Patents by Inventor Mahesh Wagh

Mahesh Wagh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8924620
    Abstract: In an embodiment, the present invention includes a protocol stack having a transaction layer and a link layer. In addition a first physical (PHY) unit is coupled to the protocol stack to provide communication between a processor and a device coupled to the processor via a physical link, where the first PHY unit is of a low power communication protocol and includes a first physical unit circuit. In turn, a second PHY unit is coupled to the protocol stack to provide communication between the processor and the device via a sideband channel coupled between the multicore processor and the device separate from the physical link, where the second PHY unit includes a second physical unit circuit. Other embodiments are described and claimed.
    Type: Grant
    Filed: August 27, 2013
    Date of Patent: December 30, 2014
    Assignee: Intel Corporation
    Inventors: David J. Harriman, Mahesh Wagh, Robert E. Gough, James E. Jaussi
  • Publication number: 20140365796
    Abstract: In one embodiment, the present invention includes a method for sending a first link handshake signal between a first subsystem and a power management unit (PMU) of a system on a chip (SoC) to request entry into a power saving state for the first subsystem, sending a second link handshake signal between the first subsystem and the PMU to acknowledge the request, and placing the first subsystem into the power saving state without further signaling between the PMU and the first subsystem. Other embodiments are described and claimed.
    Type: Application
    Filed: August 21, 2014
    Publication date: December 11, 2014
    Inventors: Woojong Han, Madhu Athreya, Ken Shoemaker, Arvind Mandhani, Mahesh Wagh, Ticky Thakkar
  • Publication number: 20140307748
    Abstract: In one embodiment, the present invention includes a fabric on a first semiconductor die to communicate with at least one agent on the die according to an on-chip protocol and a packetization layer coupled to the fabric to receive command and data information from the fabric on multiple links and to packetize the information into a packet for transmission from the die to another die via an in-package packetized link. Other embodiments are described and claimed.
    Type: Application
    Filed: June 20, 2014
    Publication date: October 16, 2014
    Inventors: Mahesh Wagh, Abhishek Singhal, Jasmin Ajanovic
  • Patent number: 8850247
    Abstract: In one embodiment, the present invention includes a method for sending a first link handshake signal between a first subsystem and a power management unit (PMU) of a system on a chip (SoC) to request entry into a power saving state for the first subsystem, sending a second link handshake signal between the first subsystem and the PMU to acknowledge the request, and placing the first subsystem into the power saving state without further signaling between the PMU and the first subsystem. Other embodiments are described and claimed.
    Type: Grant
    Filed: June 25, 2013
    Date of Patent: September 30, 2014
    Assignee: Intel Corporation
    Inventors: Woojong Han, Madhu Athreya, Ken Shoemaker, Arvind Mandhani, Mahesh Wagh, Ticky Thakkar
  • Publication number: 20140289434
    Abstract: An interconnect architecture device of an aspect includes a processor to generate a transaction that is of a different interconnect protocol than LLI. The interconnect architecture device also includes conversion logic coupled with the processor. The conversion logic is to convert the transaction, which is of the different interconnect protocol than LLI, to an LLI packet. The interconnect architecture device also includes an LLI controller coupled with the conversion logic. The LLI controller is to couple the interconnect architecture device with an LLI link. The LLI controller is to transmit the LLI packet on the LLI link.
    Type: Application
    Filed: February 28, 2013
    Publication date: September 25, 2014
    Inventors: Sridharan Ranganathan, Mahesh Wagh
  • Publication number: 20140269471
    Abstract: Systems, apparatuses, and method for synchronizing port entry into a lowest power state are described. All logic of a port placed into an intermediate state prior to entry into the lowest power state.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Inventors: Mahesh Wagh, Su Wei Lim
  • Publication number: 20140281622
    Abstract: A device is determined to be in a low power state. A transition from the low power state to an active state is initiated, where a fixed minimum recovery time is defined for transitions from the low power state to the active state. A capability of the device is identified corresponding to transition of the device from the low power state to the active state, and the transition of the device from the low power state to the active state is completed based at least in part on the capability, such that the transition is to be completed prior to expiration of the fixed minimum recovery time.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Inventors: Mahesh Wagh, Robert E. Gough
  • Publication number: 20140281108
    Abstract: A device to process data packets for communication across PHY layers which are of different respective communication protocols. In an embodiment, the device includes a first protocol stack and a second protocol stack which are each for a PCIe™ communication protocol. The first protocol stack and a second protocol stack may interface, respectively, with a first physical (PHY) layer and a second PHY layer of the device. The first protocol stack and the second protocol stack may exchange packets to facilitate communications via both the first PHY layer and the second PHY layer. In another embodiment, the first PHY layer is for communication according to the PCIe™ communication protocol and the second PHY layer is for communication according to another, comparatively low power communication protocol.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Inventors: Akshay G. Pethe, Mahesh Wagh, Manjari Kulkarni
  • Publication number: 20140281753
    Abstract: Systems, apparatuses, and method for handling timeouts in a link state training sequence are described. All modules of a port undergoing link state training placed into an intermediate state prior to entry into the lowest power state.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Inventors: Mahesh Wagh, Su Wei Lim
  • Publication number: 20140281639
    Abstract: Methods and apparatus relating to device power management state transition latency advertisement for faster boot time are described. In some embodiments, a storage unit stores a value corresponding to a requisite transition delay period for a first agent to exit from a low power consumption state. The first agent writes the value to the storage unit and a second agent waits for the requisite transition delay period (after the first agent initiates its exit from the low power consumption state) before the second agent attempts to communicate with the first agent via a link. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Inventors: Mahesh Wagh, Lily Pao Looi
  • Patent number: 8819388
    Abstract: Methods and apparatus for control of On-Die System Fabric (OSF) blocks are described. In one embodiment, a shadow address corresponding to a physical address may be stored in response to a user-level request and a logic circuitry (e.g., present in an OSF) may determine the physical address from the shadow address. Other embodiments are also disclosed.
    Type: Grant
    Filed: July 17, 2012
    Date of Patent: August 26, 2014
    Assignee: Intel Corporation
    Inventors: Zhen Fang, Mahesh Wagh, Jasmin Ajanovic, Michael E. Espig, Ravishankar Iyer
  • Publication number: 20140237154
    Abstract: In one embodiment, the present invention includes an apparatus having an adapter to communicate according to a personal computer (PC) protocol and a second protocol. A first interface coupled to the adapter is to perform address translation and ordering of transactions received from upstream of the adapter. The first interface is coupled in turn to heterogeneous resources, each of which includes an intellectual property (IP) core and a shim, where the shim is to implement a header of the PC protocol for the IP core to enable its incorporation into the apparatus without modification. Other embodiments are described and claimed.
    Type: Application
    Filed: April 25, 2014
    Publication date: August 21, 2014
    Inventors: Arvind Mandhani, Woojong Han, Ken Shoemaker, Madhu Athreya, Mahesh Wagh, Shreekant S. Thakkar
  • Publication number: 20140237155
    Abstract: In one embodiment, the present invention includes an apparatus having an adapter to communicate according to a personal computer (PC) protocol and a second protocol. A first interface coupled to the adapter is to perform address translation and ordering of transactions received from upstream of the adapter. The first interface is coupled in turn via one or more physical units to heterogeneous resources, each of which includes an intellectual property (IP) core and a shim, where the shim is to implement a header of the PC protocol for the IP core to enable its incorporation into the apparatus without modification. Other embodiments are described and claimed.
    Type: Application
    Filed: April 25, 2014
    Publication date: August 21, 2014
    Inventors: Ken Shoemaker, Mahesh Wagh, Woojong Han, Madhu Athreya, Arvind Mandhani, Shreekant S. Thakkar
  • Patent number: 8811430
    Abstract: In one embodiment, the present invention includes a fabric on a first semiconductor die to communicate with at least one agent on the die according to an on-chip protocol and a packetization layer coupled to the fabric to receive command and data information from the fabric on multiple links and to packetize the information into a packet for transmission from the die to another die via an in-package packetized link. Other embodiments are described and claimed.
    Type: Grant
    Filed: March 23, 2012
    Date of Patent: August 19, 2014
    Assignee: Intel Corporation
    Inventors: Mahesh Wagh, Abhishek Singhal, Jasmin Ajanovic
  • Patent number: 8806068
    Abstract: A method and apparatus for enhancing/extending a serial point-to-point interconnect architecture, such as Peripheral Component Interconnect Express (PCIe) is herein described. Temporal and locality caching hints and prefetching hints are provided to improve system wide caching and prefetching. Message codes for atomic operations to arbitrate ownership between system devices/resources are included to allow efficient access/ownership of shared data. Loose transaction ordering provided for while maintaining corresponding transaction priority to memory locations to ensure data integrity and efficient memory access. Active power sub-states and setting thereof is included to allow for more efficient power management. And, caching of device local memory in a host address space, as well as caching of system memory in a device local memory address space is provided for to improve bandwidth and latency for memory accesses.
    Type: Grant
    Filed: December 6, 2012
    Date of Patent: August 12, 2014
    Assignee: Intel Corporation
    Inventors: Jasmin Ajanovic, Mahesh Wagh, Prashant Sethi, Debendra Das Sharma, David J. Harriman, Mark B. Rosenbluth, Ajay V. Bhatt, Peter Barry, Scott Dion Rodgers, Anil Vasudevan, Sridhar Muthrasanallur, James Akiyama, Robert G. Blankenship, Ohad Falik, Avi Mendelson, Ilan Pardo, Eran Tamari, Eliezer Weissmann, Doron Shamia
  • Patent number: 8793404
    Abstract: A method and apparatus for enhancing/extending a serial point-to-point interconnect architecture, such as Peripheral Component Interconnect Express (PCIe) is herein described. Temporal and locality caching hints and prefetching hints are provided to improve system wide caching and prefetching. Message codes for atomic operations to arbitrate ownership between system devices/resources are included to allow efficient access/ownership of shared data. Loose transaction ordering provided for while maintaining corresponding transaction priority to memory locations to ensure data integrity and efficient memory access. Active power sub-states and setting thereof is included to allow for more efficient power management. And, caching of device local memory in a host address space, as well as caching of system memory in a device local memory address space is provided for to improve bandwidth and latency for memory accesses.
    Type: Grant
    Filed: June 11, 2012
    Date of Patent: July 29, 2014
    Assignee: Intel Corporation
    Inventors: Jasmin Ajanovic, Mahesh Wagh, Prashant Sethi, Debendra Das Sharma, David Harriman, Mark Rosenbluth, Ajay Bhatt, Peter Barry, Scott Dion Rodgers, Anil Vasudevan, Sridhar Muthrasanallur, James Akiyama, Robert Blankenship, Ohad Falik, Abraham Mendelson, Ilan Pardo, Eran Tamari, Eliezer Weissmann, Doron Shamia
  • Publication number: 20140173164
    Abstract: In one embodiment, a converged protocol stack can be used to unify communications from a first communication protocol to a second communication protocol to provide for data transfer across a physical interconnect. This stack can be incorporated in an apparatus that includes a protocol stack for a first communication protocol including transaction and link layers, and a physical (PHY) unit coupled to the protocol stack to provide communication between the apparatus and a device coupled to the apparatus via a physical link. This PHY unit may include a physical unit circuit according to the second communication protocol. Other embodiments are described and claimed.
    Type: Application
    Filed: February 21, 2014
    Publication date: June 19, 2014
    Inventors: Sridharan Ranganathan, Mahesh Wagh, David J. Harriman
  • Patent number: 8751722
    Abstract: In one embodiment, the present invention includes an apparatus having an adapter to communicate according to a personal computer (PC) protocol and a second protocol. A first interface coupled to the adapter is to perform address translation and ordering of transactions received from upstream of the adapter. The first interface is coupled in turn via one or more physical units to heterogeneous resources, each of which includes an intellectual property (IP) core and a shim, where the shim is to implement a header of the PC protocol for the IP core to enable its incorporation into the apparatus without modification. Other embodiments are described and claimed.
    Type: Grant
    Filed: March 27, 2013
    Date of Patent: June 10, 2014
    Assignee: Intel Corporation
    Inventors: Ken Shoemaker, Mahesh Wagh, Woojong Han, Madhu Athreya, Arvind Mandhani, Shreekant S. Thakkar
  • Patent number: 8745303
    Abstract: In one embodiment, the present invention includes an apparatus having an adapter to communicate according to a personal computer (PC) protocol and a second protocol. A first interface coupled to the adapter is to perform address translation and ordering of transactions received from upstream of the adapter. The first interface is coupled in turn to heterogeneous resources, each of which includes an intellectual property (IP) core and a shim, where the shim is to implement a header of the PC protocol for the IP core to enable its incorporation into the apparatus without modification. Other embodiments are described and claimed.
    Type: Grant
    Filed: May 10, 2013
    Date of Patent: June 3, 2014
    Assignee: Intel Corporation
    Inventors: Arvind Mandhani, Woojong Han, Ken Shoemaker, Madhu Athreya, Mahesh Wagh, Shreekant S. Thakkar
  • Patent number: 8737390
    Abstract: In one embodiment, a converged protocol stack can be used to unify communications from a first communication protocol to a second communication protocol to provide for data transfer across a physical interconnect. This stack can be incorporated in an apparatus that includes a protocol stack for a first communication protocol including transaction and link layers, and a physical (PHY) unit coupled to the protocol stack to provide communication between the apparatus and a device coupled to the apparatus via a physical link. This PHY unit may include a physical unit circuit according to the second communication protocol. Other embodiments are described and claimed.
    Type: Grant
    Filed: April 25, 2013
    Date of Patent: May 27, 2014
    Assignee: Intel Corporation
    Inventors: Sridharan Ranganathan, Mahesh Wagh, David J. Harriman