return, wherein the facility coolant supply and return facilitate providing facility coolant to the heat exchanger. The control apparatus further includes a coolant pump(s) associated with the recirculation conduit(s) and a controller which monitors a temperature of facility coolant supplied to the heat exchanger, and redirects facility coolant, via the coolant recirculation conduit(s) and coolant pump(s), from the facility coolant return to the facility coolant supply to, at least in part, ensure that facility coolant supplied to the heat exchanger remains above a dew point temperature.

Abstract: A data center cooling system is operated in a first mode; it has an indoor portion wherein heat is absorbed from components in the data center, and an outdoor heat exchanger portion wherein outside air is used to cool a first heat transfer fluid (e.g., water) present in at least the outdoor heat exchanger portion of the cooling system during the first mode. The first heat transfer fluid is a relatively high performance heat transfer fluid (as compared to the second fluid), and has a first heat transfer fluid freezing point. A determination is made that an appropriate time has been reached to switch from the first mode to a second mode. Based on this determination, the outdoor heat exchanger portion of the data cooling system is switched to a second heat transfer fluid, which is a relatively low performance heat transfer fluid, as compared to the first heat transfer fluid.

Abstract: Methods are provided for automated coolant flow control for, for instance, facilitating cooling of multiple different electronic systems. The methods include, for instance, automatically controlling coolant flow to a plurality of coolant circuits, and for a coolant circuit i of the coolant circuits: automatically determining the heat load transferred to coolant flowing through coolant circuit i, and automatically controlling coolant flow through coolant circuit i based on the determined heat load transferred to the coolant. The different coolant circuits may have the same or different coolant flow impedances, and flow through the different coolant circuits may be controlled using different heat load-to-coolant ranges for the different circuits.

Abstract: Methods and coolant distribution systems are provided for automated coolant flow control for, for instance, facilitating cooling of multiple different electronic systems. The methods include, for instance, automatically controlling coolant flow to a plurality of coolant circuits, and for a coolant circuit i of the coolant circuits: automatically determining the heat load transferred to coolant flowing through coolant circuit i, and automatically controlling coolant flow through coolant circuit i based on the determined heat load transferred to the coolant. The different coolant circuits may have the same or different coolant flow impedances, and flow through the different coolant circuits may be controlled using different heat load-to-coolant ranges for the different circuits.

Abstract: A method is provided for fabricating a cooling apparatus for cooling an electronics rack, which includes an air-to-liquid heat exchanger, one or more coolant-cooled structures, and a tube. The heat exchanger is associated with the electronics rack and disposed to cool air passing through the rack, includes a plurality of coolant-carrying tube sections, each tube section having a coolant inlet and outlet, one of which is coupled in fluid communication with a coolant loop to facilitate flow of coolant through the tube section. The coolant-cooled structure(s) is in thermal contact with an electronic component(s) of the rack, and facilitates transfer of heat from the component(s) to the coolant. The tube connects in fluid communication one coolant-cooled structure and the other of the coolant inlet or outlet of the one tube section, and facilitates flow of coolant directly between that coolant-carrying tube section of the heat exchanger and the coolant-cooled structure.