Abstract: A scintillator panel which is capable of obtaining a radiation image exhibiting enhanced luminance and sharpness and achieving improved storage stability is disclosed, comprising on a support a base layer and a phosphor layer provided sequentially in this order, wherein the phosphor layer comprises (columnar) phosphor crystals formed of a phosphor parent compound and an activator by a process of vapor phase deposition and the base layer comprises crystals formed of the phosphor parent compound and an activator, and a relative density of the base layer is lower than a relative density of the phosphor layer and a relative content of an activator of the base layer is lower than a relative content of an activator of the phosphor layer.

Abstract: Provided are a scintillator panel and a radiation detector which give a radiation image reduced in sensitivity unevenness and sharpness unevenness. Also provided are processes for producing the scintillator and the detector. The scintillator panel comprises a support and, deposited thereon, a phosphor layer comprising columnar crystals of a phosphor which have been formed by the vapor deposition method. The panel is characterized in that the columnar crystals of a phosphor comprise cesium iodide (CsI) as a base ingredient and thallium (Tl) as an activator ingredient and have, in a root part thereof, a layer containing no thallium, and that the coefficient of variation in thallium concentration in the plane of the phosphor layer is 40% or less.

Abstract: Disclosed are a radiation image conversion panel which has achieved a radiation image with enhanced sharpness and improved moisture resistance and shock resistance, and a production method thereof. The radiation image conversion panel comprises, on a support, a phosphor layer comprising phosphor columnar crystals, each composed mainly of cesium iodide (CsI) and formed by a process of gas phase deposition, wherein a coefficient of variation of crystal diameter of the phosphor columnar crystals is not more than 50% and a coefficient of variation of phosphor filling factor of the phosphor layer is not more than 20%.

Abstract: A semiconductor device includes a board, a semiconductor element mounted on one of main surfaces of the board, a plurality of passive elements provided in the vicinity of the semiconductor element, and a heat radiation plate mounted above the board and connected to a rear surface of the semiconductor element via a heat conductive material. A surface roughness of a surface of the heat radiation plate which surface comes in contact with the heat conductive material is non-uniform at a whole of the surface.

Abstract: There is provided a head hair dyeing method using a two-part hair dye composition which contains: a first part containing a first part stock solution and a propellant, the first part stock solution containing an alkali agent and a surfactant; a second part containing a second part stock solution and a propellant, the second part stock solution containing hydrogen peroxide and a surfactant; and two aerosol containers for respectively discharging the first part and the second part as foam, the method including respectively discharging the first part and the second part as foam from the containers, applying the foam mixture to the head hair, and then re-foaming the mixture on the head hair.

Abstract: A semiconductor device includes a board, a semiconductor element mounted on one of main surfaces of the board, a plurality of passive elements provided in the vicinity of the semiconductor element, and a heat radiation plate mounted above the board and connected to a rear surface of the semiconductor element via a heat conductive material. A surface roughness of a surface of the heat radiation plate which surface comes in contact with the heat conductive material is non-uniform at a whole of the surface.

Abstract: A method for manufacturing a substrate, including adhering an adhesive layer to an organic insulation substrate to form a first part; forming a via hole in the first part such that the via hole penetrates the first part; forming a conductive metal film so that the conductive metal film covers the via-hole on one side of the first part; using an electrolytic plating process, where the conductive metal Film is used as an electrode, to form a metal via member within the via hole and to form an inter-layer wire; and removing an entirety of the conductive metal film without removing the inter-layer formed by the electrolytic plating process; repeating steps (a)-(e) for a second part; and thereafter attaching the first part to the second part.

Abstract: A multilayer wiring substrate includes differential signal wires placed within a first insulating layer between a first power-supply plane and a first ground plane; and general signal wires placed within a second insulating layer between a second power-supply plane and a second ground plane. In the multilayer wiring substrate, the differential signal wires are placed in a different plane from a plane having each of the general signal wires so that the different plane includes a first area having the differential signal wires, and a second area having one of the second power-supply plane and the second ground plane. The general signal wires are placed in a vertical direction of the second area in a laminated state so that each of the general signal wires is placed between the second power-supply plane and the second ground plane.

Abstract: The present invention provides a treatment composition for dyed hair which effectively prevents color fading of the dyed hair, to thereby maintain the color of the dyed hair for prolonged periods. The composition contains the following components (A), (B), and (C): (A) an organic solvent selected from among aromatic alcohols, lower alkylene carbonates, N-alkylpyrrolidones, and formamides; (B) an organic carboxylic acid or a salt thereof; and (C) a lower alcohol, a polyhydric alcohol, or a lower alkyl ether of a polyhydric alcohol; wherein the pH of the composition falls within the range of 1-6 inclusive, and the composition does not contain any dye. In use, the composition is applied to hair dyed with an acid-dye-type hair dye composition; and then the hair is left to stand for 5-30 minutes at 20-60° C., followed by washing.

Abstract: A semiconductor device includes a multi-flexible substrate and semiconductor chips mounted thereon. The multi-flexible substrate is configured such that organic insulation substrate layers and filmy adhesive layers are alternatively stacked together and wiring layers formed therein are interconnected by means of vias. Each of the vias consisting of a via-hole which is formed penetrating both the organic insulation substrate layers and the filmy adhesive layers and a metal via member 26 which is provided in the via-hole and made of an identical material. A method of manufacturing the multi-flexible substrate for the semiconductor device is also disclosed.

Abstract: A clutch control apparatus of a continuously variable transmission comprises a changeover device for changing over an oil passage connected to an apply chamber and a release chamber from an engaged position to a released position and vice versa, a slip pressure regulating device for regulating a slip pressure to be supplied to the release chamber, a lockup control judging device for judging whether or not a lockup clutch is to be engaged or to be released according to traveling conditions of the vehicle and a control device for reducing the slip pressure after a specified time elapses since the oil passage is changed over to the engaged position, when the lockup control judging device judges that the lockup clutch is to be changed over from the released position to the engaged position.

Abstract: A semiconductor device includes a semiconductor element on which a plurality of bumps are formed and a substrate having a first surface on which a plurality of protruding electrodes are protrudingly formed in correspondence to an arrangement of the bumps, and a second surface on which balls serving as mounting terminals are formed. The semiconductor element is bonded in a face-down manner to the substrate with the protruding electrodes being embedded into the bumps. Alloy layers having materials identical to those of the bumps and the protruding electrodes are formed on interfaces of the bumps and the protruding electrodes.

Abstract: A multilayer wiring substrate comprises differential signal wires placed within a first insulating layer between a first power-supply plane and a first ground plane; and general signal wires placed within a second insulating layer between a second power-supply plane and a second ground plane. In the multilayer wiring substrate, the differential signal wires are placed in a different plane from a plane having each of the general signal wires so that the different plane includes a first area having the differential signal wires, and a second area having one of the second power-supply plane and the second ground plane. The general signal wires are placed in a vertical direction of the second area in a laminated state so that each of the general signal wires is placed between the second power-supply plane and the second ground plane.

Abstract: A semiconductor device includes a multi-flexible substrate and semiconductor chips mounted thereon. The multi-flexible substrate is configured such that organic insulation substrate layers and filmy adhesive layers are alternatively stacked together and wiring layers formed therein are interconnected by means of vias. Each of the vias consisting of a via-hole which is formed penetrating both the organic insulation substrate layers and the filmy adhesive layers and a metal via member 26 which is provided in the via-hole and made of an identical material. A method of manufacturing the multi-flexible substrate for the semiconductor device is also disclosed.

Abstract: A semiconductor device includes a board and a semiconductor chip which is connected to an upper surface of the board via face-down bonding. The semiconductor device further includes a frame-shape member which is connected to the upper surface of the board with first adhesive, and has an opening to accommodate the semiconductor chip therein, and a plate-shape member which is situated to cover the semiconductor chip and the frame-shape member, and is connected to the semiconductor chip and the frame-shape member with second adhesive, wherein the frame-shape member has such a sufficient sturdiness as to prevent thermal-expansion-induced deformations of the board and the plate-shape member.

Abstract: A semiconductor device includes a board and a semiconductor chip which is connected to an upper surface of the board via face-down bonding. The semiconductor device further includes a frame-shape member which is connected to the upper surface of the board with first adhesive, and has an opening to accommodate the semiconductor chip therein, and a plate-shape member which is situated to cover the semiconductor chip and the frame-shape member, and is connected to the semiconductor chip and the frame-shape member with second adhesive, wherein the frame-shape member has such a sufficient sturdiness as to prevent thermal-expansion-induced deformations of the board and the plate-shape member.

Abstract: The present invention provides a treatment composition for dyed hair which effectively prevents color fading of the dyed hair, to thereby maintain the color of the dyed hair for prolonged periods.

Abstract: A semiconductor device includes a board base having through-holes filled with a filling core, an additive layer provided on an upper surface of the board base as well as an upper surface of the filling core wherein the additive layer includes a wiring pattern having one or more paths, a semiconductor chip fixed on an upper surface of the additive layer, and nodes provided on a lower surface of the board base, wherein the one or more paths are laid out without a restriction posed by the through-holes, and are used for electrically connecting the semiconductor chip and the nodes.

Abstract: A control apparatus for an automatic transmission of a vehicle having a forward friction element for engaging or disengaging a turbine shaft with the automatic transmission in a forward running direction and a lock-up clutch for directly transmitting a rotation of an engine to the turbine shaft, comprises an abrupt deceleration control means for disengaging the forward engagement element and the lock-up clutch when an abrupt deceleration of the vehicle is detected, and a restoring means for canceling the abrupt deceleration control means and for restoring the forward friction element to an engagement state when an accelerator pedal is depressed for acceleration.

Abstract: A semiconductor device includes a board base having through-holes filled with a filling core, an additive layer provided on an upper surface of the board base as well as an upper surface of the filling core wherein the additive layer includes a wiring pattern having one or more paths, a semiconductor chip fixed on an upper surface of the additive layer, and nodes provided on a lower surface of the board base, wherein the one or more paths are laid out without a restriction posed by the through-holes, and are used for electrically connecting the semiconductor chip and the nodes.