Abstract: An implantable medical device includes a low-power circuit, a high-power circuit, and a multi-cell power source. The implantable medical device delivers stimulation therapy to cardiac tissue. The cardioversion energy is delivered across through electrodes that are coupled to terminals of the high-power circuit. A protection circuit for protecting the low-voltage circuit components from high voltage pulses includes a first segment coupled to a first of the electrodes and a second segment coupled to a second of the electrodes, the components of the low-voltage circuit being coupled to the transthoracic protection circuit portion, and a reference potential corresponding to a ground potential, wherein the first and second segments of the transthoracic protection circuit portion are coupled to the reference potential in a parallel configuration.

Abstract: An implantable medical device includes a low-power circuit and a multi-cell power source. The cells of the power source are coupled in a parallel configuration. The implantable medical device includes both a low power circuit that is selectively coupled between the first and second cells and a high power output circuit that is directly coupled to the first and second cells in a parallel configuration. An isolation circuit is coupled to the first cell, the second cell and the low power circuit to maintain a current isolation between the first cell and the second cell at least during delivery currents having a large magnitude that are delivered to the high power output circuit.

Abstract: An implantable medical device includes a low-power circuit and a multi-cell power source. The cells of the power source are coupled in a parallel configuration. The implantable medical device includes both a low power circuit that is selectively coupled between the first and second cells and a high power output circuit that is directly coupled to the first and second cells in a parallel configuration. An isolation circuit is coupled to the first cell, the second cell and the low power circuit to maintain a current isolation between the first cell and the second cell at least during delivery of current having a large magnitude to the high power output circuit.

Abstract: An implantable medical device includes a low-power circuit, a high-power circuit, and a dual-cell power source. The power source is coupled to a transformer having first and second primary windings, each of which is selectively coupled to the power source and a plurality of secondary windings that are magnetically coupled to the first and second primary windings. The plurality of secondary windings are interlaced along a length of each of the secondary windings. Each of the plurality of secondary transformer windings is coupled to a capacitor, and the capacitors are all connected in a series configuration. The low power circuit is coupled to the power source and issues a control signal to control the delivery of charge from the power source to the plurality of capacitors through the first and second transformers.

Abstract: An implantable medical device includes a low-power circuit, a high-power circuit, and a dual-cell power source. The power source is coupled to a dual-transformer such that each cell is connected to only one of the transformers. Each transformer includes multiple windings and each of the windings is coupled to a capacitor, and the capacitors are all connected in a series configuration. The low power circuit is coupled to the power source and issues a control signal to control the delivery of charge from the power source to the plurality of capacitors through the first and second transformers.

Abstract: Apparatus and methods for generating an induction waveform for performing threshold testing in an implantable medical device are disclosed. Such tests may be performed during the implant procedure, or during a device checkup procedure, or routinely during the lifetime of the device. The threshold test may include induction of an arrhythmia (such as ventricular fibrillation) followed by delivery of therapy at various progressively-increasing stimulation parameters to terminate the arrhythmia. As such, the capability to induce fibrillation within the device is desired. Induction of the arrhythmias may be accomplished via delivery of a relatively low energy shock or through delivery of an induction stimulation pulse to the cardiac tissue timed concurrently with the vulnerable period of the cardiac cycle.

Abstract: Recent advancements in power electronics technology have provided opportunities for enhancements to implantable medical device circuits. The enhancements have contributed to increasing circuit miniaturization and increased efficiency in the operation of the implantable medical devices. Stimulation therapy waveforms generated by the circuits include a stepped leading-edge that may be shaped having a varying slope and varying amplitudes associated with each of the segments of the slope. A charging circuit having a single primary transformer winding and a single secondary transformer winding that is coupled to a plurality of capacitors is utilized to generate the therapy stimulation waveforms. The stimulation waveform of the present disclosure may be dynamically shaped as a function of an individual patient's response.

Abstract: Recent advancements in power electronics technology have provided opportunities for enhancements to circuits of implantable medical devices. The enhancements have contributed to increasing circuit miniaturization and an increased efficiency in the operation of the implantable medical devices. The therapy delivery circuits and techniques of the disclosure facilitate generation of a therapy stimulation waveform that may be shaped based on the patient's physiological response to the stimulation waveform. The generated therapy stimulation waveforms include a stepped leading-edge that may be shaped having a varying slope and varying amplitudes associated with each of the segments of the slope. Unlike the truncated exponential waveform delivered by the conventional therapy delivery circuit which is based on the behavior of the output capacitors (i.e., i=C(dV/dt)), the stimulation waveform of the present disclosure may be dynamically shaped as a function of an individual patient's response.

Abstract: A hybrid integrated circuit in a wafer level package for an implantable medical device includes one or more passive component windings formed, at least in part, along one or more routing layers of the package. The windings may be primary and secondary windings of a transformer, wherein all or part of a magnetic core thereof is embedded in a component layer of the wafer level package. If the core includes a part bonded to a surface of the package, that part of the core may be E-shaped with legs extending into the routing layers, and, in some cases, through the routing layers. Routing layers may be formed on both sides of the component layer to accommodate the transformer windings, in some instances.

Abstract: A planar transformer assembly, for use in charging capacitors of an ICD, includes windings arranged to minimize voltage across intervening dielectric layers. Each secondary winding of a preferred plurality of secondary windings is arranged relative to a primary winding, in a hierarchical fashion, such that the DC voltage, with respect to ground, of a first secondary winding, of the plurality of secondary windings, is lower than that of a second secondary winding, with respect to ground, wherein the first secondary winding is in closest proximity to the primary winding. The primary winding and each secondary winding are preferably formed on a corresponding plurality of dielectric layers.

Abstract: The disclosure relates to an apparatus and method for inducing ventricular fibrillation in a patient to facilitate defibrillation threshold testing. The apparatus includes a plurality of output capacitors that are dynamically configurable in a selected stacking arrangement that facilitates delivery of energy for inducing the ventricular fibrillation. An output of the apparatus is coupled to patient electrodes and a threshold energy level delivered by the output capacitors is determined.

Abstract: The present disclosure provides methods and techniques associated with a planar transformer for an apparatus. The planar transformers include a substrate carrying electronic components and a continuous core that is formed by distributing the encapsulant material uniformly around the substrate unit to define a consistent cross-sectional area for the magnetic path. The electronic components include primary windings and secondary windings associated with the transformer. In some embodiments, the encapsulant material is molded to seals air gaps to the substrate unit.

Abstract: The present disclosure provides methods and techniques associated with a planar transformer for an apparatus. The planar transformers include a substrate carrying electronic components, an upper core bonded on a first exterior surface of the substrate, and a lower core bonded on a second exterior surface opposed to the first side of the substrate. The electronic components include primary windings and secondary windings associated with the transformer. In some embodiments, the transformer includes encapsulant material that is dispensed over and between the components of the transformer to seal air gaps.

Abstract: A planar transformer assembly, for use in charging capacitors of an ICD, includes windings arranged to minimize voltage across intervening dielectric layers. Each secondary winding of a preferred plurality of secondary windings is arranged relative to a primary winding, in a hierarchical fashion, such that the DC voltage, with respect to ground, of a first secondary winding, of the plurality of secondary windings, is lower than that of a second secondary winding, with respect to ground, wherein the first secondary winding is in closest proximity to the primary winding. The primary winding and each secondary winding are preferably formed on a corresponding plurality of dielectric layers.

Abstract: A hybrid integrated circuit in a wafer level package for an implantable medical device includes one or more passive component windings formed, at least in part, along one or more routing layers of the package. The windings may be primary and secondary windings of a transformer, wherein all or part of a magnetic core thereof is embedded in a component layer of the wafer level package. If the core includes a part bonded to a surface of the package, that part of the core may be E-shaped with legs extending into the routing layers, and, in some cases, through the routing layers. Routing layers may be formed on both sides of the component layer to accommodate the transformer windings, in some instances.

Abstract: Recent advancements in power electronics technology have provided opportunities for enhancements to implantable medical device circuits. The enhancements have contributed to increasing circuit miniaturization and increased efficiency in the operation of the implantable medical devices. Stimulation therapy waveforms generated by the circuits include a stepped leading-edge that may be shaped having a varying slope and varying amplitudes associated with each of the segments of the slope. A charging circuit having a single primary transformer winding and a single secondary transformer winding that is coupled to a plurality of capacitors is utilized to generate the therapy stimulation waveforms. The stimulation waveform of the present disclosure may be dynamically shaped as a function of an individual patient's response.

Abstract: The disclosure relates to an apparatus and method for inducing ventricular fibrillation in a patient to facilitate defibrillation threshold testing. The apparatus includes a plurality of output capacitors that are dynamically configurable in a selected stacking arrangement that facilitates delivery of energy for inducing the ventricular fibrillation.

Abstract: A reconstituted wafer level package for a versatile high-voltage capable component is disclosed. The reconstituted wafer package includes a dice substantially encapsulated by a mold material except for a first face. A dielectric layer is disposed on the first face of the dice. The package further includes an array of ball bumps formed on an exterior facing portion of the dielectric layer. Further, a field plate is disposed within the dielectric material and interposed between the first face of the dice and the ball bump array. The field plate may be spaced from the dice by a predetermined distance to prevent dielectric breakdown of the material of the dielectric layer.

Abstract: A reconstituted wafer level package for a versatile high-voltage capable component is disclosed. The reconstituted wafer package includes a dice substantially encapsulated by a mold material except for a first face. A dielectric layer is disposed on the first face of the dice. The package further includes an array of ball bumps formed on an exterior facing portion of the dielectric layer. Further, a field plate is disposed within the dielectric material and interposed between the first face of the dice and the ball bump array. The field plate may be spaced from the dice by a predetermined distance to prevent dielectric breakdown of the material of the dielectric layer.

Abstract: A multi-chip modular wafer level package of a high voltage unit for an implantable cardiac defibrillator includes one or more high voltage (HV) component chips encapsulated with other components thereof in a polymer mold compound of a single reconstituted wafer, wherein all interconnect segments are preferably located on a single side of the wafer. To electrically couple a contact surface of each HV chip, located on a side of the chip opposite the interconnect side of the wafer, the reconstituted wafer may include conductive through polymer vias; alternately, either wire bonds or layers of conductive polymer are formed to couple the aforementioned contact surface to the corresponding interconnect, prior to encapsulation of the HV chips. In some cases one or more of the components encapsulated in the reconstituted wafer of the package are reconstituted chips.