Abstract: A network device management system includes a computer that is connected to a network and at least one network device that is connected to the network and is capable of communicating with the computer via the network. Each network device includes a network device controller that provides the computer with network device information about settings and conditions of each network device of the at least one network device, via the network. The network device information includes connection type information that indicates whether each network device is a wired connection type or a wireless connection type. The computer includes a computer controller that obtains the network device information from each network device via the network and outputs a part or all of contents of the network device information including at least the connection type information, based on the obtained network device information.

Abstract: It is harder to realize structural defects when the thickness of an internal electrode is reduced in a laminated ceramic electronic component, such as a laminated ceramic capacitor, when the internal electrodes contain a base metal as their conductive constituent, and the dielectric ceramic layers are formed from a dielectric barium titanate ceramic, and as an accessory constituent, at least one alkali metal element selected from Li, K, and Na, each of the internal electrodes has a thickness of 0.5 ?m or less, and the content of the alkali metal element in the dielectric ceramic is 0.2 parts by mol or more with respect to 100 parts by mol of the main constituent.

Abstract: An information output system is provided with an information output unit that outputs information represented by service data, and a data transmitting server configured to transmit the service data to the information output unit. The data transmitting server is provided with a charging unit configured to perform a charging operation with respect the service data transmitted to the information output unit, the charging operation being performed at least one predetermined stage after a start and before a completion of the output of the information.

Abstract: A parameter setting system includes a setting device and setting target devices. The setting device includes a protocol inquiry mechanism that inquires the setting target device about a communication protocol acceptable to the setting target device; and a setting command mechanism that commands the setting target device to set the function parameter necessary to perform a communication function according to a communication protocol notified in response to an inquiry by the protocol inquiry mechanism. The setting target device includes a protocol response mechanism that notifies the protocol inquiry mechanism of information with respect to a protocol acceptable to the setting target device in response to the inquiry received from the protocol inquiry mechanism; and a commanded setting execution mechanism that sets the function parameter commanded to be set by the setting command mechanism.

Abstract: A dielectric ceramic contains a barium titanate and Li. In the dielectric ceramic, the following inequalities are satisfied: 0.5?e?6.0, 0.06<Rg<0.17, and ?g<0.075, where e is the content, in molar parts, of Li with respect to 100 molar parts of the titanate; Rg is the average size, in ?m, of grains in the dielectric ceramic; and ?g is the standard deviation, in ?m, of the size of the grains.

Abstract: In a chip-type LED according to an embodiment of the present invention, a first recess hole for mounting an LED chip and a second recess hole for connecting a fine metal wire are formed in an insulating substrate, a metal sheet serving as a first wiring pattern is formed at a portion that includes the first recess hole, a metal sheet serving as a second wiring pattern is formed at a portion that includes the second recess hole, an LED chip is mounted on the metal sheet within the first recess hole, the LED chip is electrically connected to the metal sheet within the second recess hole via a fine metal wire, the LED chip including the first recess hole and the fine metal wire including the second recess hole are encapsulated in a first transparent resin that contains a fluorescent material, a surface of the insulating substrate including the first transparent resin is encapsulated in a second transparent resin.

Abstract: A method for manufacturing a laminated ceramic capacitor by firing a laminated body which includes dielectric ceramic layers containing a dielectric ceramic raw material powder and internal electrodes. The firing is carried out in accordance with a temperature profile in which the average rate of temperature rise is 40° C./second or more from room temperature to a maximum temperature. The dielectric ceramic raw material powder contains a BaTiO3 system as its main constituent, and contains R (R is Sc, etc.), M (M is Mn, etc.), and Mg as accessory constituents, in which, when the total amount of the accessory constituents contained is denoted by D parts by mol with respect to 100 parts by mol of the main constituent, an the specific surface area of the main constituent is denoted by E m2/g, then D/E is 0.2 to 0.8.

Abstract: An embodiment of the present invention has an insulating substrate in which a first concave hole for mounting an LED chip and a second concave hole for connecting a metallic small-gauge wire are formed, where a metallic sheet that serves as a first wiring pattern is formed at a portion that includes the first concave hole, a metallic sheet that serves as a second wiring pattern is formed at a portion that includes the second concave hole, an LED chip is mounted upon the metallic sheet inside the first concave hole, the LED chip is electrically connected to the metallic sheet inside the second concave hole via a metallic small-gauge wire, and the chip-type LED is sealed with a clear resin.

Abstract: In a communication system having a client and a server capable of communicating with each other via a network, the server can transmit a command to the client in response to a command request transmitted from the client to the server. The server may include a replying unit that transmits replaying data in response to the command received from the client in such a manner that (a) if there is a command to be transmitted to the client, replying data including the command is transmitted to the client, and (b) if there is not a command to be transmitted to the client, replying data, which does not include a command is transmitted to the client. Further, the replying unit may transmit the replying data without a command to the client when a no-command status lasts a predetermined standby period after receipt of the command request.

Abstract: An image processing device is configured to provide a service relating to at least one of (1) the image data generated by the function of the image processing device and (2) image data representing the image to be formed, in response to a request from the image processing device. The image processing device may include a parameter designating unit, a service request unit, and a function implementation unit that is adapted to implement the function of the image processing device based on the service providing parameter designated by the parameter designating unit. The service providing device is provided with a service provision executing unit that is adapted to execute a process to provide the service to the image processing device after receiving the request from the service request unit provided to the image processing device.

Abstract: An image processing device is configured to provide a service relating to at least one of (1) the image data generated by the function of the image processing device and (2) image data representing the image to be formed, in response to a request from the image processing device. The image processing device may include a parameter designating unit, a service request unit, and a function implementation unit that is adapted to implement the function of the image processing device based on the service providing parameter designated by the parameter designating unit. The service providing device is provided with a service provision executing unit that is adapted to execute a process to provide the service to the image processing device after receiving the request from the service request unit provided to the image processing device.

Abstract: An embodiment of the present invention has an insulating substrate in which a first concave hole for mounting an LED chip and a second concave hole for connecting a metallic small-gauge wire are formed, where a metallic sheet that serves as a first wiring pattern is formed at a portion that includes the first concave hole, a metallic sheet that serves as a second wiring pattern is formed at a portion that includes the second concave hole, an LED chip is mounted upon the metallic sheet inside the first concave hole, the LED chip is electrically connected to the metallic sheet inside the second concave hole via a metallic small-gauge wire, and the chip-type LED is sealed with a clear resin.

Abstract: A dielectric ceramic material is composed of a perovskite compound represented by ABO3 as a main component. In the case where ABO3 is, for example, BaTiO3, the crystal grains include BaTiO3 crystal grains composed of the main component and, as secondary phases, Mg—Ni—Ti-containing crystalline grains composed of a crystalline oxide containing at least Mg, Ni, and Ti and Ba—Si-containing crystalline grains composed of a crystalline oxide containing at least Ba and Si.

Abstract: A laminated ceramic capacitor capable of achieving both a high dielectric constant and high electrical insulation property even when the thickness of the dielectric ceramic layer is less than 1 ?m, contains a plurality of laminated dielectric ceramic layers and a plurality of internal electrodes at interfaces between the dielectric ceramic layers, where dielectric ceramic layers are made of dielectric ceramic containing a perovskite-type compound represented by ABO3 as a main ingredient, and R (R is La or the like), M (M is Mn or the like) and Si as accessory ingredients.

Abstract: The light-emitting device includes: a substrate which has a single layer structure in which a conductive member is partially provided on a surface of the substrate; a plurality of light-emitting elements which are directly provided on the surface of the substrate so as to be electrically connected with the conductive member; a first light reflection resin layer; a second light reflection resin layer which is provided in a looped shape on the surface of the substrate so as to surround an area in which the plurality of light-emitting elements are provided; and a sealing resin which covers the plurality of light-emitting elements.

Abstract: A network system includes a directory server configured to provide service definition information through a network, and a terminal device configured to receive the service definition information. The directory server may include a server communication unit, a service definition information storing unit configured to store main information and auxiliary information as part of service definition information, and a service definition information transmission control unit that retrieves the service definition information from the service definition information storing unit and transmit the same to the terminal device. The terminal device may include a terminal communication unit, an outputting unit, an input receiving unit and an output control unit.

Abstract: In a chip-type LED according to an embodiment of the present invention, a first recess hole for mounting an LED chip and a second recess hole for connecting a fine metal wire are formed in an insulating substrate, a metal sheet serving as a first wiring pattern is formed at a portion that includes the first recess hole, a metal sheet serving as a second wiring pattern is formed at a portion that includes the second recess hole, an LED chip is mounted on the metal sheet within the first recess hole, the LED chip is electrically connected to the metal sheet within the second recess hole via a fine metal wire, the LED chip including the first recess hole and the fine metal wire including the second recess hole are encapsulated in a first transparent resin that contains a fluorescent material, a surface of the insulating substrate including the first transparent resin is encapsulated in a second transparent resin.

Abstract: A dielectric ceramic (and capacitor containing it) balancing high temperature load characteristics and temperature characteristics of capacitance even when layer thickness is less than 1 ?mhas a mixture of different crystal grains containing a barium titanate compound as the main constituent. The first crystal grains can contain rare earth element solid solution region lat the surface layer section. The second crystal grains have a core-shell structure including a shell section having a rare earth element solid solution present. The first and second crystal grains are 12% to 84% f and 16% to 88%, respectively, of the total number of crystal grains.

Abstract: A laminated ceramic capacitor which provides favorable properties and characteristics such as dielectric characteristics, insulation properties, temperature characteristics, and high temperature load characteristics and provides favorable thermal shock resistance, even when dielectric ceramic layers are reduced in layer thickness to increase the number of layers has dielectric ceramic layers containing, as their main constituent, a barium titanate based compound represented by the general formula ABO3 and internal electrodes containing Ni as their main constituent, which are stacked alternately. A crystalline oxide containing at least Mg and Li is present in at least either one of the internal electrodes and the dielectric ceramic layers. The crystalline oxide is preferably present mostly in contact with Ni in the internal electrodes.

Abstract: A laminated ceramic capacitor which provides favorable life characteristics, even when a high electric field strength is applied while dielectric ceramic layers are reduced in layer thickness to less than 1 ?m, contains a dielectric ceramic a compound represented by: (Ba1-x/100Cax/100)mTiO3 (0?x?20) as its main constituent, and as its accessory constituent, aMg-bSi-cMn-dR (R is at least one of La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, and Y, and a, b, c, and d (part by mol) respectively satisfy the conditions of 0.1<a?20.0, 0.5<b?20.0, 0.1<c?10.0, and 1.0<d?30.0 with respect to 100 parts by mol of the main constituent). The average grain size is 20 nm or more and less than 100 nm for crystal grains in a sintered body obtained by firing the dielectric ceramic.