Abstract: Provided is a control circuit for a thermostatic oven in an oven controlled crystal oscillator, which is capable of further improving stability of an oscillation frequency. A control circuit in which a thermistor whose resistance value changes according to a temperature outputs a signal according to the ambient temperature of the thermostatic oven inside the oscillator, an operational amplifier outputs a signal according to a difference between the output of the thermistor and a reference signal, a power transistor amplifies the output of the operational amplifier, and a heater generates heat based on a collector voltage of the power transistor, is provided with a temperature sensor circuit having a transistor with a base to which the output of the operational amplifier is input. The control circuit outputs a collector voltage of the transistor as an internal temperature signal which changes according to a temperature inside the oscillator.

Abstract: A constant temperature oscillator includes a crystal oscillator that is provided upright on a circuit board, an oscillation element arranged on the circuit board and configuring an oscillation circuit in conjunction with the crystal oscillator, and a temperature control element including a heating chip resistance and a thermistor, arranged on the circuit board, and configuring a temperature control circuit that keeps an operating temperature of the crystal oscillator constant, and which is provided with a heat transfer plate between the heating chip resistance and the bottom face of the oscillator container, wherein, the heat transfer plate has a notch into which the heating chip resistance is fitted, and a heat sink lies between the heat transfer plate and the heating chip resistance and closely contacts with them.

Abstract: One embodiment of the present invention is an image display device including a substantially transparent substrate, a color filter layer formed on the substantially transparent substrate and a substantially transparent semiconductor circuit formed on the color filter layer. The circuit includes a substantially transparent thin film transistor including a source electrode, a drain electrode, a gate insulating film, a gate electrode and a semiconductor active layer comprised of a metal oxide. The semiconductor active layer has a thickness of 10 nm-35 nm. The circuit also includes a wiring made of a substantially transparent conductive material, the wiring having a electric contact point with the substantially transparent thin film transistor.

Abstract: The present invention relates to a two-level mounting board in which a second substrate is supported horizontally by a metal pin above a first substrate having a mounting electrode on an outer base surface, the free, lower end of the metal pin is inserted in a hole provided in the surface of the first substrate, and the metal pin is affixed by solder to an annular electrode land provided on the surface of the first substrate to form an outer periphery of the hole, wherein part of the ring of the annular electrode land is cut away to open the same. This provides a two-level mounting board in which metal pins can be connected reliably to the first substrate to support the second substrate horizontally, and a crystal oscillator using the same.

Abstract: A structure with a transistor is disclosed comprising a substrate, a gas barrier layer on the substrate, and a transistor on the gas barrier layer. The transistor can include an oxide semiconductor layer. The oxide semiconductor layers can comprise In—Ga—Zn—O. A display, such as a liquid crystal display, can have such a structure.

Abstract: One embodiment of the present invention is a thin film transistor, including: an insulating substrate; a gate electrode, a gate insulating layer and a semiconductor layer including an oxide, these three elements being formed over the insulating substrate in this order, and the gate insulating layer including: a lower gate insulating layer, the lower gate insulating layer being in contact with the insulating substrate and being an oxide including any one of the elements In, Zn or Ga; and an upper gate insulating layer provided on the lower gate insulating layer, the upper gate insulating layer comprising at least one layer; and a source electrode and a drain electrode formed on the semiconductor layer.

Abstract: One embodiment of the present invention is a color EL display characterized in that at least color filters, a thin film transistor circuit, an organic EL layer, and a common electrode are laminated in this order on a transparent substrate. Another embodiment of the invention is a method for producing a color EL display comprising the steps of forming color filters or a transparent substrate; forming a thin film transistor circuit; forming an organic EL layer; and forming a common electrode, wherein process temperatures of the steps of forming the thin film transistor circuit and subsequent steps are 200° C. or less.

Abstract: A lead wire led-out type crystal oscillator of constant temperature type for high stability is disclosed, which includes a heat supply body that supplies heat to a crystal resonator from which a plurality of lead wires are led out, to maintain the temperature constant. The heat supply body includes a heat conducting plate which has through-holes for the lead wires and is mounted on the circuit board, and which faces, and is directly thermally joined to, the crystal resonator and a chip resistor for heating which is mounted on the circuit board adjacent to the heat conducting plate, and is thermally joined to the heat conducting plate.

Abstract: A lead wire led-out type crystal oscillator of constant temperature type for high stability is disclosed, which includes a heat supply body that supplies heat to a crystal resonator from which a plurality of lead wires are led out, to maintain the temperature constant. The heat supply body includes a heat conducting plate which has through-holes for the lead wires and is mounted on the circuit board, and which faces, and is directly thermally joined to, the crystal resonator and a chip resistor for heating which is mounted on the circuit board adjacent to the heat conducting plate, and is thermally joined to the heat conducting plate.

Abstract: A cardiac magnetic field diagnostic apparatus for evaluating intracardiac three-dimensional localization of a myocardial injury by means of cardiac magnetic field measurement and a three-dimensional localization evaluating method of myocardial injury are disclosed. A magnetic field distribution measuring instrument (1) creates magnetic field distribution data by contactless magnetic field measurement on coordinates on the breast of a subject. An arithmetic operation unit (2) computers intracardiac three-dimensional current density distribution data from the magnetic field distribution data, draws a magnetic field integral cubic diagram as a cardiac contour cubic diagram according to the three-dimensional current density distribution data, creates data to draw the three-dimensional distribution of the QRS difference, the T-wave vector, or the RT dispersion of the same subject according to the three-dimensional current density distribution data, and reconstructs it on the cardiac contour.

Abstract: A method of manufacturing a transmission type liquid crystal display is disclosed including preparing a color filter; forming a substantially transparent semiconductor circuit on a surface of the color filter while position adjustment between the color filter and the semiconductor circuit is performed; and forming a transmission type liquid crystal display element on one side of the substantially transparent semiconductor circuit, wherein there is no color filter on the one side.

Abstract: [Object] It is to provide a sputtering target which has an excellent adhesion to films made of Au, Cu or an alloy containing at least one of Au and Cu and also an excellent corrosion resistance and which can be used to form an Mo—Ti alloy film over a large-sized substrate. [SOLUTION] The present invention provides a sputtering target suitable for use in formation of an Mo—Ti alloy film on a substrate, characterized by that the sputtering target comprises Ti of higher than 50 atomic percentages but not exceeding 60 atomic percentages and the balance of Mo and inevitable impurities and that the relative density of the sputtering target is equal to or more than 98%. The present invention also provides a joined type sputtering target assembly formed by diffusion joining two of more of such sputtering targets, the length of the joined type sputtering target assembly being equal to or larger than 1,000 mm at least one side.

Abstract: A method for producing a Ta sputtering target including the following steps: (a) a step of forging a Ta ingot, comprising subjecting the Ta ingot to a forging pattern over at least 3 times, wherein each forging pattern is “a cold forging step comprising stamp-forging and upset-forging operations alternatively repeated over at least 3 times; (b) an in-process vacuum heat-treating step carried out between every successive two forging patterns to thus prepare a Ta billet; (c) a step of rolling the Ta billet to obtain a rolled plate; and (d) a step of vacuum heat-treating the rolled plate to obtain a Ta sputtering target. A sputtering target produced by the above method.

Abstract: A heater is disposed in contact with a hydrogen storage unit filled with a hydrogen absorption material. The heater includes at least one combustion chamber which includes a catalyst carrier and in which a combustible gas is burned, a combustible gas burning catalyst carried on the catalyst carrier, at least one combustible gas introduction chamber adjoining the combustion chamber with its chamber wall interposed therebetween, a plurality of combustible gas inlets disposed in a dispersed manner in the chamber wall to permit the combustion chamber and the introduction chamber to communicate with each other, and a combustion gas outlet communicating with the combustion chamber. Thus, the degree of uniformity of a temperature profile is decreased.

Abstract: A constant temperature oscillator which comprises: a crystal oscillator that is provided upright on a circuit board, and which comprises a plurality of lead wires extending out from a bottom face of an oscillator container in which a crystal piece is hermetically sealed; an oscillation element arranged on the circuit board and configuring an oscillation circuit in conjunction with the crystal oscillator; and a temperature control element including at least a heating chip resistance and a thermistor, arranged on the circuit board, and configuring a temperature control circuit that keeps an operating temperature of the crystal oscillator constant; and which is provided with a heat transfer plate between the heating chip resistance and the bottom face of the oscillator container, wherein, the heat transfer plate has a notch into which the heating chip resistance is fitted, and, a heat sink lies between the heat transfer plate and the heating chip resistance and closely contacts with them.

Abstract: To provide a highly stable crystal oscillator having increased thermal efficiency. The highly stable crystal oscillator comprises; a thermostat mainframe which maintains the temperature of a crystal resonator including a resonator container for sealing a crystal piece constant, an oscillating element which constitutes an oscillation circuit together with said crystal resonator, a temperature control element which controls the temperature inside of said thermostat mainframe, and a circuit board mounted with said thermostat mainframe, said oscillating element, and said temperature control element.

Abstract: The present invention is one where, in a lead wire led-out type crystal oscillator of constant temperature type for high stability, comprising: a heat supply body that supplies heat to a crystal resonator from which a plurality of lead wires are led out, to maintain the temperature constant; an oscillating element that constitutes an oscillating circuit together with the crystal resonator; a temperature control element that constitutes a temperature control circuit for controlling the temperature of the crystal resonator; and a circuit board for mounting the heat supply body, the oscillating element, and the temperature control element, and through which lead wires of the crystal resonator are passed through for mounting, the heat supply body comprises: a heat conducting plate which has through-holes for the lead wires and is mounted on the circuit board, and which faces, and is directly thermally joined to, the crystal resonator; and a chip resistor for heating which is mounted on the circuit board adjacent

Abstract: To provide a highly stable crystal oscillator having increased thermal efficiency. The highly stable crystal oscillator comprises; a thermostat mainframe which maintains the temperature of a crystal resonator including a resonator container for sealing a crystal piece constant, an oscillating element which constitutes an oscillation circuit together with said crystal resonator, a temperature control element which controls the temperature inside of said thermostat mainframe, and a circuit board mounted with said thermostat mainframe, said oscillating element, and said temperature control element.

Abstract: A heater is disposed in contact with a hydrogen storage unit filled with a hydrogen absorption material. The heater includes at least one combustion chamber which includes a catalyst carrier and in which a combustible gas is burned, a combustible gas burning catalyst carried on the catalyst carrier, at least one combustible gas introduction chamber adjoining the combustion chamber with its chamber wall interposed therebetween, a plurality of combustible gas inlets disposed in a dispersed manner in the chamber wall to permit the combustion chamber and the introduction chamber to communicate with each other, and a combustion gas outlet communicating with the combustion chamber. Thus, the degree of ununiformity of a temperature profile is decreased.

Abstract: A new card connector has a connector element which has, at its opposite ends, projection portions, and a frame element which has a projection guide having a laterally elongated portion in parallel to a card insertion-withdrawal direction at a coupling portion between the frame element and the connector element. When the frame element is coupled with or released from the connector element fixed to a mounting board, an upper side of the laterally elongated portion of the projection guide of the frame element is guided by the projection portion of the connector element so that any contact is prevented between a grounding metal plate of the frame element and pin contacts of the connector element.