Patents by Inventor Mark R. Boone
Mark R. Boone has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200352508Abstract: The present disclosure provides methods and techniques associated with a planar transformer for an apparatus. The planar transformers include a substrate carrying electronic components and a continuous core that is formed by distributing the encapsulant material uniformly around the substrate unit to define a consistent cross-sectional area for the magnetic path. The electronic components include primary windings and secondary windings associated with the transformer. In some embodiments, the encapsulant material is molded to seals air gaps to the substrate unit.Type: ApplicationFiled: July 30, 2020Publication date: November 12, 2020Inventors: Mark R. Boone, Mark S. Ricotta, Mohsen Askarinya, Lejun Wang
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Publication number: 20200135597Abstract: Various embodiments of a die carrier package and a method of forming such package are disclosed. The package includes one or more dies disposed within a cavity of a carrier substrate, where a first die contact of one or more of the dies is electrically connected to a first die pad disposed on a recessed surface of the cavity, and a second die contact of one or more of the dies is electrically connected to a second die pad also disposed on the recessed surface. The first and second die pads are electrically connected to first and second package contacts respectively. The first and second package contacts are disposed on a first major surface of the carrier substrate adjacent the cavity.Type: ApplicationFiled: October 30, 2018Publication date: April 30, 2020Inventors: Mark R. Boone, Mark E. Henschel
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Publication number: 20200105961Abstract: Various embodiments of an integrated circuit package and a method of forming such package are disclosed. The integrated circuit package includes first and second active dies. Each of the first and second active dies includes a top contact disposed on the top surface of the die and a bottom contact disposed on a bottom surface of the die. The package further includes a via die having first and second vias that each extends between a top contact disposed on a top surface of the via die and a bottom contact disposed on a bottom surface of the via die, where the bottom contact of the first active die is electrically connected to the bottom contact of the first via of the via die and the bottom contact of the second active die is electrically connected to the bottom contact of the second via of the via die.Type: ApplicationFiled: October 1, 2018Publication date: April 2, 2020Inventors: Mark R. Boone, Mark E. Henschel
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Publication number: 20200060589Abstract: Various embodiments of a sealed package and a method of forming such package are disclosed. The package includes a housing, a substrate hermetically sealed to the housing, and a light source disposed on a first major surface of the substrate. The package further includes a detector disposed on the first major surface of the substrate and having a detecting surface. The package also includes a masking layer disposed on at least one of the first major surface and a second major surface of the substrate, where the masking layer includes a first aperture aligned with an emission axis of the light source in a direction orthogonal to the first major surface of the substrate. The masking layer further includes a second aperture aligned with a detection axis of the detector in a direction orthogonal to the first major surface of the substrate.Type: ApplicationFiled: November 4, 2019Publication date: February 27, 2020Inventors: Mark R. BOONE, Jonathan L. KUHN
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Publication number: 20200058592Abstract: Various embodiments of an integrated circuit package and a method of forming such package are disclosed. The package includes a substrate having a core layer disposed between a first dielectric layer and a second dielectric layer, a die disposed in a cavity of the core layer, and an encapsulant disposed in the cavity between the die and a sidewall of the cavity. The package further includes a first patterned conductive layer disposed within the first dielectric layer, a device disposed on an outer surface of the first dielectric layer such that the first patterned conductive layer is between the device and the core layer, a second patterned conductive layer disposed within the second dielectric layer, and a conductive pad disposed on an outer surface of the second dielectric layer such that the second patterned conductive layer is between the conductive pad and the core layer.Type: ApplicationFiled: August 9, 2019Publication date: February 20, 2020Inventors: Chunho KIM, Mark R. BOONE, Randolph E. CRUTCHFIELD
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Patent number: 10463285Abstract: Various embodiments of a sealed package and a method of forming such package are disclosed. The package includes a housing, a substrate hermetically sealed to the housing, and a light source disposed on a first major surface of the substrate. The package further includes a detector disposed on the first major surface of the substrate and having a detecting surface. The package also includes a masking layer disposed on at least one of the first major surface and a second major surface of the substrate, where the masking layer includes a first aperture aligned with an emission axis of the light source in a direction orthogonal to the first major surface of the substrate. The masking layer further includes a second aperture aligned with a detection axis of the detector in a direction orthogonal to the first major surface of the substrate.Type: GrantFiled: April 3, 2017Date of Patent: November 5, 2019Assignee: Medtronic, Inc.Inventors: Mark R Boone, Jonathan L Kuhn
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Publication number: 20180279932Abstract: Various embodiments of a sealed package and a method of forming such package are disclosed. The package includes a housing, a substrate hermetically sealed to the housing, and a light source disposed on a first major surface of the substrate. The package further includes a detector disposed on the first major surface of the substrate and having a detecting surface. The package also includes a masking layer disposed on at least one of the first major surface and a second major surface of the substrate, where the masking layer includes a first aperture aligned with an emission axis of the light source in a direction orthogonal to the first major surface of the substrate. The masking layer further includes a second aperture aligned with a detection axis of the detector in a direction orthogonal to the first major surface of the substrate.Type: ApplicationFiled: April 3, 2017Publication date: October 4, 2018Inventors: Mark R. Boone, Jonathan L Kuhn
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Patent number: 9956422Abstract: Apparatus and methods for generating an induction waveform for performing threshold testing in an implantable medical device are disclosed. Such tests may be performed during the implant procedure, or during a device checkup procedure, or routinely during the lifetime of the device. The threshold test may include induction of an arrhythmia (such as ventricular fibrillation) followed by delivery of therapy at various progressively-increasing stimulation parameters to terminate the arrhythmia. As such, the capability to induce fibrillation within the device is desired. Induction of the arrhythmias may be accomplished via delivery of a relatively low energy shock or through delivery of an induction stimulation pulse to the cardiac tissue timed concurrently with the vulnerable period of the cardiac cycle.Type: GrantFiled: April 24, 2014Date of Patent: May 1, 2018Assignee: Medtronic, Inc.Inventors: Randolph E. Crutchfield, Lonny V. Cabelka, Mark R. Boone, Kevin P. Kuehn, Marshall J. Rasmussen
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Patent number: 9861827Abstract: An implantable medical device includes a low-power circuit and a multi-cell power source. The cells of the power source are coupled in a parallel configuration. The implantable medical device includes both a low power circuit that is selectively coupled between the first and second cells and a high power output circuit that is directly coupled to the first and second cells in a parallel configuration. An isolation circuit is coupled to the first cell, the second cell and the low power circuit to maintain a current isolation between the first cell and the second cell at least during delivery of current having a large magnitude to the high power output circuit.Type: GrantFiled: April 24, 2015Date of Patent: January 9, 2018Assignee: Medtronic, Inc.Inventors: Lonny V Cabelka, Mark R Boone, Randolph E Crutchfield, Kevin P Kuehn, John T Meador, John D Norton, Craig L Schmidt
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Patent number: 9724528Abstract: An implantable medical device includes a low-power circuit, a high-power circuit, and a dual-cell power source. The power source is coupled to a dual-transformer such that each cell is connected to only one of the transformers. Each transformer includes multiple windings and each of the windings is coupled to a capacitor, and the capacitors are all connected in a series configuration. The low power circuit is coupled to the power source and issues a control signal to control the delivery of charge from the power source to the plurality of capacitors through the first and second transformers.Type: GrantFiled: April 24, 2015Date of Patent: August 8, 2017Assignee: Medtronic, Inc.Inventors: Mark R Boone, Randolph E Crutchfield, Lonny V Cabelka, Kevin P Kuehn, John T Meador
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Patent number: 9643025Abstract: An implantable medical device includes a low-power circuit and a multi-cell power source. The cells of the power source are coupled to a transformer in a parallel configuration. The transformer includes multiple secondary windings and each of the windings is coupled to a capacitor that stores energy for delivery of a therapy to a patient. In accordance with embodiments of this disclosure, the low power circuit is configured to control simultaneous delivery of energy from each of the cells to a plurality of capacitors through the transformer.Type: GrantFiled: April 24, 2015Date of Patent: May 9, 2017Assignee: Medtronic, Inc.Inventors: Randolph E Crutchfield, Mark R Boone, Lonny V Cabelka, John T Meador
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Publication number: 20170086740Abstract: The present disclosure provides methods and techniques associated with a planar transformer for an apparatus. The planar transformers include a substrate carrying electronic components and a continuous core that is formed by distributing the encapsulant material uniformly around the substrate unit to define a consistent cross-sectional area for the magnetic path. The electronic components include primary windings and secondary windings associated with the transformer. In some embodiments, the encapsulant material is molded to seals air gaps to the substrate unit.Type: ApplicationFiled: December 14, 2016Publication date: March 30, 2017Inventors: Mark R. Boone, Mark S. Ricotta, Mohsen Askarinya, Lejun Wang
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Patent number: 9604071Abstract: An implantable medical device includes a low-power circuit and a multi-cell power source. The cells of the power source are coupled in a parallel configuration. The implantable medical device includes both a low power circuit that is selectively coupled between the first and second cells and a high power output circuit that is directly coupled to the first and second cells in a parallel configuration. An isolation circuit is coupled to the first cell, the second cell and the low power circuit to maintain a current isolation between the first cell and the second cell at least during delivery currents having a large magnitude that are delivered to the high power output circuit.Type: GrantFiled: April 24, 2015Date of Patent: March 28, 2017Assignee: Medtronic, Inc.Inventors: Randolph E Crutchfield, Mark R Boone, Lonny V Cabelka, Kevin P Kuehn, John T Meador, John D Norton, Craig L Schmidt
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Patent number: 9607759Abstract: The present disclosure provides methods and techniques associated with a planar transformer for an apparatus. The planar transformers include a substrate carrying electronic components, an upper core bonded on a first exterior surface of the substrate, and a lower core bonded on a second exterior surface opposed to the first side of the substrate. The electronic components include primary windings and secondary windings associated with the transformer. In some embodiments, the transformer includes encapsulant material that is dispensed over and between the components of the transformer to seal air gaps.Type: GrantFiled: March 13, 2013Date of Patent: March 28, 2017Assignee: Medtronic, Inc.Inventors: Mark R. Boone, Mohsen Askarinya, Mark S. Ricotta, Lejun Wang
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Patent number: 9579517Abstract: An implantable medical device includes a low-power circuit, a high-power circuit, and a dual-cell power source. The power source is coupled to a transformer having first and second primary windings, each of which is selectively coupled to the power source and a plurality of secondary windings that are magnetically coupled to the first and second primary windings. The plurality of secondary windings are interlaced along a length of each of the secondary windings. Each of the plurality of secondary transformer windings is coupled to a capacitor, and the capacitors are all connected in a series configuration. The low power circuit is coupled to the power source and issues a control signal to control the delivery of charge from the power source to the plurality of capacitors through the first and second transformers.Type: GrantFiled: April 24, 2015Date of Patent: February 28, 2017Assignee: Medtronic, Inc.Inventors: John T Meador, Randolph E Crutchfield, Mark R Boone, Lonny V Cabelka
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Patent number: 9539435Abstract: An implantable medical device includes a low-power circuit, a high-power circuit, and a multi-cell power source. The implantable medical device delivers stimulation therapy to cardiac tissue. The cardioversion energy is delivered across through electrodes that are coupled to terminals of the high-power circuit. A protection circuit for protecting the low-voltage circuit components from high voltage pulses includes a first segment coupled to a first of the electrodes and a second segment coupled to a second of the electrodes, the components of the low-voltage circuit being coupled to the transthoracic protection circuit portion, and a reference potential corresponding to a ground potential, wherein the first and second segments of the transthoracic protection circuit portion are coupled to the reference potential in a parallel configuration.Type: GrantFiled: April 24, 2015Date of Patent: January 10, 2017Assignee: Medtronic, Inc.Inventors: Marshall J Rasmussen, Randolph E Crutchfield, Mark R Boone, Lonny V Cabelka, Kevin P Kuehn, Forrest C. M. Pape
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Patent number: 9526910Abstract: Recent advancements in power electronics technology have provided opportunities for enhancements to circuits of implantable medical devices. The enhancements have contributed to increasing circuit miniaturization and an increased efficiency in the operation of the implantable medical devices. The therapy delivery circuits and techniques of the disclosure facilitate generation of a therapy stimulation waveform that may be shaped based on the patient's physiological response to the stimulation waveform. The generated therapy stimulation waveforms include a stepped leading-edge that may be shaped having a varying slope and varying amplitudes associated with each of the segments of the slope. Unlike the truncated exponential waveform delivered by the conventional therapy delivery circuit which is based on the behavior of the output capacitors (i.e., i=C(dV/dt)), the stimulation waveform of the present disclosure may be dynamically shaped as a function of an individual patient's response.Type: GrantFiled: November 10, 2014Date of Patent: December 27, 2016Assignee: Medtronic, Inc.Inventors: Randolph E Crutchfield, Lonny V Cabelka, Mark R Boone, Marshall J Rasmussen
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Patent number: 9496241Abstract: A hybrid integrated circuit in a wafer level package for an implantable medical device includes one or more passive component windings formed, at least in part, along one or more routing layers of the package. The windings may be primary and secondary windings of a transformer, wherein all or part of a magnetic core thereof is embedded in a component layer of the wafer level package. If the core includes a part bonded to a surface of the package, that part of the core may be E-shaped with legs extending into the routing layers, and, in some cases, through the routing layers. Routing layers may be formed on both sides of the component layer to accommodate the transformer windings, in some instances.Type: GrantFiled: August 29, 2014Date of Patent: November 15, 2016Assignee: Medtronic, Inc.Inventors: Mohsen Askarinya, Mark R Boone, Andreas A Fenner, Lejun Wang, Kenneth Heames
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Patent number: 9368270Abstract: A planar transformer assembly, for use in charging capacitors of an ICD, includes windings arranged to minimize voltage across intervening dielectric layers. Each secondary winding of a preferred plurality of secondary windings is arranged relative to a primary winding, in a hierarchical fashion, such that the DC voltage, with respect to ground, of a first secondary winding, of the plurality of secondary windings, is lower than that of a second secondary winding, with respect to ground, wherein the first secondary winding is in closest proximity to the primary winding. The primary winding and each secondary winding are preferably formed on a corresponding plurality of dielectric layers.Type: GrantFiled: August 28, 2014Date of Patent: June 14, 2016Assignee: Medtronic, Inc.Inventor: Mark R Boone
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Publication number: 20160067506Abstract: An implantable medical device includes a low-power circuit and a multi-cell power source. The cells of the power source are coupled to a transformer in a parallel configuration. The transformer includes multiple secondary windings and each of the windings is coupled to a capacitor that stores energy for delivery of a therapy to a patient. In accordance with embodiments of this disclosure, the low power circuit is configured to control simultaneous delivery of energy from each of the cells to a plurality of capacitors through the transformer.Type: ApplicationFiled: April 24, 2015Publication date: March 10, 2016Inventors: Randolph E. Crutchfield, Mark R. Boone, Lonny V. Cabelka, John T. Meador