Abstract: The present invention is a photosensitive element including a support and a photosensitive resin composition layer composed of a photosensitive resin composition containing (A) a binder polymer, (B) a photopolymerizable compound, and (C) a photopolymerization initiator, wherein, the photosensitive resin composition contains a thioxanthone-based compound represented by the following general formula (I) as the component (C), and when the parts by weight of the thioxanthone-based compound relative to 100 parts by weight for the total weight of the component (A) and the component (B) is taken to be P, and the film thickness of the photosensitive resin composition layer is taken to be Q (?m), then R, which is the product of P and Q, satisfies the condition of the following formula (1). In the following general formula (I), R1 to R8 represent a hydrogen atom, halogen atom or hydrocarbon group. 25.5?R?79.

Abstract: Provided is a new photo-curable resin composition which can be used in a photo nanoimprinting technology available for a photo nanoimprinting technology by which a substrate is processed with high accuracy. The photo-curable resin composition contains a photo-curable resin material essentially containing a (meth)acrylate, a reactive diluent, and a photo initiator. Preferably, the (meth)acrylate has a structure containing a benzene ring structure in its skeleton.

Abstract: There are disclosed a photosensitive resin composition which comprises (A) a polyamic acid having recurring units represented by the formula (I): ?wherein R1 represents and R2 represents a divalent organic group, and (B) an acryl compound having an amino group, and also a photosensitive resin composition for an i-line stepper which further comprises a photoinitiator in addition to the photosensitive resin composition.

Abstract: Interlayer insulating films 5,7 (insulating films) provided in a memory capacitor cell 8 are formed between a gate electrode 3 and a counter electrode 8C formed on a silicon wafer 1. The interlayer insulating films 5,7 comprise a borazine-based resin, having a specific dielectric constant of no greater than 2.6, a Young's modulus of 5 GPa or greater and a leak current of no greater than 1×10?8 A/cm2.

Abstract: A photosensitive resin composition comprising an aromatic polyimide precursor, wherein a 35 &mgr;m film made by imidating ring closure on a silicon substrate has a light transmittance at a wavelength of 365 nm of at least 1% and a residual stress of at most 25 MPa. The composition can be patterned through i-line exposure followed by development with alkaline solutions, and can be imidized into low-stress polyimide patterns. Electronic components having the polyimide patterns have high reliability.

Abstract: There are disclosed a photosensitive resin composition which comprises

Abstract: A 6,6′-dialkyl-3,3′,4,4′-biphenyltetracarboxylic dianhydride is prepared by brominating a 4-alkylphthalic anhydride at its 5-position, and coupling the bromination product in the presence of a nickel catalyst; A photosensitive resin composition containing a polyimide precursor having repetitive units of general formula (7) is applied onto a substrate, exposed to i-line, developed and heated to form a polyimide relief pattern. wherein Y is a divalent organic group, R7 and R8 are OH or a monovalent organic group, R9 and R10 are a monovalent hydrocarbon group, R11, R12 and R13 are a monovalent hydrocarbon group, a and b are an integer of 0 to 2, c is an integer of 0 to 4, and m is an integer of 0 to 3.

Abstract: A hexaaryl biimidazole compound useful as a photoinitiator, represented by Formula (I): wherein each R group represents an alkyl group which may be the same or different, and each X group is independently a fluorine or hydrogen. The compound (I) is particularly useful as an initiator in a photosensitive composition containing a polyimide precursor, which is curable under patternwise low radiation exposure to give a patterned layer having heat and chemical resistance.

Abstract: Disclosed are a positive type photosensitive resin composition which comprises (A) a polyimide precursor or a polyoxazole precursor having a group represented by —OR, wherein R represents a monovalent group constituting a acetal or ketal, an alkoxyalkyl group or an alkylsilyl group, which can be converted into a hydrogen atom by decomposition with an action of an acid, in the molecule which is bonded to an aromatic ring, and (B) a compound which generates an acid by irradiating radiation, a process for producing the same and electronic parts using the same.

Abstract: A photosensitive resin composition comprising an aromatic polyimide precursor, wherein a 35 &mgr;m film made by imidating ring closure on a silicon substrate has a light transmittance at a wavelength of 365 nm of at least 1% and a residual stress of at most 25 MPa. The composition can be patterned through i-line exposure followed by development with alkaline solutions, and can be imidized into low-stress polyimide patterns. Electronic components having the polyimide patterns have high reliability.

Abstract: A polyimide precursor having repeating units of the formula: 1

Abstract: A 6,6′-dialkyl-3,3′,4,4′-biphenyltetracarboxylic dianhydride is prepared by brominating a 4-alkylphthalic anhydride at its 5-position, and coupling the bromination product in the presence of a nickel catalyst; A photosensitive resin composition containing a polyimide precursor having repetitive units of general formula (7) is applied onto a substrate, exposed to 1-line, developed and heated to form a polyimide relief pattern.

Abstract: A photosensitive resin composition comprising an aromatic polyimide precursor, wherein a 10 &mgr;m thick layer of precursor has light transmittance at a wavelength of 365 nm of at least 1% and a 10 &mgr;m thick polyimide film made from the resin composition by imidation ring closure and deposited on a silicon substrate results in a residual stress of at most 25 MPa. The composition can be patterned through i-line exposure followed by development with alkaline solutions, and can be imidized into low-stress polyimide patterns. Electronic components having the polyimide patterns have high reliability.

Abstract: There are disclosed a photosensitive resin composition which comprises

Abstract: A 6,6′-dialkyl-3,3′4,4′-biphenyltetracarboxylic dianhydride is prepared by brominating a 4-alkylphthalic anhydride at its 5-position, and coupling the bromination product in the presence of a nickel catalyst; A photosensitive resin composition containing a polyimide precursor having repetitive units of general formula (7) is applied onto a substrate, exposed to i-line, developed and heated to form a polyimide relief pattern wherein Y is a divalent organic group, R7 and R8 are OH or a monovalent organic group, R9 and R10 are a monovalent hydrocarbon group, R11, R12 and R13 are a monovalent hydrocarbon group, a and b are an integer of 0 to 2, c is an integer of 0 to 4, and m is an integer of 0 to 3.

Abstract: A polyimide precursor having repeating units of the formula: wherein R1 is a tetravalent organic group having 4 or more carbon atoms; R2 is a trivalent or tetravalent organic group having one or more aromatic rings; R3 is a monovalent organic group; A is a monovalent group showing acidity; and n is an integer of 1 or 2, is effective for preparing a highly sensitive negative-working photosensitive material developable with an alkaline aqueous solution in a short time with high resolution.

Abstract: A polyimide precursor having repeating units of the formula: wherein R1 is a tetravalent organic group; and R2 is a divalent diphenyl group, is excellent in image formation and particularly suitable for forming a pattern using an i-line stepper, and gives a photosensitive resin composition by imparting photosensitivity to the polyimide precursor, said photosensitive resin composition being suitable for forming surface protective films for semiconductor devices or interlaminar insulating films for multilayer wiring boards.

Abstract: There is disclosed a positive type photosensitive resin composition which comprises an alkali-soluble polymer (A) having a carboxyl group and/or a phenolic hydroxyl group, and a compound (B) which forms an amine compound with irradiation of light.

Abstract: There are disclosed a photosensitive resin composition which comprises (A) a polyamic acid having recurring units represented by the formula (I): wherein R1 represents and R2 represents a divalent organic group, and (B) an acryl compound having an amino group, and also a photosensitive resin composition for an i-line stepper which further comprises a photoinitiator in addition to the photosensitive resin composition.

Abstract: A polyimide precursor having repeating units of the formula: ##STR1## wherein R.sup.1 is a tetravalent organic group; and R.sup.2 is a divalent diphenyl group, is excellent in image formation and particularly suitable for forming a pattern using an i-line stepper, and gives a photosensitive resin composition by imparting photosensitivity to the polyimide precursor, said photosensitive resin composition being suitable for forming surface protective films for semiconductor devices or interlaminar insulating films for multilayer wiring boards.