Abstract: A semiconductor device includes a board base having through-holes filled with a filling core, an additive layer provided on an upper surface of the board base as well as an upper surface of the filling core wherein the additive layer includes a wiring pattern having one or more paths, a semiconductor chip fixed on an upper surface of the additive layer, and nodes provided on a lower surface of the board base, wherein the one or more paths are laid out without a restriction posed by the through-holes, and are used for electrically connecting the semiconductor chip and the nodes.

Abstract: A GMR magnetic sensor includes a lower electrode, a first non-magnetic metal layer formed on the lower electrode and including ferromagnetic regions, a second non-magnetic metal layer on the first non-magnetic metal layer, a third non-magnetic metal layer on the second non-magnetic metal layer and including ferromagnetic regions, and an upper electrode formed on the third non-magnetic metal layer, wherein a tunneling insulation film is disposed further between the first non-magnetic metal layer and the third non-magnetic metal layer.

Abstract: A biodegradable resin molded article molded from a kneaded material obtained by kneading, melting or mixing a biodegradable resin raw material and at least one of a biodegradable additive and an additive made of a substance existing in the nature, an injection molded article of a biodegradable resin containing a biodegradable resin and an anti-biotic substance, a molded article of a resin composition including a polymer material having an ester bond in the polymer main chain thereof and an alkali or acid component in an amount effective for neutralizing an acidic or alkaline component contained in the polymer material, and a resin molded article having a layer of a biodegradable resin, and a layer of a photolytic resin covering the resin layer and containing an antibiotic.

Abstract: A semiconductor device includes a board base having through-holes filled with a filling core, and an additive layer provided on an upper surface of the board base as well as an upper surface of the filling core wherein the additive layer includes a wiring pattern having one or more paths. The semiconductor device further includes a semiconductor chip fixed on an upper surface of the additive layer, and nodes provided on a lower surface of the board base, wherein the one or more paths are laid out without a passage restriction posed by the through-holes, and are used for electrically connecting the semiconductor chip and the nodes.

Abstract: A biodegradable resin molded article molded from a kneaded material obtained by kneading, melting or mixing a biodegradable resin raw material and at least one of a biodegradable additive and an additive made of a substance existing in the nature, an injection molded article of a biodegradable resin containing a biodegradable resin and an anti-biotic substance, a molded article of a resin composition including a polymer material having an ester bond in the polymer main chain thereof and an alkali or acid component in an amount effective for neutralizing an acidic or alkaline component contained in the polymer material, and a resin molded article having a layer of a biodegradable resin, and a layer of a photolytic resin covering the resin layer and containing an antibiotic.

Abstract: A process for producing polyolefins having a high stereoregularity, no smell and a good particulate form, without needing removal of catalyst residue contained in the resulting polyolefins, which process comprises polymerizing olefins by the use of a catalyst obtained by combining a solid product (II) as a solid catalyst component prepared through the following reaction steps I, II and III, with an organoaluminum compound component and an organic silicon compound component having Si-O-C bond: Step I of mixing and dissolving .circle.a an anhydrous Mg dihalide, .circle.b a specified orthotitanic acid ester or/and a specified polytitanic acid ester and .circle.c a saturated or unsaturated, mono- or polyhydroxy alcohol of 1.about.20 C in an inert hydrocarbon solvent to obtain a component (A), Step II of mixing (A) with a component (B) consisting of .circle.d an aliphatic or aromatic monocarboxylic acid ester, .circle.e a specified halogenated aluminum and .circle.

Abstract: The invention is directed to a power plug which has a high physical strength against traction forces tending to pull the blades out of the plug body. The power plug of the invention realizes the above characteristics by comprising a pair of blades, each of the blades having one end connected to a cord, and a blade retaining member. The blade retaining member is made of an electrically insulating material, and has retaining portions which retain the blades so that they are not displaced relative to the blade retaining member. A resin molded plug body embeds the blade retaining member, proximal end portions of the pair of blades at which the blades are connected to the cord, and an end portion of the cord to which the blades are connected.

Abstract: A solid catalyst component for olefin polymerization having a high polymerization activity and affording a highly stereoregular polymer having a good particulate form, and a process for producing the same are provided, which component indispensably contains Mg, Ti, Al, halogen and alkoxy group; has two absorption peaks (absorbances A.sub.1 and A.sub.2) at specified wavenumbers within a specified region of spectra according to infrared spectrophotometry, A.sub.1 /A.sub.2 and A.sub.1 /A.sub.3 (A.sub.

Abstract: A carrier for olefin polymerization catalysts (or catalyst components) which is in spherical form and has a narrow particle size distribution is produced by reacting an anhydrous magnesium dihalide with an alcohol or a phenol in an inert organic solvent to obtain a complex compound; suspending this complex compound with vigorous stirring in the presence of a nonionic surfactant in an inert organic solvent at the melting point of the complex compound or higher; and adding an organoaluminum compound or a silicon halide to the suspension to react them to thereby form spherical solids.