Patents by Inventor Mahesh Wagh

Mahesh Wagh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10606785
    Abstract: Systems, methods, and devices can involve a host device that includes a root complex, a link, and an interconnect protocol stack coupled to a bus link. The interconnect protocol stack can include multiplexing logic to select one of a Peripheral Component Interconnect Express (PCIe) upper layer mode, or an accelerator link protocol upper layer mode, the PCIe upper layer mode or the accelerator link protocol upper layer mode to communicate over the link, and physical layer logic to determine one or more low latency features associated with one or both of the PCIe upper layer mode or the accelerator link protocol upper layer mode.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: March 31, 2020
    Assignee: Intel Corporation
    Inventors: Debendra Das Sharma, Michelle C. Jen, Prahladachar Jayaprakash Bharadwaj, Bruce A. Tennant, Mahesh Wagh
  • Patent number: 10560081
    Abstract: In an example, a system and method for centering in a high-performance interconnect (HPI) are disclosed. When an interconnect is powered up from a dormant state, it may be necessary to “center” the clock signal to ensure that data are read at the correct time. A multi-phase method may be used, in which a first phase comprises a reference voltage sweep to identify an optimal reference voltage. A second phase comprises a phase sweep to identify an optimal phase. A third sweep comprises a two-dimensional “eye” phase, in which a plurality of values within a two-dimensional eye derived from the first two sweeps are tested. In each case, the optimal value is the value that results in the fewest bit error across multiple lanes. In one example, the second and third phases are performed in software, and may include testing a “victim” lane, with adjacent “aggressor” lanes having a complementary bit pattern.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: February 11, 2020
    Assignee: Intel Corporation
    Inventors: Mahesh Wagh, Zuoguo J. Wu, Venkatraman Iyer, Gerald S. Pasdast, Todd A. Hinck, David M. Lee, Narasimha R. Lanka
  • Patent number: 10552253
    Abstract: First data is received on a plurality of data lanes of a physical link and a stream signal corresponding to the first data is received on a stream lane identifying a type of the first data. A first instance of an error detection code of a particular type is identified in the first data. Second data is received on at least a portion of the plurality of data lanes and a stream signal corresponding to the second data is received on the stream lane identifying a type of the second data. A second instance of the error detection code of the particular type is identified in the second data. The stream lane is another one of the lanes of the physical link and, in some instance, the type of the second data is different from the type of the first data.
    Type: Grant
    Filed: September 26, 2015
    Date of Patent: February 4, 2020
    Assignee: Intel Corporation
    Inventors: Venkatraman Iyer, Robert G. Blankenship, Mahesh Wagh, Zuoguo Wu
  • Patent number: 10552357
    Abstract: Physical layer logic is provided that is to receive data on one or more data lanes of a physical link, receive a valid signal on another of the lanes of the physical link identifying that valid data is to follow assertion of the valid signal on the one or more data lanes, and receive a stream signal on another of the lanes of the physical link identifying a type of the data on the one or more data lanes.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: February 4, 2020
    Assignee: Intel Corporation
    Inventors: Zuoguo J. Wu, Mahesh Wagh, Debendra Das Sharma, Gerald S. Pasdast, Ananthan Ayyasamy, Xiaobei Li, Robert G. Blankenship, Robert J. Safranek
  • Publication number: 20190347218
    Abstract: In one embodiment, an apparatus includes an arbitration circuit with virtual link state machines to virtualize link states associated with multiple communication protocol stacks. The apparatus further includes a physical circuit coupled to the arbitration circuit and to interface with a physical link, where the physical circuit, in response to a retraining of the physical link, is to cause a plurality of the virtual link state machines to synchronize with corresponding virtual link state machines associated with a second side of the physical link, and where at least one of the communication protocol stacks is to remain in a low power state during the retraining and the synchronization. Other embodiments are described and claimed.
    Type: Application
    Filed: May 30, 2019
    Publication date: November 14, 2019
    Inventors: Joon Teik Hor, Ting Lok Song, Mahesh Wagh, Su Wei Lim
  • Patent number: 10461805
    Abstract: One or more link training signals are received, including instances of a link training pattern, on a plurality of lanes of a physical link that includes at least one valid lane and a plurality of data lanes. The plurality of lanes are trained together using the link training signals to synchronize sampling of the valid lane with sampling of the plurality of data lanes. An active link state is entered and a valid signal received on the valid lane during the active link state. The valid signal includes a signal held at a value for a defined first duration and indicates that data is to be received on the plurality of data lanes in a second defined duration subsequent to the first duration. The data is to be received, during the active link state, on the plurality of data lanes during the second defined duration.
    Type: Grant
    Filed: September 26, 2015
    Date of Patent: October 29, 2019
    Assignee: Intel Corporation
    Inventors: Venkatraman Iyer, Lip Khoon Teh, Mahesh Wagh, Zuoguo Wu, Azydee Hamid, Gerald S. Pasdast
  • Publication number: 20190238179
    Abstract: One or more link training signals are received, including instances of a link training pattern, on a plurality of lanes of a physical link that includes at least one valid lane and a plurality of data lanes. The plurality of lanes are trained together using the link training signals to synchronize sampling of the valid lane with sampling of the plurality of data lanes. An active link state is entered and a valid signal received on the valid lane during the active link state. The valid signal includes a signal held at a value for a defined first duration and indicates that data is to be received on the plurality of data lanes in a second defined duration subsequent to the first duration. The data is to be received, during the active link state, on the plurality of data lanes during the second defined duration.
    Type: Application
    Filed: September 26, 2015
    Publication date: August 1, 2019
    Inventors: Venkatraman Iyer, Lip Khoon Teh, Mahesh Wagh, Zuoguo Wu, Azydee Hamid, Gerald S. Pasdast
  • Publication number: 20190227972
    Abstract: Systems, methods, and devices can include a first die comprising a first arbitration and multiplexing logic, a first protocol stack associated with a first interconnect protocol, and a second protocol stack associated with a second interconnect protocol. A second die comprising a second arbitration and multiplexing logic. A multilane link connects the first die to the second die. The second arbitration and multiplexing logic can send a request to the first arbitration and multiplexing logic to change a first virtual link state associated with the first protocol stack. The first arbitration and multiplexing logic can receive, from across the multilane link, the request from the first die indicating a request to change the first virtual link state; determine that the first interconnect protocol is ready to change a physical link state; and change the first virtual link state according to the received request while maintaining a second virtual link state.
    Type: Application
    Filed: April 2, 2019
    Publication date: July 25, 2019
    Applicant: Intel Corporation
    Inventors: Joon Teik Hor, Ting Lok Song, Mahesh Wagh, Su Wei Lim
  • Publication number: 20190065426
    Abstract: Systems, methods, and devices can involve a host device that includes a root complex, a link, and an interconnect protocol stack coupled to a bus link. The interconnect protocol stack can include multiplexing logic to select one of a Peripheral Component Interconnect Express (PCIe) upper layer mode, or an accelerator link protocol upper layer mode, the PCIe upper layer mode or the accelerator link protocol upper layer mode to communicate over the link, and physical layer logic to determine one or more low latency features associated with one or both of the PCIe upper layer mode or the accelerator link protocol upper layer mode.
    Type: Application
    Filed: October 25, 2018
    Publication date: February 28, 2019
    Applicant: Intel Corporation
    Inventors: Debendra Das Sharma, Michelle C. Jen, Prahladachar Jayaprakash Bharadwaj, Bruce A. Tennant, Mahesh Wagh
  • Publication number: 20190050362
    Abstract: Herein is disclosed an integrated input/output (“I/O”) processing system, comprising an I/O port, configured to receive I/O data and to deliver the I/O data to one or more processors; one or more processors, further comprising a first processing logic and a second processing logic, wherein the one or more processors are configured to deliver the received I/O data to the first processing logic and to the second processing logic, and wherein the first processing logic and the second processing logic are configured to redundantly process the I/O data; and a comparator, configured to compare an output of the first processing logic and an output of the second processing logic.
    Type: Application
    Filed: June 21, 2018
    Publication date: February 14, 2019
    Inventors: Swadesh CHOUDHARY, Bahaa FAHIM, Mahesh WAGH
  • Patent number: 10191877
    Abstract: An interconnect switch is provided including switching logic executable to facilitate a Peripheral Component Interconnect Express (PCIe)-based interconnect, and further including a control host embedded in the switch to provide one or more enhanced routing capabilities. The control host includes a processor device, memory, and software executable by the processor device to process traffic received at one or more ports of the switch to redirect at least a portion of the traffic to provide the one or more enhanced routing capabilities.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: January 29, 2019
    Assignee: Intel Corporation
    Inventors: David J. Harriman, Manjari Kulkarni, Akshay G. Pethe, Sean O. Stalley, Mahesh Wagh, Debendra Das Sharma
  • Patent number: 10180927
    Abstract: A device to process data packets for communication across PHY layers which are of different respective communication protocols. In an embodiment, the device includes a first protocol stack and a second protocol stack which are each for a PCIe™ communication protocol. The first protocol stack and a second protocol stack may interface, respectively, with a first physical (PHY) layer and a second PHY layer of the device. The first protocol stack and the second protocol stack may exchange packets to facilitate communications via both the first PHY layer and the second PHY layer. In another embodiment, the first PHY layer is for communication according to the PCIe™ communication protocol and the second PHY layer is for communication according to another, comparatively low power communication protocol.
    Type: Grant
    Filed: May 18, 2016
    Date of Patent: January 15, 2019
    Assignee: Intel Corporation
    Inventors: Akshay G. Pethe, Mahesh Wagh, Manjari Kulkarni
  • Publication number: 20190007310
    Abstract: Embodiments may be generally direct to apparatuses, systems, method, and techniques to provide multi-interconnect protocol communication. In an embodiment, an apparatus for providing multi-interconnect protocol communication may include a component comprising at least one connector operative to connect the component to at least one off-package device via a standard interconnect protocol, and logic, at least a portion of the logic comprised in hardware, the logic to determine data to be communicated via a multi-interconnect protocol, provide the data to a multi-protocol multiplexer to determine a route for the data, route the data on-package responsive to the multi-protocol multiplexer indicating a multi-interconnect on-package mode, and route the data off-package via the at least one connector responsive to the multi-protocol multiplexer indicating a multi-interconnect off-package mode. Other embodiments are described.
    Type: Application
    Filed: June 30, 2017
    Publication date: January 3, 2019
    Applicant: INTEL CORPORATION
    Inventors: DEBENDRA DAS SHARMA, MICHELLE C. JEN, MARK S. MYERS, DON SOLTIS, RAMACHARAN SUNDARARAMAN, STEPHEN R. VAN DOREN, MAHESH WAGH
  • Patent number: 10152446
    Abstract: An interface adapter to identify a first ready signal from a first link layer-to-physical layer (LL-PHY) interface of a first communication protocol indicating readiness of a physical layer of the first protocol to accept link layer data. The interface adapter generates a second ready signal compatible with a second LL-PHY interface of a second communication protocol to cause link layer data to be sent from a link layer of the second communication protocol according to a predefined delay. A third ready signal is generated compatible with the first LL-PHY interface to indicate to the physical layer of the first communication protocol that the link layer data is to be sent. The interface adapter uses a shift register to cause the link layer data to be passed to the physical layer according to the predefined delay.
    Type: Grant
    Filed: October 1, 2016
    Date of Patent: December 11, 2018
    Assignee: Intel Corporation
    Inventors: Venkatraman Iyer, Mahesh Wagh, William R. Halleck, Rahul R. Shah
  • Patent number: 10146291
    Abstract: A serial point-to-point link interface to enable communication between a processor and a device, the high speed serial point-to-point link interface including a transmitter to transmit serial data, a receiver to deserialize serial data, and control logic to implement a protocol stack. The protocol stack supports a plurality of power management states, including an active state, a first off state, in which a supply voltage is maintained, and a second off state, in which the supply voltage is not to be provided to the device. The protocol stack provides a default recovery time to allow the device to begin a transition from the first off state to the active state prior to accessing the device. The protocol stack further provides for accessing the device prior to expiration of the default recovery time to complete the transition based on a device-advertised recovery time.
    Type: Grant
    Filed: December 24, 2015
    Date of Patent: December 4, 2018
    Assignee: Intel Corporation
    Inventors: Mahesh Wagh, Robert E. Gough
  • Patent number: 10139889
    Abstract: A system on a chip (SoC) is provided with a multicore processor, a level-2 (L2) cache controller, an L2 cache, an integrated memory controller, and a serial point-to-point link interface to enable communication between the multicore processor and a device. The interface implements a protocol stack and includes a transmitter to transmit serial data to the device and a receiver to deserialize an incoming serial stream. The protocol stack supports a plurality of power management states, including an active state, a first off state, in which a supply voltage is to be provided to the device, and a second off state, in which the supply voltage is not to be provided to the device. In response to an indication the device is ready to enter the active state, the protocol stack provides for accessing the device prior to expiration of a default recovery time to complete the transition.
    Type: Grant
    Filed: December 24, 2015
    Date of Patent: November 27, 2018
    Assignee: Intel Corporation
    Inventors: Mahesh Wagh, Robert E. Gough
  • Publication number: 20180300275
    Abstract: Physical layer logic is provided that is to receive data on one or more data lanes of a physical link, receive a valid signal on another of the lanes of the physical link identifying that valid data is to follow assertion of the valid signal on the one or more data lanes, and receive a stream signal on another of the lanes of the physical link identifying a type of the data on the one or more data lanes.
    Type: Application
    Filed: November 22, 2017
    Publication date: October 18, 2018
    Applicant: Intel Corporation
    Inventors: Zuoguo J. Wu, Mahesh Wagh, Debendra Das Sharma, Gerald S. Pasdast, Ananthan Ayyasamy, Xiaobei Li, Robert G. Blankenship, Robert J. Safranek
  • Publication number: 20180276164
    Abstract: An interconnect interface is provided to enable communication with an off-package device over a link including a plurality of lanes. Logic of the interconnect interface includes receiver logic to receive a valid signal from the off-package device on a dedicated valid lane of the link indicating that data is to arrive on a plurality of dedicated data lanes in the plurality of lanes, receive the data on the data lanes from the off-package device sampled based on arrival of the valid signal, and receive a stream signal from the off-package device on a dedicated stream lane in the plurality of lanes. The stream signal corresponds to the data and indicates a particular data type of the data. The particular data type can be one of a plurality of different data types capable of being received on the plurality of data lanes of the link.
    Type: Application
    Filed: September 25, 2015
    Publication date: September 27, 2018
    Inventors: Debendra Das Sharma, Zuoguo Wu, Mahesh Wagh, Mohiuddin M. Mazumder, Venkatraman Iyer, Jeff C. Morriss
  • Patent number: 10073808
    Abstract: Physical layer logic is provided that is to receive data on one or more data lanes of a physical link, receive a valid signal on another of the lanes of the physical link identifying that valid data is to follow assertion of the valid signal on the one or more data lanes, and receive a stream signal on another of the lanes of the physical link identifying a type of the data on the one or more data lanes.
    Type: Grant
    Filed: December 26, 2013
    Date of Patent: September 11, 2018
    Assignee: Intel Corporation
    Inventors: Zuoguo J. Wu, Mahesh Wagh, Debendra Das Sharma, Gerald S. Pasdast, Ananthan Ayyasamy, Xiaobei Li, Robert G. Blankenship, Robert J. Safranek
  • Publication number: 20180196710
    Abstract: First data is received on a plurality of data lanes of a physical link and a stream signal corresponding to the first data is received on a stream lane identifying a type of the first data. A first instance of an error detection code of a particular type is identified in the first data. Second data is received on at least a portion of the plurality of data lanes and a stream signal corresponding to the second data is received on the stream lane identifying a type of the second data. A second instance of the error detection code of the particular type is identified in the second data. The stream lane is another one of the lanes of the physical link and, in some instance, the type of the second data is different from the type of the first data.
    Type: Application
    Filed: September 26, 2015
    Publication date: July 12, 2018
    Applicant: INTEL CORPORATION
    Inventors: Venkatraman Iyer, Robert G. Blankenship, Mahesh Wagh, Zuoguo Wu