Abstract: A method, apparatus, computer program, data structure, signal relating to: causing correlation of a digital signal provided by a receiver with a motion-compensated correlation code, wherein the motion-compensated correlation code is a correlation code that has been compensated before correlation using one or more phasors dependent upon an assumed or measured movement of the receiver.

Abstract: A method, apparatus, computer program, data structure, signal relating to: causing correlation of a digital signal provided by a receiver with a motion-compensated correlation code, wherein the motion-compensated correlation code is a correlation code that has been compensated before correlation using one or more phasors dependent upon an assumed or measured movement of the receiver.

Abstract: A method, apparatus, computer program, and data structure relating to: causing correlation of a digital signal provided by a receiver with a motion-compensated correlation code, wherein the motion-compensated correlation code is a correlation code that has been compensated before correlation using one or more phasors dependent upon an assumed or measured movement of the receiver.

Abstract: A method of preventing a mass flow controller from participating in crosstalk in an array of mass flow controllers is described. The method includes sensing and providing a signal indicative of a fluid pressure inside of a mass flow controller with a pressure sensor contained within the mass flow controller, determining a response of a control valve to a rapid pressure perturbation at the inlet of the mass flow controller using the signal indicative of the fluid pressure to avoid overcompensation for the rapid pressure perturbation, and adjusting a control valve contained within the mass flow controller downstream of the pressure sensor, based on the determined response, so that the mass flow controller avoids overcompensating for the rapid pressure perturbation. The pressure sensor is positioned such that the pressure sensor is sensitive to rapid pressure perturbations at the inlet of the mass flow controller.

Abstract: A method of preventing a mass flow controller from participating in crosstalk in an array of mass flow controllers is described. The method includes sensing and providing a signal indicative of a fluid pressure inside of a mass flow controller with a pressure sensor contained within the mass flow controller, determining a response of a control valve to a rapid pressure perturbation at the inlet of the mass flow controller using the signal indicative of the fluid pressure to avoid overcompensation for the rapid pressure perturbation, and adjusting a control valve contained within the mass flow controller downstream of the pressure sensor, based on the determined response, so that the mass flow controller avoids overcompensating for the rapid pressure perturbation. The pressure sensor is positioned such that the pressure sensor is sensitive to rapid pressure perturbations at the inlet of the mass flow controller.

Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention also includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and may be partially integrated or fully integrated into a processing chamber which also includes diffusion bonded layers.

Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention also includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.

Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The fluid delivery system includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.

Abstract: Described is a space-conserving integrated fluid delivery system particularly useful for gas distribution in semiconductor processing equipment. The system includes integrated fluid flow network architecture, and may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded. Subsequent to diffusion bonding, a stainless steel diffusion bonded part may advantageously be treated to enhance corrosion resistance using a series of steps designed to bring more chromium to the surface of the steel.

Abstract: The present invention relates to a method of diffusion bonding of steel and steel alloys, to fabricate a fluid delivery system of the kind which would be useful in semiconductor processing and in other applications which require high purity fluid handling.

Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The fluid delivery system includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.

Abstract: The present invention relates to diffusion bonding of patterned sheets to form a fluid flow handling structure, and to a method of preventing bonding between a load distribution block and a plate set of stacked sheets during the diffusion bonding process.

Abstract: The present invention relates to a method of diffusion bonding sheets of patterned material to fabricate a fluid delivery system; and particularly relates to a method of improving the interior surface roughness of fluid flow conduits formed within the diffusion bonded fluid delivery system structure.

Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention also includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.

Abstract: The present invention relates to stainless steel sheets which would be useful in semiconductor processing and in other applications which require high purity fluid handling. The invention also relates to a method of selecting and processing such sheets.

Abstract: The present invention relates to a method of diffusion bonding of steel and steel alloys, to fabricate a fluid delivery system of the kind which would be useful in semiconductor processing and in other applications which require high purity fluid handling.

Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention pertains to a diffusion bonded integrated fluid flow network architecture, which includes, in addition to a layered substrate containing fluid flow channels, an in-line filter and may include various fluid handling and monitoring components. The integrated fluid delivery system that is formed from a layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.

Abstract: A diffusion bonded space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The disclosure includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. A capacitive dual electrode pressure sensor which is integrated into a multilayered substrate is described. The pressure sensor may be used as a gage relative to atmospheric pressure if desired for a particular application.

Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The fluid delivery system includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.

Abstract: The disclosure pertains to a space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The present invention also pertains to an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.